ESDPeek Plastic SheetFormation Process
ESD PEEK sheet preparation is primarily divided into three stages: resin synthesis, modification and formulation, and molding.
1. Raw Resin Synthesis
PEEK resin is prepared via nucleophilic substitution polymerization: 4,4'-difluorobenzophenone (DFBP) and hydroquinone (HQ) are used as monomers. A polycondensation reaction occurs in a polar aprotic solvent at 280-320°C under high pressure to produce a high-molecular-weight PEEK polymer.
2. Modification and Formulation (Key Step)
To impart antistatic/conductive properties to PEEK, conductive fillers (such as carbon black, carbon nanotubes, metal powder, conductive fibers, etc.) are added to the PEEK resin, or surface coating techniques (such as coating with a conductive polymer or metal layer) are employed.
Filling Modification (Most Commonly Used): A conductive filler is mixed with the PEEK resin at a specific ratio (usually 5%-20%). High-speed stirring and melt blending are then used to ensure uniform dispersion of the filler, forming a conductive network.
Surface Coating: A thin layer of conductive material (such as conductive adhesive or metal foil) is applied to the surface of the PEEK sheet. However, please note that the coating may not be as durable as the filled type.
3. Molding Processing
The modified PEEK composite material is formed into sheet through extrusion or hot press molding:
Extrusion: The mixed material is fed into an extruder, melted at 360-400°C, and extruded through a die to form a sheet. The sheet is then cooled, pulled, and wound to form the finished product.
Hot Press Molding: Suitable for high-precision sheet materials, the prepreg is heated to a molten state, pressurized (10-30 MPa) in a mold, and kept at a temperature of 340-380°C. After cooling, the sheet is demolded.
Features and Advantages of ESD Peek Board
Electrical Properties
Controllable surface resistivity (SR) or volume resistivity (VR) (10⁶ to 10⁹Ω), short static dissipation time (typically <1 second).
Mechanical Properties
High tensile strength (≥70 MPa), fatigue resistance (long life under cyclic loading), near-metallic density at only 1.46 g/cm³ (lightweight).
High Temperature Resistance
Long-term operating temperature 250°C (short-term operating temperature up to 310°C), melting point (Tm) 343°C.
Chemical Resistance
Resistant to most organic solvents (such as alcohols and hydrocarbons), concentrated acids and bases (except concentrated sulfuric acid and nitric acid), and hydrolysis resistance (can withstand long-term use in high-temperature, high-pressure steam).
Radiation Resistance
Strong resistance to gamma rays and X-rays (maintains performance up to 10⁹ Gy), suitable for the nuclear industry.
Biocompatibility
Non-toxic, non-sensitizing, and sterilizable (resistant to autoclave sterilization at 134°C).
Dimensional Stability
Low hygroscopicity (water absorption <0.1% at 23°C/50% RH), low thermal expansion coefficient, and high dimensional accuracy during processing.
Advantages over Other ESD Materials:
Compared to common antistatic plastics: PEEK offers significantly superior temperature resistance, chemical resistance, and mechanical strength, making it suitable for harsh environments.
Compared to conductive metals: PEEK offers lower density, easier processing, and no risk of metal ion precipitation.
Compared to conductive plastics: PEEK offers superior long-term temperature resistance (>250°C) and aging resistance, making it suitable for high-temperature applications.
AHD ESD PEEK SHEET AND ESD PEEK Rod
Main Application Areas and Specific Scenarios
ESD Polyetheretherketone Sheet, with its combined advantages of "ESD protection + high performance," is widely used in static-sensitive applications requiring weather resistance and high mechanical strength:
1. Semiconductor and Electronics Manufacturing
Wafer/Chip Carriers: Used in the photolithography and etching processes of wafer manufacturing, they require high-temperature resistance (above 200°C), no particle contamination (PEEK has low outgassing), and they also conduct static electricity to prevent chip breakdown.
Electronic Component Packaging: An alternative to traditional anti-static foam/plastic bags, this sheet is used for transport packaging of sensitive components such as IC chips, sensors, and precision resistors (anti-static and impact-resistant).
PCB Test Fixtures: Develop circuit board test fixtures to prevent static damage to delicate circuits during testing.
2. Medical and Life Sciences
Medical Electronic Equipment Housings: For example, housings for electrocardiographs and monitors, these provide anti-static protection for internal circuitry and meet medical standards for biocompatibility.
3. Aerospace and Defense
Lightweight structural parts: Used in internal brackets and connector housings for satellites and spacecraft, they must be resistant to radiation (for the space environment) and anti-static (to prevent interference with electronic equipment).
Precision instrument protection: For example, inertial navigation system (INS) housings, they must balance lightweight and anti-static requirements.
4. Industrial and Precision Manufacturing
Sensor covers: Protective housings for fiber optic sensors and laser sensors, offering anti-static properties to prevent dust from attracting and affecting accuracy, and chemical resistance (suitable for industrial environments).
Automated equipment fixtures: For example, robotic grippers, they must be anti-static to prevent the attraction of small parts and fatigue-resistant (for long-term cyclic use).
ESD PEEK Sheet is a quintessential material that combines high-performance engineering plastics with ESD protection. Its high-temperature and chemical resistance, high mechanical strength, and controllable conductivity make it irreplaceable in high-end fields such as semiconductors, medical devices, and aerospace. During use, special attention must be paid to process control, environmental storage conditions, and surface integrity to ensure its ESD protection performance and long-term reliability.
