PCB manufacturing: FR4 is the main material for manufacturing printed circuit boards (PCBs) and is widely used in electronic devices.
Electrical insulation: used for insulating components of electrical equipment such as transformers, relays, switches, etc.
Communication equipment: used for high-frequency communication equipment such as antennas and filters.
Industrial control: used for circuit boards and insulating components in industrial control systems.
Automotive electronics: used for automotive electronic control units (ECUs) and sensors, etc.
Aerospace: used for high-performance circuit boards in aerospace electronic equipment.
Our company is deeply engaged in the field of high-performance engineering plastics and insulation materials, and is committed to providing innovative material solutions for the global high-end manufacturing industry. Our main products include high-end engineering plastic sheets/rods such as polyoxymethylene (POM), ABS, nylon (PA), polycarbonate (PC), polyphenylene sulfide (PPS), polyetherimide (PEI), polyetheretherketone (PEEK), etc. We also provide special insulation materials such as bakelite (phenolic laminate) and epoxy glass fiber board. With excellent properties such as high temperature resistance, wear resistance, and high strength, our products are widely used in new energy vehicles, smart electronics, industrial machinery, aerospace and other fields.
FAQ
1.Q: What is the electrical insulation performance of FR4 boards? Is it suitable for high-frequency circuits?
A: FR4 has high insulation resistance (>10¹⁴ Ω·cm) and a stable dielectric constant (4.2-4.7 @1GHz). High-frequency signal loss is 10% less than that of aluminum substrates, making it an ideal choice for communications equipment.
2.Q: What are the mechanical strength advantages of FR4 compared to aluminum substrates?
A: FR4 has a flexural strength of 200 MPa (compared to 150 MPa for aluminum substrates), 30% higher impact resistance, and a more stable multilayer structure, making it suitable for industrial vibration environments.
3.Q: Is FR4 heat-resistant enough for lead-free soldering?
A: Yes! FR4 has a temperature resistance of 130-180°C (high Tg versions) and can withstand reflow soldering at 288°C for short periods. Conventional epoxy substrates (such as 3240) only withstand 130°C and are prone to delamination.
4.Q: Does its flame retardancy meet safety standards?
A: UL94 V-0 certified, self-extinguishing within 10 seconds and non-drip. Paper substrate (FR-1) is not flame retardant and carries a higher risk.
5.Q: Will FR4 fail in humid environments?
A: Its water absorption is <0.1%, and its wet insulation resistance is stable. Ordinary fiberglass board has a water absorption rate of up to 0.5%, which can easily cause short circuits.
6.Q: How does the cost of FR4 compare to ceramic substrates?
A: FR4 is only 1/10 the price of ceramic substrates and has a processing yield of 98%. Ceramic substrates are fragile and have a 20% higher drilling cost.
7.Q: Why choose FR4 over aluminum substrates for LED light sources?
A: Aluminum substrates have strong heat dissipation, but FR4 is temperature-controllable (within 85°C) at power <2W/cm² and is 30% less expensive, making it suitable for low-power LEDs.
8.Q: Does FR4 have better dimensional stability than other materials?
A: The Z-axis thermal expansion coefficient is only 49.7ppm/°C (compared to 64.5ppm for ordinary epoxy substrates), reducing deformation by 35% under temperature and humidity fluctuations, ensuring precision circuit accuracy.
9.Q: Can it be used in harsh environments such as automotive electronics?
A: Yes! It is resistant to chemical corrosion and thermal shock (-40~125°C), with a service life of 15 years. Aluminum substrates are susceptible to oxidation in acid-etching environments.
10.Q: Why is FR4 the mainstream substrate in the PCB industry?
A: It offers the best overall cost-effectiveness: 30% higher strength than aluminum substrates, 90% lower cost than high-frequency PTFE substrates, and significantly less processing difficulty than ceramic substrates, covering 90% of electronic applications.
