PI insulation caps used in hot runner applications are the core thermal insulation components of injection molding hot runner systems. Made primarily of polyimide (PI), their main function is to act as a thermal barrier, confining heat within the melt runner and preventing it from escaping to surrounding components, thereby ensuring stable operation of the injection molding process.
Key Performance Advantages
High-Temperature Stability: Capable of long-term, stable operation at 300°C and can withstand intermittent higher temperatures while continuously maintaining insulation and thermal barrier properties, making it suitable for the high-temperature operating conditions of hot runner systems.
Low Thermal Conductivity: Significantly reduces heat transfer from the nozzle tip to cooling components, maintains consistent nozzle temperature, improves melt flow stability, and shortens injection molding cycle times.
Chemical Resistance and Insulation: Highly chemically inert, it resists corrosion from cleaning agents and molten polymers, while its high dielectric constant ensures the safe and reliable operation of hot runner systems.




Precision-Machined Polyimide (PI) Material: Manufactured using high-precision CNC machining to ensure tight tolerances and consistent quality.
Exceptional High-Temperature Resistance: Withstands continuous high temperatures up to 300°C+, making it perfect for hot runner and injection molding applications.
Superior Thermal Insulation Performance: Effectively reduces heat loss at the nozzle tip, ensuring a stable melt temperature.
Excellent Mechanical Strength: High wear resistance and dimensional stability under extreme industrial conditions.
Cleanroom Compatible: Low outgassing and high purity, ideal for semiconductor and sensitive environments.
Semiconductor Insulator: Specifically designed for semiconductor wet etching and vacuum equipment.
Cleanroom Machined Components: ISO Class 4 cleanliness compatible, precision finished for low friction.
High Temperature Thermal Barrier: Effective heat insulation to protect surrounding sensitive electronic components.
Superior Chemical Resistance: Resistant to most acids, alkalis, and organic solvents used in cleanrooms.
High Dimensional Stability: Zero deformation under thermal stress, ensuring long-term precision
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