Vertical DIP USB3.1 Type C Plug

Vertical DIP USB3.1 Type C Plug

4 week ago

4 0

HuiZhou Antenk Electronics Co., LTD

 5 year year

Product details

Product Description

Huizhou Antenk Electronics Co., Ltd. manufactures U3.1MS04‑SLXXX series vertical DIP USB3.1 Type C plug to achieve high speed data transmission and high current power delivery for through hole printed circuit board assembly, following strict drawing dimensional tolerances to guarantee precise DIP soldering and stable reversible plugging performance up to 10000 mating cycles. This USB3.1 Type C plug adopts LCP insulator housing with UL94V 0 flame retardant grade, gold plated copper alloy contacts and SUS304‑H nickel plated shell, electrically rated for maximum 5A VBUS current 20V working voltage, 40 milliohms maximum contact resistance and 100 Megohms minimum insulation resistance, operating within minus 30 degree Celsius to plus 85 degree Celsius and meets RoHS and HSF environmental standards. Tray and bag packing options satisfy various mass‑production requirements. This high performance USB plug is widely deployed in liquid crystal display modules, digital cameras, communication hardware, industrial control panels, digital household appliances, computer peripherals, automotive electronic assemblies and precision measuring instruments. Operators should confirm plating finish and packing selection for actual project needs, comply with official PCB layout specification in DIP soldering procedure, avoid excessive soldering heat to prevent LCP housing damage, and store finished plugs inside dry sealed packages to protect metal components from oxidation. Unlike competitors outsourcing stamping molding and plating services Antenk completes full in house production workflow covering self‑developed precision plastic and metal mold fabrication, copper alloy high speed stamping, high temperature LCP injection molding and multi grade electroplating plus comprehensive laboratory reliability testing, holding ISO9001 ISO14001 IATF16949 and UL E472792 certifications compliant with REACH rules. We own over two hundred fifty plastic connector molds and one hundred eighty metal terminal molds, deliver custom solutions and round the clock professional engineering support, and over seventy percent of our USB connector products are exported globally backed by ANTENK brand and consistent stable mass production quality.

1. LCP High Temp Insulator Housing sustains high thermal stress during DIP soldering and maintains stable mechanical property under wide operating temperature range.

2. Gold Plated Copper Contact provides low contact resistance and outstanding anti corrosion performance for high speed USB3.1 signal transmission.

3. Nickel Plated SUS Shell delivers excellent shielding capability and structural rigidity for repeated plug and unplug operational cycles.

Detailed Specifications：

1. Electrical Parameters

1.1 VBUS Rated Current: 5A

1.2 GND Pin Rated Current: 1.25A

1.3 Other Pins Rated Current: 0.25A

1.4 Maximum Rated Voltage: 20V

1.5 Dielectric Withstanding Voltage: 100V AC r.m.s

1.6 Maximum Contact Resistance: 40 milliohms

1.7 Minimum Insulation Resistance: 100 Megohms

2.Mechanical Parameters

2.1 Insertion Force: 5‑20N

2.2 Extraction Force: 8‑20N after testing

2.3 Mating Durability: 10000 cycles

3. Matnrial & Plating Information

3.1 Insulator Material: LCP, UL94V‑0 flame retardant grade

3.2 Contact Material: Copper alloy, gold plated on contact area, lead‑free tin plating on solder area

3.3 Shell Material: SUS304‑H, thickness 0.30±0.03mm, full 50u" nickel plating

3.4 Shield Material: SUS304‑H, thickness 0.12±0.03mm

4. Structural Specifications

4.1 Product Type: USB3.1 Plug Type C Vertical Dip

5. Dimensional Standards (Unit: mm)

5.1 Key outline dimensions: 8.01, 8.25, 11.10

5.2 PCB layout dimension reference included in drawing

5.3 General tolerance: X.XX ±0.20, shtur ±0.15

6. Environmental Performance

6.1 Operating Temperature Range: ‑30°C ~ +85°C

7. Compliance Standard

7.1 RoHS and HSF compliant

8. Packing Selections

8.1 Available packing: Tray, Bag

9. Application Scenarios

9.1 Liquid crystal display modules, digital cameras

9.2 Communication hardware, industrial control panels

9.3 Digital household appliances, computer peripherals

9.4 Automotive electronic assemblies, precision measuring instruments

10. Operation & Storage Precautions

10.1 Confirm plating requirement and packing option according to project specifications

10.2 Follow official recommended PCB layout for vertical DIP through‑hole soldering

10.3 Avoid excessive soldering heat to prevent LCP insulator deformation

10.4 Keep packing intact during transportation to avoid tape peeling

10.5 Store connectors inside dry sealed packages to prevent oxidation of metal parts

FAQ

Q: How many packaging do you have?

A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.

Q: Can you do our own packaging?

A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.

Q: How many different types of products your company manufactures?

A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.

Product Drawing：

U3.1MS04-SLBG0D+USB3.1 Plug Type C Vertical Dip（6）

U3.1MS04-SLBG0D+USB3.1 Plug Type C Vertical Dip（5）

U3.1MS04-SLBG0D+USB3.1 Plug Type C Vertical Dip（3）

U3.1MS04-SLBG0D+USB3.1 Plug Type C Vertical Dip（2）

U3.1MS04-SLBG0D+USB3.1 Plug Type C Vertical Dip（4）

U3.1MS04-SLBG0D+USB3.1 Plug Type C Vertical Dip（1）

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HuiZhou Antenk Electronics Co., LTD

 Audited supplier

5 year

Address: Shenzhen, China

Main Product: Connectors , Wire harness, Board to board connector , Wire to board connector , Battery holders , Industrial connector

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