2.00mm Pitch SMT Box Header H6.40

2.00mm Pitch SMT Box Header H6.40

2 week ago

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HuiZhou Antenk Electronics Co., LTD

 5 year year

Product details

Product Description：

Huizhou Antenk Electronics Co., Ltd. manufactures BHCM03 series 2.00mm pitch SMT box header with 6.40mm height to deliver secure signal and power interconnection for compact surface mount printed circuit board assembly, following strict drawing dimensional tolerances to achieve accurate reflow soldering and anti mis‑mating performance with polarized key slot design. This box header adopts glass filled PA6T insulator housing with UL94V 0 flame retardant grade, brass contacts finished with nickel base gold or tin plating, electrically rated for 2.0 Amp current, 20 milliohms maximum contact resistance and 1000 Megohms minimum insulation resistance, withstands 500V AC DC and works within minus 40 degree Celsius to plus 105 degree Celsius while complying with RoHS and HSF standards. Multiple contact counts, insulator colors, locating peg options and various packing selections meet diverse automated production needs. This shrouded SMT header is widely applied in liquid crystal display modules, digital cameras, communication hardware, industrial control panels, digital household appliances, computer peripherals, automotive electronic assemblies and precision measuring instruments. Operators should choose suitable pin count plating finish housing color and peg option for project requirements, apply recommended PCB layout for SMT reflow soldering, avoid excessive reflow temperature to prevent plastic housing damage, and store finished connectors inside dry sealed packages to stop metal contact oxidation. Unlike competitors outsourcing stamping molding and plating services Antenk executes full in house production workflow covering self‑developed precision plastic and metal mold fabrication, brass terminal high speed stamping, high temperature PA6T injection molding and multi‑grade electroplating plus comprehensive laboratory reliability testing, holding ISO9001 ISO14001 IATF16949 and UL E472792 certifications compliant with REACH rules. We own over two hundred fifty plastic connector molds and one hundred eighty metal terminal molds, provide custom solutions and round the clock professional engineering support, and over seventy percent of our header products are exported globally supported by ANTENK brand and stable mass‑production quality.

1. Glass Filled PA6T Housing delivers outstanding mechanical strength and heat resistance for high temperature SMT reflow soldering processes.

2. Nickel Base Brass Contact ensures stable electrical conduction and improves corrosion resistance under long‑term circuit operating conditions.

3. Polarized SMT Box Header prevents reverse mis‑insertion and guarantees correct mating alignment during PCB assembly operations.

Detailed Specifications：

1. Electrical Parameters

1.1 Rated Current: 2.0 Amp

1.2 Maximum Contact Resistance: 20 milliohms

1.3 Minimum Insulation Resistance: 1000 Megohms

1.4 Withstand Voltage: 500V AC DC

2. Environmental Parameters

2.1 Operating Temperature Range: -40°C to +105°C

3. Material & Plating Options

3.1 Insulator Material: PA6T plus 30%GF, optional LCP or PA9T, UL94V‑0 flame retardant grade

3.2 Contact Material: Brass

3.3 Contact Plating: Gold flash, full gold, selective gold or tin over nickel base

3.4 Insulator Color Choices: Black, Blue, White

4. Structural Specifications

4.1 Product Type: 2.00 mm pitch SMT Box Header, height 6.40 mm

4.2 Available Contact Count: 04‑50 positions

4.2 Mechanical Version: Type A without locating pegs, Type B with locating pegs

4.3 Polarized slot design; partial pin versions omit certain positioning slots and tags

5. Dimensional Standards (Unit: mm)

5.1 Pitch dimension: 2.00 ±0.10

5.2 Main stacking height: 6.40

5.3 Length formula relates to number of contact positions

5.4 PCB layout tolerance: ±0.05

5.5 General drawing tolerance: X.±0.35, X.X±0.25, X.XX±0.20, X.XXX±0.15

6. Compliance Standard

6.1 RoHS and HSF Pb compliant

7. Packing Selections

7.1 Available packing: Tray, Bag, Tube, Tube plus CAP, Tape & Reel, Tape & Reel plus CAP

8. Application Scenarios

8.1 Liquid crystal display modules, digital cameras

8.2 Communication hardware, industrial control panels

8.3 Digital household appliances, computer peripherals

8.4 Automotive electronic assemblies, precision measuring instruments

9. Operation & Storage Precautions

9.1 Select correct contact count insulator color plating type and locating peg version for project requirements

9.2 Follow recommended PCB layout specification for SMT reflow soldering

9.3 Avoid excessive reflow temperature to prevent thermoplastic housing damage

9.4 Take note of slot and tag differences for low pin count variants

9.5 Store box headers in dry sealed packages to prevent oxidation of brass contacts

FAQ

Q: How many packaging do you have?

A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.

Q: Can you do our own packaging?

A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.

Q: How many different types of products your company manufactures?

A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.

Product Drawing：

BHCM03-XXXXXX+2.00mm Box Header SMT H=6.40（5）

BHCM03-XXXXXX+2.00mm Box Header SMT H=6.40（1）

BHCM03-XXXXXX+2.00mm Box Header SMT H=6.40（4）

BHCM03-XXXXXX+2.00mm Box Header SMT H=6.40（6）

BHCM03-XXXXXX+2.00mm Box Header SMT H=6.40（2）

BHCM03-XXXXXX+2.00mm Box Header SMT H=6.40（3）

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HuiZhou Antenk Electronics Co., LTD

 Audited supplier

5 year

Address: Shenzhen, China

Main Product: Connectors , Wire harness, Board to board connector , Wire to board connector , Battery holders , Industrial connector

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