alumina circuit board

alumina circuit board

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Wuxi Maoqian New Material Technology Co.,Ltd.

 5 month year

Product details

High-Performance Alumina Ceramic Circuit Boards for Advanced Electronics

In the realm of modern electronics, thermal management and electrical insulation are critical factors that determine the longevity and reliability of high-power devices. The Alumina Ceramic Circuit Board has emerged as a superior solution for engineers seeking to overcome the limitations of traditional organic substrates like FR4 or metal core PCBs. This product description explores the exceptional properties of 96% Alumina Ceramic Circuit Board materials, detailing how they provide robust performance in demanding environments. Whether you require standard configurations or engage in Custom Alumina Circuit Board Design, understanding the nuances of aluminum oxide ceramics is essential for optimizing your electronic systems.

Overview of Alumina Ceramic Technology

The foundation of this technology lies in the chemical composition of aluminum oxide (Al2O3). Among various ceramic grades, the 96% Alumina Ceramic Circuit Board strikes an optimal balance between cost-effectiveness and high-performance characteristics. It offers significantly higher thermal conductivity compared to polymer-based alternatives while maintaining excellent dielectric strength. This makes it ideal for applications where heat dissipation is paramount, such as in power modules, LED lighting, and automotive electronics. Unlike conventional boards that may warp or degrade under thermal stress, alumina ceramics provide dimensional stability even at elevated temperatures, ensuring consistent electrical performance over time.

Furthermore, the manufacturing process involves precise sintering techniques that create a dense, non-porous structure. This structural integrity prevents moisture absorption, which is a common failure mode in humid environments. By choosing an Alumina Ceramic Circuit Board, manufacturers can enhance the mean time between failures (MTBF) of their products, thereby reducing warranty claims and improving brand reputation. The material's inherent resistance to corrosion and chemicals further broadens its applicability across industrial and aerospace sectors.

Key Features and Technical Advantages

When evaluating substrate options, several distinct features set the Alumina Ceramic Circuit Board apart from competitors. First and foremost is its thermal conductivity, which typically ranges from 20 to 25 W/m·K for 96% purity grades. This allows for efficient heat transfer away from sensitive components, preventing overheating and potential damage. Second, the dielectric constant of alumina is stable across a wide frequency range, making it suitable for high-frequency signal transmission without significant loss or distortion. This property is crucial for RF applications and high-speed digital circuits.

Another critical feature is the coefficient of thermal expansion (CTE). The CTE of Alumina Ceramic Circuit Board materials can be tailored to match that of silicon chips or other semiconductor materials. This matching reduces mechanical stress during thermal cycling, minimizing the risk of delamination or cracking. Additionally, the surface hardness of alumina provides excellent wear resistance, allowing for direct mounting of components without protective coatings that might impede thermal performance. For projects requiring specific geometries or layer counts, Custom Alumina Circuit Board Design services ensure that these technical advantages are fully leveraged to meet unique engineering requirements.

Detailed Product Specifications and Design Considerations

Understanding the specifics of 96% Alumina Ceramic Circuit Board construction is vital for successful implementation. The base material consists primarily of alpha-phase alumina, which contributes to its mechanical strength and electrical insulation capabilities. Conductive traces are typically patterned using thick-film or thin-film technologies, utilizing metals such as silver, gold, or copper with barrier layers to prevent diffusion. The choice of metallization affects both the solderability and long-term reliability of the board.

In terms of Custom Alumina Circuit Board Design, flexibility is key. Engineers can specify varying thicknesses, hole sizes, and trace widths to accommodate different component footprints. Multi-layer designs are possible through the lamination of individual ceramic sheets, enabling complex routing in compact spaces. However, due to the brittleness of ceramic materials, careful handling and specialized drilling techniques are required during assembly. Thermal vias can be incorporated to enhance heat sinking, connecting top-side components to bottom-side heatsinks. These design considerations ensure that the final product meets rigorous industry standards for safety and performance.

Application Scenarios and Industry Use Cases

The versatility of Alumina Ceramic Circuit Board solutions spans numerous industries. In the automotive sector, they are extensively used in eng.The performance is superior to that of Alumina Ceramic & High Purity Alumina Ceramic.

Performance is not lower than that of Zirconia ceramic & Aluminium Nitride ceramic.

AlUMINA TECH DATA

ITEM	UNIT	99.9 ALUMINA
Density	G/cm3	3.94
Bending Resistance	Mpa	500
Compressive Strength	Mpa	3300
Elasticity Modulus	Gpa	400
Shock Strength	Mpam/2	5.2
Vaporization Coefficient	M	12
Vickers Hardness	HV0.5	2000
Thermal Expansivity	10-6K-1	8.0
Conductivity	W/MK	28
Thermal Shock Resistance	AT℃	280
Maximum Service Temperature	℃	1750
20℃ Volume Resistance	Ω	≥1015
Dielectric Strength	KV/mm	30
Apparent Porosity	％	0
Permittivity	Er	10
Dielectric Loss Angle	tanδ	0.001

ALUMINA POWDER TECH DATA

ITEM	LS-110	LS-120	LS-130	LS-110F	LS-220	LS-210
LOI(％)	0.02	0.02	0.05	0.08	0.03	0.01
Na2O(％)	0.05	0.04	0.03	0.05	0.07	0.08
SiO2(％)	0.07	0.07	0.07	0.09	0.02	0.02
Fe2O3(％)	0.03	0.03	0.03	0.03	0.02	0.02
Al2O3(％)	99.9	99.9	99.9	99.9	99.9	99.9
average grain diameter(um)	1.7	2.1	2.2	1.1	2.7	2.9
αgrain diameter(um)	1-2	1-3	2-4	1-2	2-3	3-5
BET Surface Area(m2/g)	1.9	1.4	1.4	3.2	1.6	0.9
Pressure-induced volume density(g/cm3)*	2.22	2.27	2.31	2.29	2.22	2.32
Forming density(g/cm3)**	2.13	2.20	2.23	2.33	2.17	2.30
Sintering volume density(g/cm3)**	3.78	3.79	3.78	3.89	3.81	3.77
Line collection efficiency(％)	18.0	17.2	16.7	15.7	17.5	15.3

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Wuxi Maoqian New Material Technology Co.,Ltd.

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5 month

Address: Wuxi, China

Main Product: Alumina Ceramics, Zirconia ceramics, Ceramic tubes, Ceramic rods, ceramic rings, crucible

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