2.00mm Pitch Vertical SMT Wafer Connector

2.00mm Pitch Vertical SMT Wafer Connector

7 day ago

1 0

HuiZhou Antenk Electronics Co., LTD

 5 year year

Product details

Product Description:

Huizhou Antenk Electronics Co., Ltd. manufactures AW2013V M X XP series 2.00 millimeter pitch 180 degree vertical SMT wafer connector to deliver stable wire to board signal and power interconnection via surface mount soldering on printed circuit boards. This vertical SMT wafer header mates with AH2013 series housing and supports pole options ranging from 2 poles up to 15 poles, insulator housing adopts PA9T material with UL94V 0 flame retardant grade, brass pins apply tin over nickel plating and built with mylar protection structure. It is rated for 3A AC DC current and 125V AC DC voltage, reaches 500V AC one minute dielectric strength and minimum 1000 megaohm insulation resistance, contact resistance stays under 10 milliohm and remains within 20 milliohm after environmental testing, operating temperature ranges from minus 40 degree Celsius to plus 105 degree Celsius. Different pole numbers create different outline dimensions to meet compact PCB layout demands. This product satisfies RoHS and REACH standards and works for consumer electronics smart home appliances and industrial control modules. Operators must adopt official PCB layout for SMT soldering assembly and store products under dry surroundings to avoid brass pin oxidation. Unlike competitors outsourcing stamping molding and plating Antenk carries out full in house production including independent mold development brass terminal stamping plastic injection molding multi grade electroplating and comprehensive laboratory reliability testing. We obtain ISO9001 ISO14001 IATF16949 and UL certifications, provide custom configuration solutions and round the clock engineering support, more than seventy percent of connector goods are exported worldwide. Feel free to share your project specifications for sample quotation and full datasheet resources.

1. Multi‑color SMT Wafer Header offers multiple housing color selections to match diverse product appearance requirements.

2. Vertical Mount Wafer Connector optimizes vertical component arrangement for compact printed circuit board designs.

3. High Temp PA9T Wafer Housing sustains reliable performance under high temperature SMT reflow soldering conditions.

Detailed Specifications:

1. Mechanical Specifications

1.1 Product type: 180 degree vertical SMT surface mount wafer header, wire to board type

1.2 Measurement unit: millimeter

1.3 Key dimension: contact pitch 2.00 mm, pole options range from 2 poles to 15 poles. Overall dimension changes according to different pole counts, refer to official engineering drawing for full dimension table and PCB layout data

1.4 Special structure: Equipped with mylar protective structure

1.5 Available option: multiple housing colors including black red and beige

1.6 Mating information: Matches with AH2013 series housing

1.7 CTA: Contact our engineering team to obtain complete dimension drawings and PCB layout reference files for your wire‑to‑board hardware design validation.

2. Material Construction

2.1 Insulator housing: PA9T material with UL94V‑0 flame retardant grade

2.2 Contact pin: Brass material with tin over nickel plating

3. Electrical Parameters

3.1 Rated current: 3A AC DC

3.2 Rated voltage: 125V AC DC

3.3 Dielectric strength: 500V AC for one minute

3.4 Insulation resistance: minimum 1000 megaohm

3.5 Contact resistance: maximum 10 milliohm, ≤20 milliohm after environmental testing

4. Environmental Parameters

4.1 Operating temperature range: minus 40°C to plus 105°C

5. Compliance Standard

5.1 Environmental compliance: RoHS compliant

6. Usage Method

6.1 Assembly mode: SMT surface mount soldering onto printed circuit board

6.2 Operation tip: Select proper pole number and housing color based on actual project demands

7. Application Scenarios

7.1 Consumer electronic devices

7.2 Smart home appliances

7.3 Industrial control modules

8. Operation & Storage Precautions

8.1 Follow official PCB layout drawing for SMT soldering assembly

8.2 Only mate with AH2013 series housing to realize normal connection performance

8.3 Store products in dry storage environment to prevent brass pin oxidation

8.4 Confirm dimension parameters for selected pole count before mechanical design

8.5 CTA: Submit your pole count and color requirements, we can offer free sample evaluation and professional technical consultation.

FAQ

Q: How many packaging do you have?

A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.

Q: Can you do our own packaging?

A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.

Q: How many different types of products your company manufactures?

A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.

Product Drawing：

AW2013V-S-X-03P+2.00mm Pitch 180°SMT Wafer Connector Series（6）

AW2013V-S-X-03P+2.00mm Pitch 180°SMT Wafer Connector Series（5）

AW2013V-S-X-03P+2.00mm Pitch 180°SMT Wafer Connector Series（4）

AW2013V-S-X-03P+2.00mm Pitch 180°SMT Wafer Connector Series（2）

AW2013V-S-X-03P+2.00mm Pitch 180°SMT Wafer Connector Series（3）

AW2013V-S-X-03P+2.00mm Pitch 180°SMT Wafer Connector Series（1）

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HuiZhou Antenk Electronics Co., LTD

 Audited supplier

5 year

Address: Shenzhen, China

Main Product: Connectors , Wire harness, Board to board connector , Wire to board connector , Battery holders , Industrial connector

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