1. High Current SMT Socket delivers stable 5 amp power transfer for compact consumer and industrial electronic device motherboard mounting.
2. Tape Reel USB Receptacle adopts 16 millimeter wide carrier tape packaging to suit high speed automatic SMT production operations.
3. Gold Plated Contact Socket lowers contact resistance and improves anti corrosion performance for long term plug and play applications.
Detailed Specifications:
1. Mechanical Specifications
1.1 Product type: 16 positions board‑mount SMT Type‑C female socket with four fixing feet
1.2 Measurement unit: millimeter
1.3 Key dimension: Main body length 7.35 mm, critical outline tolerances follow drawing specifications. Recommended PCB footprint is provided on technical drawing. Tape and reel packaging width is 16 mm, cover tape peel force ranges from 0.2‑1.2 N.
1.4 Assembly method: SMT surface mount for automatic pick and place via 16 mm width tape reel packing
1.5 Mating performance: Insertion force 5‑20 N, withdrawal force 8‑20 N; after durability test insertion force remains 5‑20 N, withdrawal force remains 6‑20 N. Durability cycle reaches 10000 times.
1.6 CTA: Contact our engineering team to acquire complete dimension drawings and PCB layout files for your hardware design validation.
2. Material Construction
2.1 Insulator: LCP plus 30 percent glass fiber, UL94 V‑0 flame rating
2.2 Contact terminal: C7025 high conductivity copper, minimum 50 micro inch nickel underplate, 1 micro inch gold plating on contact area
2.3 Shell: SUS304 stainless steel 0.30 mm thickness, minimum 50 micro inch nickel plating
2.4 Middle spring clip: SUS301 stainless steel
3. Electrical & Performance Parameters
3.1 Rated current: 5 A
3.2 Contact impedance: Max 40 mΩ initial value
3.3 Insulation impedance: Minimum 100 MΩ
3.4 Withstand voltage: 100 V AC RMS
3.5 Solder requirement: Solder coverage shall reach above 95 percent
3.6 Environmental performance: Minimum 24 hours salt spray test; operating temperature range ‑30 ℃ to +85 ℃
3.7 SMT reflow condition: Accept peak temperature 260 ℃ ±5 ℃ without blister melting or excessive warpage.
4. Usage Method
4.1 Assembly mode: Load tape reel into SMT equipment, complete surface mount reflow soldering onto matched printed circuit board
4.2 Operation tip: Follow recommended PCB footprint drawing to guarantee precise soldering position and reliable connection.
5. Application Scenarios
5.1 Consumer electronic device internal USB signal and power connection
5.2 Digital household appliance circuit interface
5.3 Industrial control portable equipment interface assembly
5.4 Storage device and smart hardware port configuration
6. Operation & Storage Precautions
6.1 Strictly follow drawing dimension tolerance and PCB layout during product structural design
6.2 Avoid heavy mechanical impact and excessive force on connector shell and terminals during mounting
6.3 Prevent contamination or scratch on gold plated contact area before soldering
6.4 Store products in dry environment to avoid metal part corrosion
6.5 Confirm product specification packaging requirement before procurement and project design
6.6 CTA: Submit your custom packaging special requirement and project details, we provide free sample evaluation and professional technical support services.