
High junction operating temperature capability (Tj(max) = 150 °C)
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Absolute maximum rating
VRRM
repetitive peak reverse voltage
-
-
800
V
IT(RMS)
RMS on-state current
half sine wave; Tmb ≤ 128 °C;
-
-
25
A
Fig. 1; Fig. 2; Fig. 3
ITSM
non-repetitive peak on- state current
half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5
-
-
300
A
half sine wave; Tj(init) = 25 °C; tp = 8.3 ms
-
-
330
A
Tj
junction temperature
-
-
150
°C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 7
1.5
-
15
mA
IH
holding current
VD = 12 V; Tj = 25 °C; Fig. 9
-
-
60
mA
VT
on-state voltage
IT = 30 A; Tj = 25 °C; Fig. 10
-
1.1
1.5
V
Dynamic characteristics
dVD/dt
rate of rise of off-state voltage
VDM = 536 V; Tj = 150 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit
80
-
-
V/μs
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol | Parameter | Conditions | Min | Max | Unit | |
VDRM | repetitive peak off-state voltage | - | 800 | V | ||
VRRM | repetitive peak reverse voltage | - | 800 | V | ||
IT(AV) | average on-state current | half sine wave; Tmb ≤ 128°C; | - | 16 | A | |
IT(RMS) | RMS on-state current | half sine wave; Tmb ≤ 128°C; Fig. 1; Fig. 2; Fig. 3 | - | 25 | A |
ITSM | non-repetitive peak on- state current | half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5 | - | 300 | A | |
half sine wave; Tj(init) = 25 °C; tp = 8.3 ms | - | 330 | A | |||
I2t | I2t for fusing | tp = 10 ms; SIN | - | 450 | A2s | |
d IT/dt | rate of rise of on-state current | IG = 20 mA | - | 200 | A/μs | |
IGM | peak gate current | - | 5 | A | ||
VRGM | peak reverse gate | - | 5 | V | ||
voltage | ||||||
PGM | peak gate power | - | 20 | W | ||
PG(AV) | average gate power | over any 20 ms period | - | 0.5 | W | |
Tstg | storage temperature | -40 | 150 | °C | ||
Tj | junction temperature | - | 150 | °C |
Thermal Characteristics
Symbol | Parameter | Conditions | Min | Typ | Max | Unit | |
Rth(j-mb) | thermal resistance | Fig. 6 | - | - | 1 | K/W | |
from junction to | |||||||
mounting base | |||||||
Rth(j-a) | thermal resistance | in free air | - | 60 | - | K/W | |
from junction to | |||||||
ambient free air |
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