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The “Shielding case H5DC38008” is a high-reliability deep-cavity Other Shielding enclosure designed to accommodate densely populated circuit zones with components of varying heights—such as stacked memory modules, tall inductors, or multi-layer RF filters. With an internal depth of 12.0 mm and reinforced structural integrity, it provides comprehensive Protective Shielding without requiring custom enclosures. This makes it a cornerstone of robust EMI Shielding Solutions in telecom infrastructure, edge computing, and industrial control systems.
Q: How does the two-piece lid improve serviceability?
A: It allows technicians to open only the section needing repair—minimizing thermal stress on adjacent shielded areas.
Q: Will the deep cavity trap heat?
A: Thermal management can be enhanced via optional vented lid inserts (non-conductive EMI mesh available upon request).
Q: Is this suitable for outdoor or high-humidity environments?
A: Yes—the dual-layer plating resists oxidation, and the tight lid seal reduces moisture ingress.
This Other Shielding solution is ideal for:
While many deep shields sacrifice rigidity or EMI performance due to lid flex or poor grounding, the H5DC38008 features a stiffened base frame and perimeter grounding tabs that maintain consistent contact—even after repeated thermal cycles. Its depth isn’t just empty space; it’s engineered volume for real-world component diversity.
Within scalable EMI Shielding Solutions, this high-reliability Other Shielding can bridges the gap between standard cans and costly custom enclosures—delivering professional-grade protection where complexity demands it.
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