2.54mm Stamped DIP IC Socket

2.54mm Stamped DIP IC Socket

3 week ago

7 0

HuiZhou Antenk Electronics Co., LTD

 5 year year

Product details

Product Description：

Huizhou Antenk Electronics Co., Ltd. manufactures IFES01 series 2.54 millimeter stamped straight DIP IC sockets for reliable chip mounting and signal transmission on printed circuit boards. This dual in line socket supports multiple pole counts ranging from 6 pins up to 64 pins, insulator housing applies PBT plus 30 percent glass fiber material with UL94V 0 flame retardant grade, contact parts adopt phosphor bronze base with nickel underlayer and optional tin or gold plating for different application demands. It delivers 1.0 amp rated current, maximum 20 milliohm contact resistance, minimum 1000 megaohm insulation resistance and 1000V RMS dielectric strength with 100 insertion removal mechanical cycles and operating temperature from minus 55 degree Celsius to plus 125 degree Celsius. Users complete through hole DIP soldering onto circuit boards and select suitable pin count and surface plating according to chip specifications, follow official PCB tolerance requirements during layout and keep goods in dry storage environment to prevent contact oxidation. Unlike many competitors outsourcing stamping molding and plating processes Antenk conducts full in house production including independent mold development terminal stamping plastic injection molding electroplating and comprehensive laboratory reliability verification. We hold ISO9001 ISO14001 IATF16949 and UL certifications, support custom plating choices and various packaging options with full time engineering support, more than seventy percent of our connector products are exported globally. Feel free to submit your project requirements to receive free sample evaluation and complete datasheet resources.

1. Stamped DIP Socket adopts precision stamped contact structure to offer stable signal transmission for various integrated chip applications.

2. Phosphor Bronze IC Socket uses high performance phosphor bronze contacts to maintain stable spring force after repeated plug and unplug operations.

3. PBT GF IC Receptacle applies PBT plus glass fiber housing material to deliver excellent mechanical strength and flame retardant performance.

Detailed Specifications：

1. Mechanical Specifications

1.1 Product type: Stamped straight dual in‑line DIP IC socket

1.2 Measurement unit: millimeter

1.3 Key dimension: 2.54 millimeter pitch, pole options from 6 pins up to 64 pins. General drawing tolerances X.XX ±0.20, X.XXX ±0.15. Refer to official engineering drawing for complete dimension tables and PCB footprint reference data.

1.4 Contact plating options: 60u tin,150u tin,200u tin, gold flash, 3u gold,5u gold,10u gold,15u gold,30u gold

1.5 Available packaging form: Tray, bag, tube, tape and reel

1.6 CTA: Contact our engineering team to obtain complete dimension drawings and PCB layout files for your hardware design validation.

2. Material Construction

2.1 Insulator housing: PBT plus 30 percent glass fiber with UL94V 0 flame retardant grade

2.2 Contact terminal: Phosphor bronze material, 20u nickel base layer, default 60u bright tin surface plating

3. Electrical & Performance Parameters

3.1 Rated current: 1.0 Amp

3.2 Maximum contact resistance: 20 milliohms

3.3 Dielectric strength: Minimum 1000V RMS

3.4 Minimum insulation resistance: 1000 megaohms

3.5 Mechanical life: Minimum 100 insertion and removal cycles

3.6 Operating temperature range: ‑55 degree Celsius to +125 degree Celsius

4. Usage Method

4.1 Assembly mode: Through hole DIP soldering onto printed circuit boards

4.2 Operation tip: Select proper pole count and contact plating according to integrated chip and actual circuit requirements

5. Application Scenarios

5.1 Industrial control circuit boards

5.2 Instrument and meter equipment

5.3 Consumer electronic products

5.4 Microcontroller development hardware

6. Operation & Storage Precautions

6.1 Follow official drawing tolerance standards for PCB layout design

6.2 Avoid excessive plugging force to prevent phosphor bronze contact spring deformation

6.3 Store finished goods under dry environment to prevent oxidation of tin or gold plated contact surfaces

6.4 Confirm pole number plating specification and dimension parameters before mechanical and circuit design

6.5 CTA: Submit your pin count plating and packaging requirements, we can provide free sample evaluation and professional technical consultation.

FAQ

Q: How many packaging do you have?

A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.

Q: Can you do our own packaging?

A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.

Q: How many different types of products your company manufactures?

A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.

Product Drawing：

IFES01-XXX+2.54mm Dual-in-line Socket Straight DIP Type Stamped（1）

IFES01-XXX+2.54mm Dual-in-line Socket Straight DIP Type Stamped（6）

IFES01-XXX+2.54mm Dual-in-line Socket Straight DIP Type Stamped（4）

IFES01-XXX+2.54mm Dual-in-line Socket Straight DIP Type Stamped（2）

IFES01-XXX+2.54mm Dual-in-line Socket Straight DIP Type Stamped（5）

IFES01-XXX+2.54mm Dual-in-line Socket Straight DIP Type Stamped（3）

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HuiZhou Antenk Electronics Co., LTD

 Audited supplier

5 year

Address: Shenzhen, China

Main Product: Connectors , Wire harness, Board to board connector , Wire to board connector , Battery holders , Industrial connector

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