
The 10-Pin Butterfly Package is an industry-standard housing solution engineered for the most demanding Optoelectronic Packaging applications. This hermetically sealed enclosure provides a robust, thermally efficient, and electrically stable environment for sensitive optical components such as pump lasers, modulators, and photodetectors. Constructed using advanced ceramic-to-metal sealing technology, our butterfly packages ensure the long-term reliability and performance required for high-speed telecommunications, data centers, and CATV infrastructure. The package's design facilitates precise optical fiber alignment and superior thermal management, making it the premier choice for creating reliable Transmitter Optical Sub-Assemblies (TOSA) and Receiver Optical Sub-Assemblies (ROSA).
Parameter | Specification |
---|---|
Pin Count | 10 |
Body Material | Kovar (Fe-Ni-Co Alloy) |
Base Material | Tungsten Copper (WCu) for enhanced thermal conductivity |
Feedthrough Insulator | High-purity Alumina ($Al_2O_3$) Ceramic |
Plating | Electrolytic Nickel (Ni) and Gold (Au) for corrosion resistance and wire bondability |
Hermeticity | ≤ 1x10⁻⁸ atm·cc/s (He), compliant with MIL-STD-883 |
Typical Dimensions | Customizable, standard footprints available (e.g., 22mm x 12.7mm) |
RF Configuration | Options for 50Ω impedance-matched RF leads (GSG configuration) |
This versatile butterfly package is the cornerstone of numerous high-technology systems, including:
Our manufacturing processes adhere to the highest quality standards. Products are compliant with:
Q1: Can the pin configuration be customized?
A1: Yes, we offer extensive customization options. While this is a 10-pin model, we can modify the pin count, pitch, and electrical characteristics (e.g., adding more RF or DC pins) to meet your specific application requirements.
Q2: What type of fiber attachment is supported?
A2: The package is designed with a precision-machined front port to accommodate the brazing or laser welding of a fiber optic ferrule or tube, ensuring stable and accurate fiber pigtail alignment.
Q3: Is a thermoelectric cooler (TEC) integrated into the package?
A3: This package is designed to accommodate an internal thermoelectric cooler (TEC). The high thermal conductivity of the base ensures efficient heat transfer from the hot side of the TEC to an external heat sink.
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