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In an era where electronic devices are becoming more powerful and compact, effective thermal management is paramount. We provide elite Ceramic Substrates, including high-purity Alumina (Al₂O₃) and Aluminium Nitride (AlN), that serve as the bedrock for cutting-edge Electronics Packaging. Our substrates are meticulously engineered to dissipate heat, ensure electrical integrity, and provide a stable mechanical foundation for sensitive semiconductor components. Whether you are developing high-power RF amplifiers, industrial laser modules, or next-generation automotive electronics, our ceramic solutions empower you to push the boundaries of performance and reliability.
Our substrates are manufactured to the highest quality standards, with material properties tailored for demanding applications.
| Property | Alumina (99.6% Al₂O₃) | Aluminium Nitride (AlN) | Unit |
|---|---|---|---|
| Thermal Conductivity (@ 20°C) | 26.9 | ≥170 | W/m·K |
| Coefficient of Thermal Expansion (CTE) | 7.0 (RT-400°C) | 4.6 (RT-400°C) | ppm/K |
| Bending Strength | ≥592 | ≥400 | MPa |
| Dielectric Constant (@ 1MHz) | 9.90 | 8.70 | - |
| Breakdown Strength (D.C.) | ≥18 | ≥15 | KV/mm |
| Surface Roughness (Polished) | ≤0.05 | ≤0.05 | µm |
With a thermal conductivity up to 170 W/m·K, our AlN substrates provide a highly efficient pathway to draw heat away from critical components like GaN and SiC dies, ensuring stable operation and extending device lifetime.
Both Alumina and AlN offer high dielectric strength and low dielectric loss, making them ideal for high-frequency Wireless RF Packaging where signal integrity is crucial.
Our ceramic substrates exhibit high flexural strength and a low CTE that can be closely matched to semiconductor materials, minimizing thermo-mechanical stress during operation and enhancing overall reliability.
We employ state-of-the-art thin-film processes (Ti/Pt/Au) to create high-precision, high-adhesion circuitry. We can also integrate passive components like high-stability TaN resistors and pre-deposit AuSn solder for simplified assembly.
Partnering with us provides tangible advantages for your business:
Our manufacturing processes and products are designed to meet the most stringent industry standards for high-reliability applications, including the principles outlined in MIL-STD-883 for microelectronics.
We don't just sell standard products; we create custom solutions. Our capabilities include:
Q1: When should I choose Aluminium Nitride (AlN) over Alumina (Al₂O₃)?
A1: AlN is the premium choice for applications with high heat flux, where thermal management is the primary challenge (typically for power devices dissipating >10W). Alumina offers a robust, cost-effective solution for a wide range of applications with moderate thermal loads and is an excellent electrical insulator.
Q2: What is the benefit of pre-deposited AuSn solder?
A2: Pre-depositing AuSn solder creates a flux-free, high-reliability solder joint with excellent thermal conductivity and precise thickness control. It simplifies your assembly process by eliminating the need for solder paste printing or preforms, leading to higher yields and better performance, especially in optoelectronics.
Q3: What information is required for a quotation?
A3: To provide an accurate quote, please supply your design files (DXF or Gerber), specify the ceramic material (AlN or Al₂O₃), required thickness, metallization details (including any resistors or AuSn), and estimated annual quantity.
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Main Product:
Tungsten Heavy Alloys,
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Electronic Packaging,
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Tantalum Alloys,
Nickel Based Braze Alloy
