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Puwei's 99.6% Alumina Ceramic Substrate (Al₂O₃) is the industry benchmark for reliability in passive component manufacturing. Engineered with ultra-high purity and exceptional consistency, it provides the perfect foundation for Thick Film Resistor and Film Resistor Element applications, ensuring outstanding electrical insulation, thermal stability, and mechanical support. As a cornerstone of Microelectronics Packaging, it guarantees signal integrity and long-term performance in demanding high-frequency modules and RF circuits.
High-purity 99.6% Al₂O₃ substrate blanks, ready for precision resistor patterning.
Substrates enabling high-yield manufacturing of precision chip resistors.
Composition: 99.6% Al₂O₃ with minimal trace impurities. Key electrical properties include Volume Resistivity > 10¹⁴ Ω·cm, Dielectric Constant of 9-10 @ 1 MHz, and Dielectric Strength of 15-25 kV/mm. Material density is 3.8-3.9 g/cm³, making it an ideal Bare Ceramic Plate for component assembly.
Thermal Conductivity: 20-30 W/(m·K). Coefficient of Thermal Expansion (CTE): 7.2-8.0 ppm/°C. Flexural Strength: 300-400 MPa. Vickers Hardness: HV 1500-1700. This balanced profile ensures compatibility with various pastes and metals in Electronic Packaging.
For precision resistors, substrate purity is non-negotiable. Our 99.6% purity minimizes conductive impurities that cause electrical leakage and parasitic effects, ensuring predictable performance. This makes it the optimal choice over lower-purity alumina for high-reliability applications, and a cost-effective alternative to AlN for most resistor and Integrated Circuit support functions.
The standard base for thick-film resistor pastes across consumer electronics, automotive, and industrial controls.
Essential for resistors in Microwave Components, filters, and communication devices where stable dielectric properties are critical.
Used in ECUs, sensors, and near Power Devices for its durability under thermal cycling and harsh environments.
The foundational platform for Thick Film Printed Circuit and complex HYBRID MICRO CIRCUITS, providing reliable interconnects and insulation.
Our manufacturing is ISO 9001:2015 certified, and materials are fully compliant with RoHS and REACH. We provide full traceability and batch-specific Certificates of Analysis, ensuring every substrate meets the stringent requirements of global Microelectronics and Sensor Packaging supply chains.
We tailor our substrates to your precise needs:
Our process guarantees consistency: Electronic-grade powder formulation, precise dry pressing, controlled high-temperature sintering, and precision grinding/lapping. 100% of production undergoes rigorous inspection for dimensions, flatness, and surface defects, ensuring a reliable foundation for your high-volume Electronic Packaging manufacturing.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates ,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
