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AMB (Active Metal Brazing) ceramic copper-clad substrates represent a significant advancement in power electronics packaging, building upon the foundation of DBC (Direct Bond Copper) technology. These substrates are engineered to address the demanding requirements of high-power, high-temperature applications in the new energy sector. The core innovation lies in the use of active metal solder containing elements like Ti (Titanium) and Zr (Zirconium), which enables robust bonding between dissimilar materials—ceramics and copper—at elevated temperatures around 800°C.
As a leading manufacturer, Puwei Ceramic specializes in advanced ceramic solutions, including Alumina Ceramic Substrates, Aluminum Nitride Substrates, and DBC Ceramic Substrate products. Our AMB substrates are particularly designed for next-generation power devices, offering superior performance in thermal management, electrical insulation, and mechanical reliability. They are ideal for electric vehicles, renewable energy systems, and industrial power converters where efficiency and durability are critical.
Puwei Ceramic's AMB substrates are available in various material configurations to meet specific application needs. Key technical parameters include:
These specifications ensure compatibility with high-power semiconductors like SiC and IGBTs, making our substrates a preferred choice for automotive and industrial applications.
Below are high-resolution images showcasing the AMB substrate's structure and applications. (Note: Videos can be embedded here upon request for dynamic demonstrations.)
Figure 1: AMB Substrate used in a new energy power module, highlighting compact design and copper cladding.
Figure 2: Close-up of AMB substrate surface, illustrating the uniform copper layer and ceramic base.
AMB substrates offer distinct benefits over traditional DBC or DPC substrates. Below are the key features explained in detail:
With thermal conductivity exceeding 90 W/mK for Si₃N₄-AMB variants, these substrates efficiently dissipate heat from high-power devices. This is critical for preventing overheating in EV inverters and solar inverters, thereby enhancing system longevity. Compared to standard Alumina Ceramic Substrates, AMB provides up to 3x better heat dissipation.
The active metal brazing process creates a chemical bond at the ceramic-metal interface, achieving peel strengths over 80 MPa. This prevents copper delamination during thermal cycling, a common issue in less advanced materials.
Silicon nitride's CTE (3.2 ppm/K) closely aligns with semiconductor materials like SiC, reducing thermal stress and cracking. This makes AMB substrates ideal for direct chip attachment without intermediate layers.
Supporting copper thicknesses up to 0.8 mm, these substrates can handle currents exceeding 500 A, suitable for heavy-duty applications in wind turbines and rail systems.
Testing under -55°C to 150°C cycles shows a lifespan of >5,000 cycles, outperforming many Electronic Ceramic Products. This reliability is vital for automotive and outdoor energy storage systems.
For engineers and procurement managers, here is a simplified guide to using AMB substrates in power modules:
For custom designs, our technical support team can assist with integration guidelines.
AMB substrates are deployed across multiple high-growth sectors. Below are key applications with examples:
In electric and hybrid vehicles, AMB substrates are used in traction inverters and onboard chargers. The "SiC + AMB" combination supports 800V architectures, reducing charging times and improving efficiency. They handle high currents while withstanding under-hood temperature variations.
For railway propulsion systems, AMB substrates provide reliability in inverters and converters. Their thermal shock resistance ensures operation in varying climates, from desert heat to Arctic cold.
In renewable energy, these substrates are used in photovoltaic inverters and battery management systems. For instance, in large-scale energy storage, they enhance the efficiency of DC-AC converters, complementing our Aluminum Nitride Ceramics for high-frequency applications.
AMB substrates serve in fuel cell power controllers, where high temperature and humidity resistance are crucial. They ensure stable performance in electrolyzers and fuel cell stacks.
High-power motor drives and UPS systems benefit from AMB's durability, reducing downtime in manufacturing plants.
By choosing Puwei Ceramic's AMB substrates, procurement managers and engineers gain:
Puwei Ceramic adheres to international quality and safety standards, ensuring product reliability:
These certifications provide assurance for global sourcing, particularly in regulated markets like Europe and North America.
We offer comprehensive OEM & ODM services to meet unique requirements:
Our large-size capabilities, such as AlN Ceramics Disc substrates, have received positive feedback for innovation and precision.
Our manufacturing process ensures high quality and consistency:
This process leverages our expertise in Ceramic Heat Sink technology, ensuring defect-free products.
Here are feedback examples from global clients (company names anonymized for privacy):
A: AMB uses active metal brazing for stronger bonding at higher temperatures, while DBC relies on oxygen-free bonding. AMB is better for high-reliability applications like automotive.
A: Yes, the CTE of Si₃N₄-AMB closely matches SiC, making it ideal for SiC power modules to reduce thermal stress.
A: Standard orders ship in 4-6 weeks. Prototypes can be delivered in 2 weeks with expedited service.
A: Absolutely. Our engineers assist with layout optimization, material selection, and testing protocols.
A: DPC is better for high-frequency, fine-pattern applications, while AMB excels in high-power, high-temperature scenarios. We can recommend based on your needs.
For quotes or technical inquiries, reach out to our sales team. We welcome OEM partnerships and long-term collaborations.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates ,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
