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Puwei's AlN Ceramic Mo-Mn Metalized Substrate is a state-of-the-art solution that merges the exceptional thermal conductivity of Aluminum Nitride with the robust reliability of molybdenum-manganese (Mo-Mn) metallization. This substrate is specifically engineered for applications where efficient heat dissipation, superior electrical insulation, and long-term reliability are non-negotiable. It serves as an ideal foundation for demanding electronic packaging, enabling the next generation of compact, high-power, and high-frequency electronic systems.
Our AlN Mo-Mn substrates are manufactured to precise specifications to ensure consistent, reliable performance in your application.
Mo-Mn metallization is a time-tested, thick-film process ideal for applications requiring hermetic sealing and exceptional bond strength. Unlike thin-film techniques, the Mo-Mn layer is fired at high temperatures, forming a durable, chemically bonded interface that penetrates the ceramic surface. This makes it the preferred choice over Direct Plated Copper (DPC) or thin-film metallization for:
Ideal substrate for microwave components such as RF power amplifiers (LDMOS, GaN), filters, and antenna modules in radar and 5G infrastructure. Its low dielectric loss and excellent thermal management are critical for high-frequency modules and RF circuits. Also serves as a baseplate for high-power laser diodes.
Used as the insulating, heat-spreading substrate in Insulated Gate Bipolar Transistor (IGBT) modules and next-generation Silicon Carbide (SiC) / Gallium Nitride (GaN) power devices. The Mo-Mn layer provides a reliable surface for brazing or soldering power dies and attaching copper baseplates or heat sinks.
A cornerstone technology for thick film hybrid microcircuits and hybrid micro circuits. The metallized surface allows for the screen-printing of thick-film resistor and conductor pastes, creating complex, high-reliability circuits for aerospace, medical, and industrial controls. Also used in the assembly of thermoelectric cooling assemblies.
Critical for microelectronics packaging that requires hermetic sealing, such as in military, aerospace, down-hole oil & gas, and high-end sensor packaging. The Mo-Mn metallization provides a perfect seal ring area for welding or brazing a metal lid, protecting sensitive chips from moisture and contaminants.
Increasingly used in electric vehicle (EV) traction inverters, onboard chargers, and industrial motor drives. Withstands the high temperatures, vibration, and harsh environments typical in these applications, providing a reliable platform for high-power microelectronic components.
To ensure optimal performance and reliability of your assembly, follow these guidelines when designing with and integrating our Mo-Mn metalized AlN substrates.
Puwei specializes in co-engineering metalized ceramic substrates to meet your exact electrical, thermal, and mechanical specifications, from prototyping to volume production.
Our vertically integrated manufacturing ensures stringent control over every step, delivering substrates with exceptional consistency and reliability.
Puwei Ceramic is committed to the highest standards of quality and reliability, essential for serving global markets in demanding industries.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates ,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
