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The DPC Metallized Substrate for Thin Film Circuits represents precision engineering at its finest, specifically designed for high-performance thin film applications requiring exceptional electrical characteristics and thermal management. As specialists in Metallized Ceramics, Puwei Ceramic delivers substrates that enable superior performance in advanced electronic systems.
Premium DPC Metallized Substrate optimized for thin film circuit fabrication
Comprehensive material selection guide for optimal thin film performance
Our DPC technology enables circuit patterns with resolutions down to 25 μm, supporting the most demanding thin film applications. This precision surpasses traditional Alumina Ceramic Substrates and enables higher circuit density and performance in compact designs.
With surface roughness maintained below 0.1 μm Ra, our substrates provide the ideal foundation for subsequent thin film deposition processes. The mirror-like finish ensures uniform layer deposition and optimal adhesion for additional thin film materials.
The combination of high thermal conductivity ceramics and precision copper metallization provides efficient heat spreading, crucial for thin film circuits where localized heating can affect performance and reliability.
Low dielectric constant and loss tangent ensure minimal signal distortion at high frequencies, making our substrates ideal for RF and microwave thin film circuits where signal integrity is paramount.
Begin with high-purity ceramic substrates that undergo precision polishing to achieve sub-micron surface finish. Rigorous cleaning eliminates contaminants that could compromise thin film adhesion and electrical performance.
Advanced sputtering technology deposits uniform seed layers, followed by controlled electroplating to build copper thickness with exceptional consistency. Process parameters are meticulously controlled to ensure optimal conductivity and adhesion.
State-of-the-art photolithography and etching techniques create intricate circuit patterns with micron-level accuracy. This final step transforms the copper layer into precise conductive pathways tailored to specific thin film circuit requirements.
Begin with plasma treatment or chemical activation to enhance surface energy, ensuring optimal adhesion for subsequent thin film layers.
Utilize sputtering, evaporation, or chemical vapor deposition to apply additional conductive, resistive, or dielectric layers as required by your specific thin film circuit design.
Apply photoresist and use photolithography to define additional circuit elements, followed by precise etching to create the complete thin film circuit structure.
Mount active and passive components using appropriate bonding techniques, leveraging the excellent thermal and electrical properties of the DPC substrate.
Perform comprehensive electrical, thermal, and reliability testing to ensure the integrated thin film circuit meets all performance specifications.
Comprehensive manufacturing workflow ensuring highest quality standards for thin film circuits
Critical for high-density integrated circuits requiring precise interconnects, bonding pads, and conductive structures. The sub-micron precision of our DPC substrates enables complex circuit designs with high component density, outperforming conventional DBC Ceramic Substrate solutions in fine-pitch applications.
Essential for MEMS devices where stable platforms integrate mechanical and electrical components. The exceptional thermal and electrical properties ensure reliable operation of MEMS sensors, actuators, and microsystems in demanding environments.
Ideal for advanced optoelectronic devices including high-power LEDs, laser diodes, and photodetectors. The superior heat dissipation and electrical conductivity significantly enhance device performance, reliability, and lifespan in optical communication systems.
Perfect for high-frequency applications including RF modules, microwave circuits, and millimeter-wave systems. The low dielectric loss and high conductivity enable excellent signal integrity with minimal attenuation up to 40 GHz frequencies.
Increasingly adopted in medical imaging systems, implantable devices, and aerospace electronics where reliability, precision, and thermal stability are critical requirements in challenging operating environments.
Our precision DPC substrates enable thinner traces, closer spacing, and higher circuit densities, directly translating to improved electrical performance and miniaturization capabilities for your thin film applications.
The exceptional surface quality and dimensional stability of our substrates reduce defects in subsequent thin film processes, improving overall manufacturing yield and reducing production costs.
Superior thermal management and mechanical stability ensure reliable operation under thermal cycling and mechanical stress, extending the operational lifespan of your thin film devices.
The combination of precision patterning and excellent material properties provides engineers with greater design freedom for innovative thin film circuit architectures.
Puwei Ceramic maintains the highest quality standards with comprehensive international certifications:
As experts in Electronic Ceramic Products, we offer comprehensive customization services tailored to your specific thin film application requirements:
Our expertise in large dimension ceramic substrates, including sizes such as 240 × 280 × 1 mm and 95 × 400 × 1 mm, has earned consistent praise from clients in the thin film industry. These capabilities position us as preferred suppliers for applications requiring substantial substrate areas for multi-device integration.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics ,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
