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Puwei's Aluminum Nitride (AlN) Ceramic Substrates represent the pinnacle of thermal management solutions for advanced electronic applications. Manufactured using precision casting processes, these substrates are engineered to meet the demanding requirements of modern electronic packaging and microelectronics packaging applications.
Our specialized subdivision of aluminum nitride substrates addresses diverse customer requirements, particularly focusing on optimized metallization solutions for various applications. With exceptional thermal conductivity and electrical insulation properties, these substrates serve as fundamental components in high-performance electronic systems.
Our Aluminum Nitride Ceramic Substrates exhibit exceptional performance characteristics ideal for power devices and high-power microelectronic components. The material demonstrates outstanding thermal conductivity exceeding 175W/m·K, with high-performance variants reaching 200W/m·K. Electrical insulation properties ensure reliable operation in high-voltage environments, while the coefficient of thermal expansion closely matches silicon, minimizing thermal stress in semiconductor applications.
Mechanical properties include high flexural strength exceeding 300MPa, ensuring structural integrity in demanding operational conditions. Surface roughness can be precision-controlled to sub-micron levels, critical for thin film resistor elements and advanced hybrid micro circuits. The substrates maintain excellent performance across a wide temperature range from -50°C to 400°C, with dielectric strength greater than 15kV/mm.
The exceptional thermal conductivity of our Aluminum Nitride substrates enables efficient heat dissipation in high-density integrated circuits and power electronic systems, significantly enhancing device reliability and lifespan.
We provide specialized metallization services optimized for specific application requirements, including direct plate copper (DPC), direct bonded copper (DBC), thick film and thin film printing processes. This versatility makes our substrates ideal for RF circuits and microwave components.
Utilizing advanced casting technology, we achieve exceptional dimensional accuracy and surface quality, critical for thermoelectric semiconductor module plates and precision ceramic components.
Our manufacturing facilities support a wide range of substrate dimensions tailored to specific application needs. Standard thickness ranges from 0.10mm to 1.5mm, with custom thickness options available. Panel sizes can be customized up to 150mm × 200mm, accommodating various production requirements for sensor packaging and optoelectronics applications.
Ideal for insulation elements in high-power converters and inverters, providing excellent electrical isolation and thermal management for power semiconductor devices.
Superior performance in high-frequency modules and microwave applications due to low dielectric loss and stable electrical characteristics across frequency spectra.
Critical component in microelectronics packaging and sensor packaging, enabling miniaturization while maintaining thermal performance and reliability.
Excellent substrate choice for optoelectronics applications, particularly in high-power LED systems and laser diodes where efficient heat dissipation is crucial.
Puwei's Aluminum Nitride Ceramic Substrates deliver significant operational advantages including extended component lifespan through superior thermal management, reduced system failure rates in demanding environments, and enhanced performance consistency in high-power microelectronic components. The substrates contribute to overall system cost reduction by enabling higher power densities and simplifying thermal management systems.
We offer extensive customization options including dimensional specifications, surface finish requirements, specialized metallization patterns, and tailored thermal performance characteristics. Our engineering team collaborates closely with clients to develop optimized solutions for specific applications in thermoelectric cooling assemblies and specialized ceramic chips.
Our production process integrates rigorous quality control at each manufacturing stage, from raw material selection through final inspection. Advanced casting technology ensures consistent material properties and dimensional accuracy, while specialized firing processes optimize the ceramic microstructure for enhanced thermal and mechanical performance in critical applications such as thick film hybrid microcircuits.
In addition to Aluminum Nitride substrates, Puwei provides comprehensive advanced ceramic solutions including alumina ceramics, silicon carbide ceramics, silicon nitride ceramics, and specialized ceramic metallization materials. This diverse portfolio enables us to offer optimal material selection for specific application requirements across thermal management, electrical insulation, and mechanical support functions.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates ,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
