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Puwei's Aluminum Nitride Ceramic Substrates represent the pinnacle of thermal management for high-performance electronic systems. Manufactured using precision casting technology and vertical integration, these substrates deliver exceptional thermal conductivity (≥175 W/m·K) combined with superior electrical insulation. They are the preferred foundation for demanding applications in electronic packaging, power devices, and high-frequency modules. Our rigorous quality control, from raw material processing to finished ceramic components, ensures consistent, reliable performance for your most critical designs.
Engineered for precision and performance, our AlN substrates meet the strict demands of microelectronics packaging and high-reliability systems.
These properties ensure reliable performance as insulation elements and heat spreaders in integrated circuit and high-power microelectronic component applications.
With thermal conductivity up to 200 W/m·K (5-8x higher than alumina), our substrates efficiently dissipate heat from high-density power devices and microwave components, preventing thermal runaway and significantly extending device lifespan.
Engineered to support DPC, DBC, AMB, thick film, and thin film printing processes. This offers maximum design flexibility for creating RF circuits, thick film hybrid microcircuits, and advanced thermoelectric cooling assemblies.
Advanced casting technology ensures tight dimensional tolerances and superior surface quality. We offer customized thicknesses (down to 0.10 mm), surface finishes, and sizes, ideal for specialized sensor packaging and demanding optoelectronics applications.
High dielectric strength (>15 kV/mm) and volume resistivity make it an excellent insulation element, ensuring safety and signal integrity in high-voltage environments and dense microelectronics packaging.
A structured approach to incorporating Puwei AlN substrates into your designs for optimal performance.
Ideal for IGBT modules, power converters, and inverters. Serves as a critical insulation element and heat spreader, enhancing the reliability of high-power microelectronic components in EV, industrial, and renewable energy systems.
Provides low dielectric loss and stable thermal performance for high-frequency modules, microwave applications, and RF power amplifiers used in 5G infrastructure and radar systems.
Critical for microelectronics packaging, sensor packaging, and thermoelectric semiconductor module plates, enabling miniaturization while maintaining superior thermal control.
Used as a high-efficiency heat sink substrate for laser diodes, high-power LEDs, and other optoelectronics applications where junction temperature directly impacts light output and lifetime.
Puwei provides extensive customization to ensure our AlN substrates precisely match your technical requirements and simplify your assembly process for ceramic chips and complex modules.
Our manufacturing excellence is built on a vertically integrated, tightly controlled process, ensuring that every substrate functions as a reliable ceramic component.
Statistical Process Control (SPC) ensures exceptional batch-to-batch consistency, making Puwei a trusted partner for high-reliability applications.
Manufactured in ISO 9001:2015 certified facilities. Our quality management system ensures full traceability and adherence to international standards. All materials are RoHS and REACH compliant, meeting global environmental and safety requirements for electronic components.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates ,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
