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High-performance Electronics And Circuit Boards Alumina Ceramic Substrates

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Alumina Ceramic Substrates for High-Performance Electronics

Puwei's Alumina Ceramic Substrates are precision-engineered to meet the demanding requirements of modern high-performance electronics. These advanced substrates deliver exceptional thermal management, superior electrical insulation, and robust mechanical strength, making them the ideal foundation for cutting-edge Electronic Packaging and Microelectronics Packaging applications.

With excellent thermal conductivity, outstanding chemical stability, and reliable performance under extreme conditions, our alumina ceramic substrates ensure optimal functionality in the most challenging electronic environments.

Technical Specifications

Material Properties

  • Material Composition: High-Purity Alumina (Al₂O₃)
  • Alumina Content: 96%, 99%, 99.5%, 99.6% available
  • Density: 3.7-3.9 g/cm³
  • Flexural Strength: 300-400 MPa
  • Compressive Strength: 2500-3000 MPa

Electrical Properties

  • Dielectric Constant: 9-10 @ 1 MHz
  • Dielectric Strength: 15-25 kV/mm
  • Volume Resistivity: >10¹⁴ Ω·cm
  • Insulation Resistance: Excellent electrical isolation

Thermal Properties

  • Thermal Conductivity: 20-30 W/m·K
  • Thermal Expansion Coefficient: 7.2-8.0 × 10⁻⁶/°C
  • Maximum Operating Temperature: 1600°C
  • Thermal Shock Resistance: Excellent performance

Product Visualization

Product Features & Advantages

Exceptional Thermal Management

Excellent thermal conductivity ensures efficient heat dissipation in high-power electronic devices, maintaining stable operation and extending component lifespan in demanding Power Devices applications.

Superior Electrical Insulation

High insulation resistance and dielectric strength prevent electrical leakage, ensuring safe and efficient circuit operation while maintaining signal integrity.

Robust Mechanical Strength

Exceptional hardness and wear resistance enable these substrates to withstand mechanical stress, making them ideal for durable Electronic Packaging solutions.

Excellent Chemical Stability

Resistant to chemical corrosion, alumina substrates maintain integrity in harsh environments exposed to various chemicals and processing conditions.

Optimized Dielectric Properties

Low dielectric constant minimizes signal loss and interference, ensuring efficient signal transmission in High frequency module and RF applications.

Precision Manufacturing

Tight dimensional tolerances and superior surface finish enable reliable integration into advanced electronic assemblies and hybrid circuits.

Application Scenarios

Integrated Circuits & Microelectronics

Essential substrates for IC packaging and Microelectronics Packaging, leveraging superior thermal and electrical properties to enhance performance and reliability in compact electronic devices.

LED Technology & Optoelectronics

Ideal base for LED chips and optoelectronic devices, providing efficient heat dissipation and electrical insulation for high-brightness lighting applications.

Power Electronics Systems

Critical components in power modules, converters, and electronic control units where thermal management and electrical insulation are paramount for system reliability.

RF & Microwave Components

Preferred substrate for RF circuits and microwave components, offering low dielectric loss and stable high-frequency performance for telecommunications and wireless applications.

Thick & Thin Film Circuits

Perfect foundation for advanced circuit technologies, withstanding high processing temperatures and providing excellent electrical characteristics for precision electronic applications.

Sensor & Automotive Electronics

Reliable platform for Sensor packaging and automotive control systems, delivering stable performance under varying environmental conditions and thermal cycling.

Benefits for Electronics Manufacturers

  • Enhanced System Reliability

    Superior thermal management and electrical insulation extend component lifespan and reduce failure rates in demanding applications

  • Improved Performance

    Excellent dielectric properties and thermal conductivity enable higher power densities and improved signal integrity

  • Reduced Manufacturing Costs

    High reliability and consistent performance minimize rework, warranty claims, and total cost of ownership

  • Design Flexibility

    Customizable dimensions and properties enable optimized solutions for specific application requirements

  • Extended Product Lifecycle

    Exceptional durability and resistance to environmental factors ensure long-term performance and customer satisfaction

Certifications & Quality Assurance

Puwei Ceramic maintains the highest quality standards with comprehensive certification and rigorous quality control processes for electronic-grade ceramic substrates.

Quality Management System

  • ISO 9001 Certified Quality Management System
  • RoHS and REACH Compliance for environmental safety
  • Comprehensive material traceability and batch control
  • Statistical process control for dimensional consistency
  • Advanced metrology for precision verification

Customization Options

Puwei Ceramic offers comprehensive customization services for alumina ceramic substrates tailored to specific electronic application requirements.

Dimensional Customization

Precision manufacturing of custom sizes, thicknesses, and geometric configurations to match specific circuit designs and packaging requirements.

Material Grade Selection

Multiple alumina purity grades (96%, 99%, 99.5%, 99.6%) available to balance performance requirements with cost considerations.

Surface Finish Options

Various surface treatments including precision lapping, polishing, and specialized coatings optimized for different circuit printing and bonding processes.

Metallization Services

Optional metal coatings and patterns for specific bonding, soldering, or electrical connection requirements in advanced electronic assemblies.

Manufacturing Process

  1. Raw Material Preparation

    High-purity alumina powder is carefully selected, formulated, and tested for electronic-grade applications

  2. Precision Forming

    Advanced pressing and casting techniques create substrate preforms with accurate dimensions and uniform density

  3. High-Temperature Sintering

    Controlled atmosphere sintering at elevated temperatures achieves optimal density and develops required electrical and mechanical properties

  4. Precision Machining

    CNC grinding and lapping operations establish exact dimensional accuracy and surface finish specifications

  5. Surface Treatment

    Specialized surface finishing processes optimize substrates for specific circuit printing and component mounting requirements

  6. Quality Verification

    Comprehensive testing including dimensional inspection, electrical property verification, and performance validation

Frequently Asked Questions

What are the key advantages of alumina ceramic substrates over other materials?

Alumina ceramic substrates offer superior thermal conductivity, excellent electrical insulation, high mechanical strength, and excellent chemical stability compared to organic substrates, making them ideal for high-performance and high-reliability applications.

How do I choose the right alumina purity grade for my application?

Higher purity grades (99.5%, 99.6%) offer better thermal and electrical properties for demanding applications, while standard grades (96%, 99%) provide cost-effective solutions for less critical applications. Our technical team can help select the optimal grade.

What temperature ranges can these substrates withstand?

Our alumina ceramic substrates can operate continuously at temperatures up to 1600°C, with excellent thermal shock resistance for rapid temperature cycling applications.

Can these substrates be used in high-frequency applications?

Yes, the low dielectric constant and stable electrical properties make them ideal for high-frequency and RF applications, minimizing signal loss and maintaining impedance characteristics.

What lead times can I expect for custom orders?

Standard custom orders typically have a lead time of 4-6 weeks, with expedited options available for urgent requirements. Prototype development can often be completed more quickly.

Do you provide technical support for substrate integration?

Yes, we offer comprehensive technical support from material selection through application optimization, ensuring successful integration and maximum performance in your electronic systems.

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Address: Xian, China


Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics, AlN Ceramics Disc , DPC Substrate, DBC Ceramic Substrate

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The information of 2bvideo.com limited shown above is provided by the user or collected on the network. Video 2B does not guarantee the authenticity,accuracy and legitimacy of 2bvideo.com limited information. Video 2B does not involve legal relationships and disputes between users arising from transactions other than secured transactions on this website. Disputes shall be settled by you through negotiation. If you are the person in charge or relevant employee of this enterprise, if you find that the enterprise information is incorrect or want to manage thiscompany, please contact us jacklee1558@gmail.com, after you claim the enterprise, you can obtain management permission, publish supplyand demand information, bring consulting orders, and remove page advertisements.
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