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Puwei's 99.6% High-purity Polished Alumina Ceramic Substrate is engineered for high-reliability applications demanding exceptional surface quality and material consistency. With an ultra-smooth surface roughness (<0.5 μm), it provides an ideal foundation for high-resolution circuit patterning, serving as a cornerstone material for advanced Electronic Packaging and Microelectronics Packaging. It delivers an optimal balance of superior electrical insulation, effective thermal management, and robust mechanical strength for the most demanding industries, forming the base for integrated circuits and high-power microelectronic components.
High-purity polished alumina substrate with exceptional surface flatness for Thick Film Printed Circuit applications.
Close-up detail showcasing the ultra-smooth, defect-free surface critical for Integrated Circuits and microelectronics assembly.
Precision polishing process for ceramic components used in advanced optoelectronics applications.
Precision-engineered properties define this substrate, making it critical for sensitive Insulation Elements and high-performance circuit carriers in microwave applications and RF circuits.
Alumina Content (Al₂O₃): 99.6%. Flexural Strength: 300-400 MPa. Hardness: ~9 Mohs. Surface Roughness (Ra): < 0.5 μm (Polished). These properties ensure durability for high-power microelectronic components.
Volume Resistivity: >10¹⁴ Ω·cm. Thermal Conductivity: 20-30 W/(m·K). Coefficient of Thermal Expansion (CTE): 6-8 ×10⁻⁶/°C. Dielectric Strength: Excellent for high-voltage isolation in power devices and insulation elements.
The precision-polished finish is critical for high-performance Microwave Components and RF circuits, ensuring superior adhesion and resolution for thin-film and thick-film processes used in thick film hybrid microcircuits.
Extremely high volume resistivity provides reliable isolation, preventing leakage and crosstalk in dense Microelectronics and High-Power Microelectronic Components, serving as dependable insulation elements.
Effective heat management with matched CTE ensures durability under thermal cycling, ideal for reliable Sensor Packaging and Power Devices in automotive and industrial applications.
99.6% Al₂O₃ guarantees uniform performance, reducing engineering uncertainty and streamlining qualification for volume production of ceramic components and Bare Ceramic Plates.
Low-loss substrate for filters and antennas in High-Frequency Modules, where surface smoothness is critical for GHz signal integrity, ideal for microwave and RF ceramic substrates.
Base platform for Thick Film Hybrid Microcircuits in aerospace, medical, and military electronics requiring high reliability and precision for hybrid micro circuits.
Provides a stable, insulating, and flat platform for sensitive elements in Sensor Packaging and MEMS devices, ensuring long-term stability.
Functions as a robust Insulation element and heat spreader in Power Devices and IGBT ceramic substrates, offering a cost-effective thermal solution for power semiconductor ceramic substrates.
Our commitment to quality is validated by international standards, ensuring reliability for global supply chains.
We offer extensive OEM/ODM services to tailor substrates to your exact needs, leveraging our expertise in advanced CERAMIC COMPONENTS and alumina ceramic substrates.
Thickness from 0.2mm to 2.0mm. Custom sizes and shapes, including large formats. Precision holes and edge profiles per your drawing for automotive electronic ceramic substrates.
Precision Polished (Ra <0.5μm), Lapped, or As-Fired. Optional laser marking available for traceability.
Supplied as Bare Ceramic Plates (TO BE USED IN MFG ASSY. OF ELECTRONIC INTEGRATED CIRCUIT) or with pre-applied thin-film/thick-film layers as a turnkey solution for thick film printed circuits and RF circuits.
Statistical Process Control (SPC) is implemented throughout, guaranteeing that every substrate meets the exacting standards required for advanced electronic packaging and sensor packaging applications.
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Main Product:
Alumina Ceramic Substrates,
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Metallized Ceramics,
AlN Ceramics Disc ,
DPC Substrate,
DBC Ceramic Substrate
