99.6% Alumina Ceramic Substrate For High-power Laser Diodes

99.6% Alumina Ceramic Substrate For High-power Laser Diodes

2 year ago

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Shaanxi Puwei Electronic Technology Co., Ltd

 2 year year

Product details

Ceramic Insulating Substrates for Thermoelectric Modules

Product Overview

Puwei Ceramic specializes in high-performance ceramic insulating substrates engineered as the critical foundation for reliable and efficient thermoelectric modules. Designed for applications ranging from precision cooling to industrial waste heat recovery, our alumina ceramic substrate (Al2O3) provides the essential electrical isolation, thermal pathway, and mechanical support required for optimal thermoelectric cooling assemblies and power generation systems. This substrate acts as a robust insulation element and structural baseplate, ensuring long-term stability and performance for modules operating on the Peltier effect.

High-purity alumina ceramic substrates for thermoelectric module assembly

Precision-manufactured alumina substrates ready for thermoelectric element bonding.

Core Advantages for Thermoelectric Applications

Superior Electrical Insulation: Volume resistivity exceeding 10¹⁴ Ω·cm ensures complete isolation between thermoelectric couples, preventing current leakage and short circuits that degrade module efficiency in electronic packaging.
Optimized Thermal Conductivity: With thermal conductivity of 20-30 W/m·K, the substrate efficiently transfers heat to and from the thermoelectric elements, maintaining the critical temperature gradient for effective energy conversion in thermoelectric modules for electric power generation.
Matched Coefficient of Thermal Expansion (CTE): CTE of 7.2-8.4 × 10⁻⁶/°C is engineered to closely match common thermoelectric semiconductor materials (like Bismuth Telluride), minimizing interfacial stress and preventing delamination during thermal cycling.
Exceptional Mechanical Strength: High flexural strength (>300 MPa) provides a rigid, durable platform that protects fragile thermoelectric elements from mechanical shock and vibration, ensuring module integrity in demanding environments.

Technical Specifications

Material & Physical: Material: High-Purity Aluminum Oxide (Al₂O₃). Purity: 95% to 99.6%. Density: 3.9-4.0 g/cm³. Surface Roughness: Ra < 0.5 μm.

Electrical Properties: Dielectric Strength: >10 kV/mm. Volume Resistivity: >10¹⁴ Ω·cm. Dielectric Constant: 9.0-10.5.

Thermal Properties: Thermal Conductivity: 20-30 W/m·K. Operating Temperature: -50°C to 1600°C. Thermal Expansion: 7.2-8.4 × 10⁻⁶/°C.

Mechanical Properties: Flexural Strength: >300 MPa. Compressive Strength: >2000 MPa.

Key Applications & Use Cases

Our substrates enable reliable performance across diverse thermoelectric applications:

Precision Temperature Control: Found in thermoelectric cooling assemblies for medical devices, laboratory equipment, and sensor packaging, where stable, vibration-free cooling is required.
Industrial & Automotive Energy Harvesting: Used in modules that convert waste heat from exhaust systems or industrial processes into electricity, functioning as robust thermoelectric modules for electric power generation.
Consumer Electronics Thermal Management: Integrated into compact coolers for high-performance CPUs, laser diodes, and telecommunications equipment, where space is constrained and reliability is critical.
Specialized Cooling/Heating Systems: Employed in electronic thermocouple pyrometers based on the Peltier effect and specialized refrigeration units requiring solid-state, reliable temperature control.

Implementation Guide: From Substrate to Functional Module

Design & Specification: Determine substrate dimensions, thickness, and alumina purity (96% for cost-effectiveness, 99.6% for highest performance) based on your module's voltage, current, and thermal load requirements.
Metallization & Patterning: Apply conductive electrode patterns onto the substrate. Puwei can provide this service using thick film printed circuit techniques (screen printing) or thin-film deposition to create the necessary electrical connections for the thermoelectric couples.
Thermoelectric Element Bonding: Precisely attach Bismuth Telluride or other semiconductor pellets to the metallized pads using solder, conductive epoxy, or transient liquid phase bonding for optimal thermal and electrical contact.
Module Assembly & Encapsulation: Complete the assembly with the second substrate, establish electrical series connections, and apply protective coatings or potting compounds to ensure environmental protection and mechanical stability.
Performance Testing: Validate the completed module's key parameters: maximum temperature differential (ΔTmax), maximum heat pumping capacity (Qmax), and electrical insulation resistance under operating conditions.

Production Process & Quality Assurance

Our vertical manufacturing ensures consistent quality and performance:

Powder Preparation: Selection and milling of high-purity alumina powder with controlled particle size distribution.
Precision Forming: Substrates are shaped using dry pressing or tape casting for uniform density and thickness control.
High-Temperature Sintering: Firing in kilns at temperatures up to 1600°C to achieve maximum density, strength, and stability.
CNC Machining & Surface Finishing: Precision grinding and lapping to achieve exact dimensions and the required surface flatness (Ra < 0.5μm) for optimal thermal interface.
Metallization (Optional): Application of silver, gold, or other conductive pastes in custom patterns via screen printing.
Rigorous Final Inspection: 100% dimensional verification and batch testing for electrical and thermal properties to ensure every substrate meets specification.

Our production facility is ISO 9001:2015 certified, implementing strict statistical process control (SPC) from raw material to finished product, guaranteeing batch-to-batch consistency and compliance with international standards.

Customization & Value Proposition

We offer extensive customization to meet your specific thermoelectric module design:

Dimensions & Geometry: Custom thickness (from 0.2mm), length, and width. Options for holes, notches, or complex shapes to fit your assembly.
Material Grade: Choice between standard 96% Al₂O₃ or high-performance 99.6% Al₂O₃ for enhanced thermal and electrical properties.
Surface Finish & Metallization: Various surface finishes (as-fired, ground, polished) and full metallization services with custom electrode patterns.

Value for Your Business: By providing a substrate with matched CTE and excellent insulation, we help you build more reliable modules with higher conversion efficiency and longer service life. This translates to reduced field failures, lower total cost of ownership, and a stronger competitive product in markets for cooling, heating, and energy harvesting.

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Shaanxi Puwei Electronic Technology Co., Ltd

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2 year

Address: Xian, China

Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics, AlN Ceramics Disc, DPC Substrate , DBC Ceramic Substrate

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