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Puwei's High-Performance Alumina Ceramic Substrate provides the critical foundation for modern optoelectronic systems. Engineered from high-purity aluminum oxide (Al₂O₃), it delivers exceptional electrical insulation, superior thermal management, and outstanding dimensional stability required for high-speed data communication, microelectronics packaging, and high-frequency modules. It is the ideal platform for demanding optoelectronics applications, ensuring reliable signal integrity in data centers, telecommunications, and high-performance computing where mission-critical reliability is non-negotiable.
99.6% Alumina Ceramic Substrate for high-power laser diodes
High-power electronic modules ceramic substrate
Material & Core Properties: High-Purity Al₂O₃ (≥96% standard, 99.6% premium). Volume resistivity >10¹⁴ Ω·cm. Thermal conductivity 15-30 W/(m·K). Coefficient of Thermal Expansion (CTE) 6-8 × 10⁻⁶/°C.
Mechanical & Dimensional Parameters: Flexural strength 200-350 MPa. Surface roughness (Ra) <0.5 μm. Thickness range 0.2mm to 2.00mm. Maximum format 240mm × 280mm. Flatness <0.05mm/50mm.
Metallization & Finishing Options: Available metallization: Au (high-frequency/corrosion-resistant), Ag (high-current), Cu (cost-effective). Processes include DBC, DPC, and thick film printing for custom circuit patterns suitable for thick film printed circuit designs and hybrid micro circuits.
Excellent dielectric properties and low loss tangent make it ideal for microwave components and RF circuits, ensuring minimal signal degradation in high-frequency modules. This characteristic is essential for maintaining data integrity in high-speed optical transceivers.
Effectively dissipates heat from high-power laser diodes and driver ICs, preventing thermal runaway and extending component lifespan. Crucial for high-power microelectronic components and laser diode cooling applications where thermal density continues to increase with each generation.
Low CTE ensures minimal dimensional change with temperature, maintaining critical optical alignments in transceiver modules and precision sensor packaging. This stability directly translates to higher coupling efficiency and lower optical loss over the product lifetime.
Serves as a robust and reliable base for thick film hybrid microcircuits, enabling complex circuit integration within a compact footprint. The substrate supports multiple assembly techniques including wire bonding, flip-chip, and surface mount technologies.
Surface roughness <0.5 μm enables precise placement of optical components and ensures optimal adhesion for metallization layers, critical for maintaining signal integrity in optoelectronics applications.
High-speed optical transceivers (QSFP+, SFP+), 5G fronthaul/backhaul modules, and fiber-optic network equipment requiring stable performance in optoelectronics applications. Our substrates support data rates from 10G to 800G and beyond.
Optical interconnects for servers and advanced computing systems, as well as precision LiDAR and industrial sensor packaging where signal integrity and thermal management are critical for high-frequency modules.
Robust substrates for automotive LiDAR, industrial fiber sensors, and IoT communication modules that must withstand harsh operating environments including vibration, humidity, and extreme temperatures.
Also suitable for power devices, insulation elements in high-voltage systems, and as bare ceramic plates for custom electronic assembly where dielectric strength and thermal performance are essential.
Additional applications include fiber optic communication devices, automotive electronics modules, LED industry, high-frequency microwave systems, and medical laser equipment requiring precise thermal and electrical management.
Our manufacturing is governed by an ISO 9001:2015 certified quality management system. Materials and processes comply with RoHS/REACH standards, ensuring global regulatory acceptance and supply chain compatibility. Each production batch maintains full traceability from raw material to finished substrate.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
