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Puwei Ceramic's Direct Bonded Copper (DBC) Metallization of Alumina Substrate represents the pinnacle of electronic packaging technology, combining exceptional thermal management with superior electrical insulation. As leading Alumina Ceramic DBC Substrate Manufacturers and Suppliers in China, we deliver reliable solutions that enhance device performance and longevity across power electronics, automotive systems, and industrial applications.
Our DBC technology creates a robust bond between high-purity alumina ceramic and oxygen-free copper, resulting in substrates that offer excellent thermal conductivity, strong mechanical properties, and reliable electrical isolation. This makes them ideal for demanding applications where thermal management and electrical integrity are critical.
High-quality DBC alumina substrate with excellent copper bonding
Comprehensive performance specifications for DBC metallization substrates
Our DBC Metallization of Alumina Substrates are engineered to meet rigorous industry standards with the following technical parameters:
Puwei Ceramic's DBC Metallization of Alumina Substrates offer distinct advantages for demanding electronic applications:
With thermal conductivity of approximately 24W/(m·K), our alumina substrates efficiently dissipate heat from power devices, preventing overheating and extending component lifespan. The closely matched coefficient of thermal expansion (7.1ppm/K) to silicon chips minimizes thermal stress during operation, enhancing reliability in thermal cycling conditions.
Our substrates provide outstanding electrical isolation with dielectric withstand voltage exceeding 2.5kV and high insulation resistance. This effectively prevents current leakage and short circuits, ensuring the electrical safety of equipment in high-voltage applications. The low dielectric constant and minimal dielectric loss maintain signal integrity even in high-frequency circuits.
The strong bonding between copper foil and alumina ceramic, with peel strength ≥5.0 N/mm, ensures the copper layer remains securely attached during use. The substrates exhibit sufficient mechanical strength to withstand external stress and impact while maintaining dimensional stability. The smooth, defect-free surface meets requirements for high-precision electronic packaging.
Our substrates demonstrate excellent resistance to chemical corrosion from acids, alkalis, and salts, maintaining performance in harsh environments. The non-hygroscopic nature ensures reliable operation in humid conditions, while the environmentally friendly materials comply with global regulatory standards.
Follow these steps for optimal integration into your electronic designs:
Our DBC Metallization of Alumina Substrates serve critical roles across multiple industries:
Essential for Insulated Gate Bipolar Transistors (IGBTs), power modules, and high-voltage converters where efficient heat dissipation and electrical isolation are critical for reliability and performance.
Used in electric vehicle power systems, battery management, and motor drives where thermal management under harsh operating conditions ensures long-term reliability.
Applied in motor drives, power supplies, and industrial controls where robust performance under thermal cycling and mechanical stress is essential.
Critical for solar inverters, wind turbine controllers, and energy storage systems where reliability and thermal performance directly impact energy conversion efficiency.
Used in high-power LED drivers, power adapters, and communication devices where space constraints demand efficient thermal management in compact designs.
Choosing Puwei Ceramic's DBC Metallization of Alumina Substrates delivers significant advantages:
Our manufacturing process ensures consistent quality and performance through rigorous controls:
Puwei Ceramic maintains the highest quality standards through comprehensive certifications:
We offer comprehensive OEM & ODM services to meet your specific application requirements:
Our expertise in DBC Metallization of Alumina Substrate and other advanced ceramics enables us to provide tailored solutions for unique application requirements.
DBC (Direct Bonded Copper) creates a direct bond between copper and ceramic under high temperature, offering superior thermal performance and bond strength. DPC (Direct Plated Copper) uses electroplating to deposit copper onto ceramic, allowing finer circuit patterns but with lower thermal performance. Puwei specializes in both DBC Ceramic Substrate and DPC Ceramic Substrate technologies.
Alumina offers excellent electrical insulation and good thermal conductivity (24W/mK) at a more cost-effective price point. Aluminum nitride provides higher thermal conductivity (170-200W/mK) but at a premium cost. The choice depends on your specific thermal requirements and budget constraints.
Standard lead time for custom orders is 3-4 weeks, with expedited options available for urgent requirements. Sample orders typically ship within 7-10 business days after design confirmation.
Yes, we offer complete customization of copper layer patterns to match specific component layouts and electrical connection requirements. Our design team can assist with optimizing your circuit pattern for both electrical performance and thermal management.
Our comprehensive QC includes raw material inspection, in-process controls, and final testing of electrical, thermal, and mechanical properties. Each substrate undergoes visual inspection, dimensional verification, and performance testing to ensure it meets specifications.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate
