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Puwei's Direct Bonded Copper (DBC) Alumina Substrates are the cornerstone of reliable, high-performance electronic packaging. Engineered for critical applications, they provide an unparalleled combination of thermal dissipation and electrical isolation for power devices, integrated circuits, and advanced microelectronics packaging.
As a leading Alumina Ceramic DBC Substrate Manufacturer, we fuse high-purity Al₂O₃ ceramic with oxygen-free copper through a direct bonding process. This creates a robust, monolithic structure ideal for managing the extreme demands of modern high-power microelectronic components.
Our substrates feature a consistent thermal conductivity of approximately 24W/(m·K) and operate reliably across a wide temperature range (-55°C to 850°C). The coefficient of thermal expansion (CTE) is approximately 7.1ppm/K, designed to minimize interfacial stress with silicon and other semiconductor materials in microelectronics assemblies.
Electrical safety is paramount. Our DBC substrates offer a dielectric withstand voltage exceeding 2.5kV and high insulation resistance. The copper-ceramic bond, with a peel strength ≥5.0 N/mm, provides exceptional mechanical durability for rugged applications, including microwave components and automotive systems.
All substrates exhibit excellent chemical stability and superior solderability (wettability ≥95%). They are non-hygroscopic and fully comply with RoHS and REACH environmental standards, making them suitable for global markets.
The direct copper bond creates a highly efficient thermal path, critical for cooling power devices like IGBTs and MOSFETs. Matched CTE extends component lifespan by reducing thermal cycling fatigue.
High-purity alumina provides outstanding dielectric properties, preventing current leakage and ensuring safe operation in high-voltage power electronics, serving as reliable insulation elements.
The metallurgical bond formed at high temperature ensures the copper layer remains intact during assembly, operation, and extreme thermal cycling, providing a stable platform for your circuits.
The oxygen-free copper surface offers excellent solderability and can be easily patterned using standard photolithography and etching processes, enabling custom and high-density circuit designs for high-frequency modules.
Puwei DBC Alumina substrates are essential in industries where thermal and electrical performance cannot be compromised.
The core substrate for Insulated Gate Bipolar Transistors (IGBTs), power converters, and motor drives, where efficient heat dissipation from high-power microelectronic components is critical for reliability.
Used in electric vehicle power control units (PCUs), onboard chargers, and battery management systems that demand unwavering reliability under harsh conditions and wide temperature swings.
Critical for solar inverters, wind power converters, industrial motor drives, and UPS systems, where long-term reliability and efficient thermal management directly impact system efficiency and lifetime.
Provides stable performance for RF circuits and microwave components where consistent dielectric properties and thermal management are required for signal integrity.
Follow these key steps to integrate Puwei DBC substrates into your electronic packaging design:
Our vertically integrated manufacturing process ensures traceability and consistency at every stage:
Our commitment to quality is systemically enforced through our ISO 9001:2015 certified quality management system. All products comply with RoHS and REACH standards, ensuring suitability for global markets.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate
