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Puwei Ceramic specializes in high-performance Direct Bonded Copper (DBC) Substrates, engineered for demanding thick film circuit applications. Our DBC substrates combine exceptional electrical insulation, superior thermal management, and robust mechanical strength, making them ideal for Power Devices, automotive systems, and industrial equipment.
With decades of expertise in Alumina Ceramic Substrates and advanced materials, we deliver reliable solutions that enhance circuit efficiency and longevity. Key advantages include high dielectric strength, low thermal resistance, and customizable dimensions, ensuring compatibility with various electronic designs.
High-quality DBC substrate for reliable performance in thick film circuits
Performance overview of DBC metallization substrates highlighting key parameters
High thermal conductivity efficiently dissipates heat, extending device lifespan in high-power applications. Ideal for Electronic Packaging where thermal performance is critical.
High dielectric strength prevents failures in demanding environments, ensuring reliable operation in high-voltage applications and RF circuits.
Strong peel and bending strength resist physical stresses, making these substrates ideal for automotive and aerospace applications requiring durability.
Unaffected by harsh environmental conditions, reducing maintenance costs and ensuring long-term reliability in industrial settings.
Excellent welding wettability (≥ 95% with Sn/0.7Cu) ensures reliable bonding in multi-step assembly processes for Thick Film Printed Circuit applications.
Tight thickness tolerance control and excellent flatness ensure seamless integration with electronic components and systems.
Review circuit layout and ensure compatibility with substrate dimensions and thermal requirements
Clean substrate surface with lint-free cloth and isopropyl alcohol to remove contaminants
Apply solder paste and use reflow ovens at temperatures up to 260°C for reliable connections
Attach electronic parts onto the copper layer, leveraging high weldability characteristics
Conduct electrical and thermal tests to verify insulation, conductivity, and heat dissipation
Install assembled substrate into end device, ensuring proper fit and thermal management
Used in inverters, converters, and IGBT modules for efficient heat management in high-power applications, including renewable energy systems and industrial drives.
Applied in electric vehicle powertrains, battery management systems, and onboard chargers where reliability under thermal cycling is critical for safety and performance.
Supports high-frequency circuits in machinery controls and automation equipment, reducing downtime with robust performance in demanding industrial environments.
Ideal for solar inverters and wind turbine power conversion systems, enhancing energy conversion efficiency and system reliability.
Integrated into High frequency module and RF communication equipment where stable thermal performance and signal integrity are essential.
Used in high-power LED drivers, power supplies, and advanced consumer devices requiring efficient thermal management and electrical isolation.
Superior thermal management and electrical insulation extend device lifespan and reduce failure rates in critical applications
Excellent thermal conductivity enables higher power densities and improved system performance in compact designs
Reduced energy loss and longer service life lower total ownership costs through improved efficiency and reduced maintenance
Customizable options allow adaptation to specific project requirements, speeding up time-to-market for new products
Compliance with international standards and rigorous quality control minimizes failure risks in critical applications
Comprehensive technical assistance from material selection through application optimization ensures successful integration
Puwei Ceramic adheres to global quality benchmarks, ensuring product safety and reliability for international customers.
Source high-purity ceramics and copper materials, tested for consistency and performance characteristics
Use advanced bonding technology to fuse copper and ceramic layers under controlled temperature and atmosphere conditions
Cut and shape substrates to specified tolerances using CNC equipment for dimensional accuracy
Apply specialized surface finishes and treatments to optimize performance for specific application requirements
Conduct comprehensive electrical, thermal, and mechanical tests to verify all performance parameters
Rigorous final quality control ensures compliance with international standards and customer specifications
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
