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Large-sized Aluminum Nitride Ceramic Substrate

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Aluminum Nitride (AlN) Ceramic Substrate for High-Performance Thick Film Circuits

Puwei's Aluminum Nitride Ceramic Substrates provide the ultimate thermal management foundation for advanced thick film hybrid microcircuits. Engineered to excel in demanding electronic packaging applications, they combine exceptional thermal conductivity with superior electrical insulation, directly addressing heat dissipation and reliability challenges in modern power devices and high-frequency modules. This makes them an indispensable component for next-generation microelectronics.

Puwei AlN Ceramic Substrate for Thick Film Circuit Applications

Core Benefits for Your Circuit Design

  • Maximize Power Density & Reliability: Exceptional heat dissipation (170-230 W/m·K) prevents thermal runaway in high-power microelectronic components, enabling higher power in smaller packages and extending device lifespan.
  • Ensure Signal Integrity: Excellent electrical insulation (Volume Resistivity >10¹⁴ Ω·cm) and stable dielectric properties are critical for microwave applications and RF circuits, minimizing signal loss.
  • Optimize Manufacturing Yield: Customizable surface finishes (as-fired to polished) ensure ideal topography for uniform thick film paste deposition, printing, and sintering, leading to consistent, high-yield production of thick film printed circuits.
  • Enhance Mechanical Robustness: High flexural strength (300-400 MPa) and chemical resistance ensure substrate integrity in harsh operating environments, safeguarding your CERAMIC COMPONENTS.
  • Achieve Design Flexibility: Compatible with all major subsequent metallization processes (DBC, DPC, AMB), allowing seamless integration into complex hybrid micro circuits and integrated circuit packages.
AlN vs. Al2O3 Ceramic Substrate Performance Comparison Chart

Technical Specifications

Material & Electrical Properties

  • Primary Material: High-Purity Aluminum Nitride (AlN) Ceramic.
  • Thermal Conductivity: Standard Grade: ≥175 W/(m·K); High Performance Grade: ≥200 W/(m·K).
  • Dielectric Constant (εr): 8.5 – 9.0 @ 1 MHz.
  • Volume Resistivity: > 10¹⁴ Ω·cm @ 25°C, functioning as an excellent insulation element.
  • Dielectric Strength: 15 – 20 kV/mm.

Mechanical & Physical Properties

  • Flexural Strength: 300 – 400 MPa.
  • Surface Roughness: Customizable (As-fired, Ground, Polished) to suit specific thick film paste requirements.
  • Density: ≥ 3.26 g/cm³.

Standard Manufacturing Parameters

  • Thickness Range: From 0.10mm and above.
  • Typical Thickness: 0.25mm, 0.38mm, 0.50mm, 0.63mm, 1.00mm.
  • Max Panel Size: Up to specifications, supporting panel-level processing.

Integration Process for Thick Film Manufacturing

Follow these key steps to seamlessly integrate Puwei AlN substrates into your microelectronics packaging line:

  1. Substrate Selection & Specification: Define thickness, surface finish (e.g., ground for optimal adhesion), and thermal conductivity grade based on your power dissipation needs.
  2. Pre-Processing Cleaning: Perform a standard clean (e.g., ultrasonic cleaning in solvents) to remove any particulates or organic contaminants, ensuring pristine surface quality.
  3. Thick Film Printing: Apply conductor, resistor, or dielectric pastes using standard screen printing techniques. The tailored AlN surface promotes excellent paste release and definition.
  4. Controlled Firing/Sintering: Fire the printed substrates in a belt furnace following the paste manufacturer's recommended temperature profile to form durable, functional films.
  5. Final Assembly & Packaging: Proceed with component attachment (SMT, die bonding) and final enclosure to complete your Thick Film Hybrid Microcircuit or module.

Targeted Application Scenarios

Automotive & Industrial Power Electronics

Used as a baseplate for IGBT modules, DC-DC converters, and motor drives. AlN's superior heat spreading capability is critical for managing losses from high-current power devices in compact, under-hood environments.

RF Communication & Radar Systems

Ideal substrate for microwave components such as RF power amplifiers, filters, and switches in 5G base stations and radar systems, where stable electrical properties at GHz frequencies are paramount.

Advanced Hybrid Microelectronics

The preferred choice for high-reliability thick film hybrid microcircuits used in aerospace, defense, and medical equipment, where performance cannot be compromised.

High-Performance Sensor Modules

Provides a stable, insulating platform for sensor packaging, particularly for temperature, pressure, or flow sensors operating in demanding conditions, ensuring accuracy and long-term stability.

Puwei AlN Substrate Precision Dimensions and Production Control

Customization & Engineering Support

Puwei provides tailored AlN substrate solutions to meet your exact electronic packaging requirements.

  • Dimensional Precision: Custom sizes, shapes, and thicknesses with tight tolerances. Laser cutting for complex geometries.
  • Surface Finish Optimization: Expert guidance on selecting the ideal surface texture (Ra) for your specific thick film paste system.
  • Material Grade Selection: Choose between cost-effective standard thermal grade or ultra-high conductivity grade for extreme thermal challenges.
  • Pre-Processed Features: Laser-marked identifiers, edge chamfering, and via holes can be provided to streamline your assembly process.
  • Metallization-Ready Surfaces: Substrates can be supplied with surfaces optimally prepared for subsequent DBC, DPC, or direct thick film printing.

Manufacturing Excellence & Quality Assurance

Our vertically integrated manufacturing ensures consistent, high-quality AlN substrates batch after batch.

  1. Powder Synthesis: Controlled synthesis of high-purity AlN powder with proprietary sintering aids.
  2. Precision Forming: Advanced tape casting or dry pressing to create uniform green bodies of precise dimensions.
  3. High-Temperature Sintering: Sintering in controlled atmosphere furnaces at temperatures exceeding 1800°C to achieve near-theoretical density and optimal thermal conductivity.
  4. Precision Machining & Finishing: Lapping, grinding, and polishing to achieve specified thickness, flatness, and surface finish.
  5. Comprehensive Inspection: 100% visual inspection, dimensional verification, and statistical batch testing for key properties like thermal conductivity and dielectric strength, ensuring every substrate meets our stringent standards and your specifications for Bare Ceramic Plates.

Certifications & Compliance

  • Quality Management System: ISO 9001:2015 certified, ensuring a systematic approach to quality control and continuous improvement.
  • Environmental Compliance: Fully compliant with RoHS and REACH directives. Our AlN materials are lead-free and environmentally safe.
  • Traceability & Documentation: Full material and process traceability with comprehensive Certificates of Analysis (CoA) provided with each shipment.
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Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates , Metallized Ceramics, AlN Ceramics Disc, DPC Substrate, DBC Ceramic Substrate

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