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Puwei's Laser Drilling Alumina Ceramic Substrate is a precision-engineered solution for modern high-density electronics. Utilizing advanced UV/picosecond laser micromachining on high-purity Al₂O₃, we create substrates with ultra-precise micro-vias. This technology enables complex 3D circuit routing, addressing critical needs for miniaturization, thermal management, and signal integrity in sophisticated electronic packaging and microelectronics packaging.
Our substrates are manufactured to exacting standards for consistent performance in high-reliability applications.
Our ""cold"" ablation process using UV/picosecond lasers minimizes thermal stress, producing clean, crack-free vias critical for reliability. This offers key advantages over mechanical drilling: no tool wear for consistent quality, ability to create complex shapes and high aspect ratios, and rapid digital prototyping to accelerate development for sensor packaging and new microelectronics designs.
Essential for microwave components (filters, couplers, antennas) in 5G/6G, radar, and satellite comms. Precision vias ensure controlled impedance and low-loss grounding.
Used in 2.5D/3D integrated circuit packaging, SiP, and FOWLP. Provides high-density vertical interconnects in ceramic interposers.
Serves as an insulating substrate with thermal vias for IGBT, SiC, and GaN power devices, managing heat from active dies.
A foundational platform for thick film hybrid microcircuits, enabling interconnections and cavities for mounting CERAMIC CHIPS or MEMS devices in aerospace and medical electronics.
We offer comprehensive co-engineering to tailor substrates to your specific architecture.
Our controlled process ensures precision and reliability.
Our commitment to quality meets global standards.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
