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Puwei Ceramic specializes in manufacturing precision laser scribed alumina substrates engineered for demanding Integrated Circuit applications. Our advanced Alumina Ceramic Substrate (Al2O3) delivers exceptional electrical insulation, superior thermal management, and outstanding dimensional stability, making it the ideal foundation for high-performance Electronic Packaging and Microelectronics Packaging. Utilizing state-of-the-art laser scribing technology, we create precise, micron-level patterns on high-purity Al₂O₃, providing reliable performance in high-frequency and high-temperature environments for advanced Hybrid Microcircuits and sensors.
Material: High-Purity Aluminum Oxide (Al₂O₃), 96% or 99.6% purity. Dielectric Constant: 9-10.5 @ MHz. Volume Resistivity: >10¹⁴ Ω·cm. Dielectric Strength: >10 kV/mm, providing critical isolation for Insulation Elements.
Thermal Conductivity: 29 W/m·K. Max Operating Temperature: 1600°C. Bulk Density: 3.9 g/cm³. Surface Roughness (Ra): 0.03-0.7 μm.
Standard Thickness: 0.635mm. Custom Range: 0.2mm to 2.00mm. Custom Dimensions & Shapes available to meet your specific design, suitable for use as Bare Ceramic Plates or complex substrates.
Precision Laser Scribed Alumina Substrate for High-Density Integrated Circuits
Advanced laser technology enables complex circuit patterns and high-density interconnects with exceptional accuracy, supporting the development of sophisticated Thick Film Hybrid Microcircuits and miniaturized designs.
Excellent dielectric properties with minimal loss ensure stable performance across wide frequency ranges, making it ideal for High-Frequency Modules, RF Circuits, and Microwave Applications.
Efficient heat dissipation (29 W/m·K) protects sensitive components, enhances reliability, and extends the lifespan of Power Devices and High-Power Microelectronic Components.
High hardness, wear resistance, and chemical inertness ensure dimensional stability and long-term performance in harsh industrial, automotive, or outdoor environments.
Essential for Microwave Components, filters, and amplifiers in 5G infrastructure and radar systems, where precise impedance control and low signal loss are critical.
Provides a reliable, insulating base with excellent heat spreading for IGBT modules, inverters, and other Power Devices in automotive and industrial drives.
Ideal substrate for Sensor Packaging and MEMS devices, offering mechanical protection, stability, and optimal electrical performance for sensitive applications.
Used in high-power LED arrays and Optoelectronics Applications for its thermal management capabilities and stable performance.
Manufactured under a controlled, advanced process: 1) High-Purity Powder Selection. 2) Tape Casting for uniform thickness. 3) High-Temperature Sintering. 4) Precision Laser Scribing via computer-controlled systems. 5) Surface Finishing (polishing/cleaning). 6) Optional Metallization. 7) Rigorous Final Inspection including 100% dimensional and electrical verification.
Our manufacturing adheres to stringent international quality standards (ISO 9001:2015 certified processes). Materials and processes comply with global regulations, ensuring acceptance in automotive, medical, aerospace, and industrial supply chains.
We provide fully tailored solutions to meet your exact technical needs:
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc ,
DPC Substrate,
DBC Ceramic Substrate
