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Direct Bonded Copper (DBC) on Aluminum Nitride Substrate: Ultimate Thermal & Electrical Solution

Puwei's Direct Bonded Copper (DBC) Aluminum Nitride Substrates represent a breakthrough in high-performance circuit board technology. Engineered for the most demanding thermal and electrical environments, they combine the exceptional thermal conductivity of AlN ceramic with the superior electrical conductivity and bonding strength of pure copper. This product is specifically designed to address critical challenges in power devices, high-frequency modules, and advanced electronic packaging, offering unmatched reliability and performance.

Why Puwei DBC AlN is the Preferred Choice for Engineers

  • Unrivaled Thermal Management (170-230 W/m·K): Actively pulls heat away from high-power microelectronic components, enabling higher power density and preventing thermal failure in integrated circuits.
  • Exceptional Copper Bond Strength (>8 N/mm): The direct bonding process creates a permanent, metallurgical bond that withstands extreme thermal cycling without delamination, ensuring long-term reliability for hybrid micro circuits.
  • Superior High-Frequency Performance: Low dielectric loss and stable dielectric constant make it ideal for microwave applications and RF circuits, minimizing signal distortion.
  • Matched CTE with Semiconductors: Coefficient of Thermal Expansion closely matches silicon and gallium arsenide, reducing stress and increasing the lifespan of mounted chips in sensor packaging and microelectronics packaging.
  • Complete Design & Customization Freedom: From custom circuit patterns to specific thicknesses, we provide tailored solutions for thick film hybrid microcircuits and complex thermoelectric cooling assemblies.
DBC Ceramic Substrate Performance Specifications and Comparison Chart

Technical Specifications

Puwei DBC AlN Substrates are manufactured to precise specifications to ensure consistent, high-performance results in your application.

Base Material & Key Properties

  • Substrate Material: High-Purity Aluminum Nitride (AlN) Ceramic
  • Thermal Conductivity: 170 - 230 W/(m·K)
  • Dielectric Constant (εr): 8.5 - 9.0 @ 1 MHz
  • Breakdown Voltage: > 15 kV/mm
  • Volume Resistivity: > 10¹⁴ Ω·cm
  • Coefficient of Thermal Expansion (CTE): 4.5 × 10⁻⁶/°C (RT-400°C)
  • Surface Roughness (Ra): ≤ 0.4 μm (Polished)

Copper Layer & Construction

  • Copper Type: ≥99.9% Oxygen-Free High Conductivity Copper
  • Copper Thickness: 0.1 mm - 0.6 mm (Standard), Customizable
  • Bond Strength (Peel Test): > 8 N/mm
  • Standard Substrate Thickness: 0.25 mm - 1.5 mm
  • Max Standard Panel Size: 150 mm × 150 mm
  • Operating Temperature Range: -55°C to 850°C

Technology & Competitive Advantages

The DBC Process: Creating an Unbreakable Bond

Unlike plated or printed methods, the Direct Bonding process involves a high-temperature reaction between copper and AlN in a controlled atmosphere. This forms a robust copper-oxygen eutectic bond that is integral to the ceramic, resulting in exceptional thermal transfer and mechanical stability for bare ceramic plates used in final assemblies.

Key Performance Advantages Over Alternatives

  • vs. Alumina (Al2O3) DBC: 8-10 times higher thermal conductivity for vastly superior heat dissipation in power devices.
  • vs. Insulated Metal Substrates (IMS): Higher operating temperature, better dielectric strength, and superior performance in high-frequency modules.
  • vs. Direct Plated Copper (DPC): Thicker copper layers for higher current carrying capacity and stronger bond strength for reliable thermoelectric modules.
  • vs. Beryllium Oxide (BeO): Offers comparable thermal performance without toxicity concerns, making it a safer, modern alternative.

Primary Application Scenarios

1. Power Electronics & Converters

The cornerstone of modern power devices like IGBT modules, SiC/GaN power converters, and motor drives. DBC AlN effectively manages heat from high-current switches, enabling smaller, more efficient, and more reliable systems for electric vehicles and industrial automation.

2. RF & Microwave Communications

Essential for microwave components, RF power amplifiers (LDMOS, GaN), and high-frequency modules in 5G infrastructure, radar, and satellite communications. Its stable electrical properties ensure minimal signal loss and distortion.

3. Advanced Microelectronics & Optoelectronics Packaging

Provides a high-performance platform for optoelectronics applications (laser diodes, high-power LEDs), sensor packaging, and complex microelectronics packaging. It serves as a critical insulation element and heat spreader in multi-chip modules.

4. Specialized Thermal Management Systems

Used in thermoelectric cooling assemblies (Peltier devices) and power generation modules, where efficient heat transfer across the junction is critical for performance and longevity.

Customization & OEM/ODM Engineering Services

Puwei specializes in co-engineering DBC AlN substrates to meet your exact electrical, thermal, and mechanical requirements. We support prototypes to high-volume production.

Customizable Parameters

  • Circuit Pattern: Custom photolithography and etching for precise traces, pads, and geometries.
  • Dimensions & Shape: Non-standard sizes, contours, and cut-outs available.
  • Layer Structure: Single-sided, double-sided, or multi-layer DBC constructions.
  • Surface Finish: Immersion Gold (ENIG), Silver, Nickel, or bare copper for soldering/brazing.
  • Integration: Can be combined with other Puwei ceramic components like precision-drilled AlN discs or alumina ceramic substrates for hybrid solutions.

Manufacturing Process & Quality Assurance

Our vertically controlled manufacturing ensures every substrate meets the highest standards of quality and consistency.

  1. Material Sourcing & Inspection: Certification of high-purity AlN powder and oxygen-free copper foil.
  2. Ceramic Substrate Fabrication: Precision forming and high-temperature sintering to achieve optimal density and properties.
  3. Direct Bonding: Controlled atmospheric furnace bonding to create the permanent copper-ceramic interface.
  4. Precision Patterning: Advanced photolithography and etching to define circuit patterns for thick film printed circuits.
  5. Rigorous Final Inspection: 100% electrical testing, bond strength (peel test), dimensional verification, and visual inspection under microscope.

Certifications, Compliance & Reliability

Puwei Ceramic is committed to global quality and environmental standards, providing you with a dependable and compliant component.

  • Quality Management: ISO 9001:2015 Certified Manufacturing.
  • Environmental Compliance: Fully compliant with RoHS and REACH directives.
  • Material Safety: Non-toxic and safe alternative to BeO ceramics.
  • Reliability Testing: Standard thermal cycling, humidity, and high-voltage testing protocols are available to validate performance for your specific integrated circuit application.
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Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics, AlN Ceramics Disc, DPC Substrate , DBC Ceramic Substrate

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