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Puwei's Double-Sided Direct Bonded Copper (DBC) Substrate is engineered for extreme reliability in advanced power and high-frequency electronics. By metallurgically bonding high-purity copper foil onto both sides of a high-thermal-conductivity ceramic core, we create the ultimate solution for electronic packaging that demands superior heat dissipation, exceptional electrical insulation, and robust mechanical stability. It is the substrate of choice for next-generation power devices and high-power microelectronic components.
Advanced Double-Sided DBC Substrate enabling high-density circuit design and efficient thermal management.
Detailed performance data of our DBC substrates, showcasing material properties and advantages.
Our DBC substrates solve critical challenges in microelectronics packaging and sensor packaging:
Puwei DBC substrates are critical in industries where performance cannot be compromised:
IGBT and power module substrates for traction inverters, OBC, and DC-DC converters, enabling higher power density and reliability.
Solar inverter power stacks, wind turbine converters, and motor drives, where long-term reliability under thermal cycling is paramount.
High-power RF packages, 5G infrastructure, and radar systems requiring low loss and stable dielectric properties for microwave applications.
Foundational substrate for optoelectronics applications, laser diodes, and specialized thick film hybrid microcircuits.
Our state-of-the-art DBC process ensures every substrate meets the highest standards:
Quality is assured by our ISO 9001:2015 certified system, with full compliance to RoHS and REACH.
We partner with customers to develop tailored solutions:
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