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Puwei Ceramic's Double-sided Copper Clad Laminate DBC Substrate represents the pinnacle of electronic packaging technology. This high-performance substrate combines exceptional thermal management with superior electrical insulation, making it ideal for demanding applications in power electronics, automotive systems, and high-frequency circuits.
Advanced Double-sided DBC Substrate - Optimized for High-Performance Electronic Packaging
DBC Substrate Performance Specifications - Engineered for Reliability and Efficiency
The ceramic substrate's high thermal conductivity efficiently transfers heat from components to the entire substrate surface. Double-sided copper cladding further enhances heat dissipation, significantly reducing operating temperatures of electronic components. This thermal efficiency directly improves device reliability and extends service life in high-power microelectronic components and power devices.
Ceramic materials provide outstanding insulating properties, effectively isolating different circuit layers and preventing short circuits and signal interference. This ensures stable operation of electronic equipment even in demanding electrical environments, making it ideal for electronic packaging and microelectronics packaging applications.
The ceramic substrate imparts exceptional hardness and mechanical strength, enabling the substrate to withstand external impacts, vibrations, and mechanical stress. It maintains dimensional stability across various operating conditions without warping or deformation, ensuring reliable performance in sensor packaging and precision applications.
The copper foil surfaces offer excellent solderability, facilitating reliable connections with chips and electronic components. This ensures low-resistance electrical connections and efficient signal transmission, comparable to premium Aluminum Nitride Substrates for high-frequency applications.
Review your circuit layout and thermal requirements. Ensure compatibility with substrate dimensions, copper thickness, and material selection based on application needs for integrated circuit and microelectronics applications.
Thoroughly clean the copper surfaces using appropriate solvents to remove contaminants and oxidation, ensuring optimal adhesion and electrical performance.
Apply photoresist and use photolithography to create your circuit pattern on both sides, leveraging the double-sided design for complex hybrid micro circuits and thick film hybrid microcircuits.
Use chemical etching to remove unwanted copper, creating the desired circuit traces with high precision and accuracy.
Mount electronic components using soldering techniques suitable for the copper surface, ensuring reliable connections for microwave components and high-frequency modules.
Ensure proper heat sinking if required, leveraging the substrate's excellent thermal conductivity for optimal performance in microwave applications and optoelectronics applications.
Perform comprehensive electrical and thermal testing to verify performance under operating conditions, ensuring reliability and compliance with specifications.
High-purity ceramic materials are formed and sintered to achieve optimal density and properties, ensuring consistent thermal and electrical performance.
Oxygen-free copper foil undergoes precise surface preparation and oxidation control to ensure optimal bonding strength and electrical conductivity.
Copper and ceramic are bonded under high temperature and controlled atmosphere using advanced DBC technology, creating a strong metallurgical bond without intermediate layers.
Substrates are cut to exact dimensions using laser or diamond saw cutting, achieving tight tolerances and smooth edges for optimal performance.
Each substrate undergoes comprehensive testing for electrical, thermal, and mechanical properties, ensuring compliance with industry standards and customer specifications.
Optional surface treatments and protective packaging ensure optimal solderability and prevent contamination during shipping and storage.
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