Product
Product
Supplier
Search
Get Quote
730 people are quoting
Puwei Ceramic's AlN Coated Copper DBC Substrate represents a breakthrough in thermoelectric module technology, combining superior thermal management with exceptional electrical performance. This advanced substrate utilizes high-purity aluminum nitride ceramic with direct bonded copper layers to deliver unmatched reliability in demanding thermal applications. As leading specialists in Aluminum Nitride Substrates and DBC Ceramic Substrate manufacturing, we provide solutions that significantly enhance thermoelectric conversion efficiency and device longevity.
High-performance AlN coated copper DBC substrate optimized for thermoelectric module applications
Specialized DBC substrate design for thermoelectric cooling (TEC) systems
Comprehensive performance specifications for DBC metallization substrates
In thermoelectric modules utilizing our AlN Coated Copper DBC Substrate, the Peltier effect creates precise temperature control when electric current passes through semiconductor junctions. The substrate's copper layers efficiently conduct both electricity and heat, facilitating rapid heat transfer between the hot and cold sides of thermoelectric elements. This enables highly efficient cooling or heating functions while maintaining electrical isolation through the AlN ceramic layer.
The direct bonded copper technology ensures minimal thermal resistance at the interface, maximizing the thermoelectric module's coefficient of performance (COP). This makes our substrates ideal for applications requiring precise temperature management in Thermoelectric Semiconductor Module Plates and advanced power electronics.
The aluminum nitride ceramic core provides thermal conductivity of 170-200 W/(m·K), significantly higher than conventional alumina substrates. This enables rapid heat transfer from thermoelectric elements, improving both cooling efficiency and power generation performance in Thermoelectric Modules for Electric Power Generation.
With dielectric strength exceeding 2.5 kV, the AlN layer provides reliable electrical isolation between circuit elements. This prevents current leakage and short circuits, ensuring safe operation in high-voltage thermoelectric applications and protecting sensitive Integrated Circuits.
Our advanced DBC technology creates an exceptionally strong bond between copper and AlN ceramic, with peel strength ≥5.0 N/mm. This mechanical stability withstands thermal cycling stresses and mechanical vibration, preventing delamination and ensuring long-term reliability in demanding environments for Power Devices.
Both aluminum nitride and copper demonstrate outstanding resistance to chemical corrosion, maintaining performance in harsh operating conditions. The substrate remains stable when exposed to moisture, oxidation, and various chemical environments, extending service life in challenging Microelectronics Packaging applications.
Analyze thermal and electrical requirements. Ensure substrate dimensions match your thermoelectric element layout and heat sink configuration for optimal Electronic Packaging.
Clean copper surfaces with isopropyl alcohol to remove contaminants. Apply flux if required for soldering operations to ensure proper bonding.
Use solder paste or conductive epoxy to mount P-type and N-type thermoelectric elements onto the copper pads with precise alignment.
Connect thermoelectric elements in series using wire bonding or soldering techniques appropriate for the specific application requirements.
Attach appropriate heat sinks to both sides of the assembly, ensuring good thermal contact through thermal interface materials for maximum heat dissipation.
Verify thermoelectric performance under operating conditions, monitoring temperature differentials and electrical parameters to ensure specification compliance.
Install the completed thermoelectric module into the final application, ensuring proper mechanical support and environmental protection for long-term reliability.
Ideal for precision cooling in medical equipment, laboratory instruments, and portable refrigerators. The substrates provide efficient heat pumping for temperature-sensitive applications where reliability and precise temperature control are critical in Sensor Packaging.
Essential for waste heat recovery in automotive exhaust systems and industrial processes. The substrates efficiently convert thermal energy into electrical power through the Seebeck effect, improving overall energy utilization efficiency for sustainable power solutions.
Critical for temperature stabilization in laser diodes and high-power LEDs. The substrates maintain optimal operating temperatures, enhancing device performance and extending service life in demanding Optoelectronics Applications.
Used in advanced seat heating/cooling systems and battery thermal management for electric vehicles. The substrates provide reliable thermal control in automotive environments where vibration and temperature extremes are common.
Applied in thermal management for avionics and satellite systems where weight savings, reliability, and performance under extreme conditions are paramount requirements for mission-critical operations.
High-purity aluminum nitride powder and oxygen-free copper are selected and tested for quality compliance with international standards.
AlN ceramic is pressed and sintered under controlled conditions to achieve optimal density and thermal properties for consistent performance.
Copper foil and ceramic surfaces are meticulously cleaned and prepared for bonding to ensure perfect interface quality.
Copper and AlN ceramic are bonded using DBC technology under high temperature and controlled atmosphere for maximum bond strength.
Substrates are cut to exact specifications using laser or diamond saw cutting with micron-level accuracy.
Each substrate undergoes comprehensive testing for thermal, electrical, and mechanical properties to guarantee performance.
Substrates are carefully packaged in anti-static materials with moisture protection for safe shipping and storage.
Puwei Ceramic maintains the highest quality standards through comprehensive international certifications for global market acceptance:
We offer comprehensive customization services to meet your specific thermoelectric requirements with flexible manufacturing capabilities:
Our specialization in large dimension ceramic substrates, including formats up to 240mm × 280mm × 1mm and 95mm × 400mm × 1mm, makes us preferred suppliers for applications requiring substantial substrate areas for complex thermoelectric systems and Hybrid Micro Circuits.
If you are interested in the product, contact 2bvideo.com for more information for more information
The information of 2bvideo.com limited shown above is provided by the user or collected on the network. Video 2B does not guarantee the authenticity,accuracy and legitimacy of 2bvideo.com limited information. Video 2B does not involve legal relationships and disputes between users arising from transactions other than secured transactions on this website. Disputes shall be settled by you through negotiation. If you are the person in charge or relevant employee of this enterprise, if you find that the enterprise information is incorrect or want to manage thiscompany, please contact us jacklee1558@gmail.com, after you claim the enterprise, you can obtain management permission, publish supplyand demand information, bring consulting orders, and remove page advertisements.
Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate
