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Puwei's Electronic Metallized Ceramic Substrates are engineered to solve the core challenges of modern electronics: heat dissipation, electrical isolation, and mechanical reliability. By seamlessly integrating high-performance ceramics (Alumina, AlN, BeO) with robust Mo/Mn or Tungsten (W) metallization, we create a versatile platform that serves as the structural and functional backbone for your most demanding applications. This technology is fundamental to advanced Electronic Packaging and Microelectronics Packaging, providing the essential link between sensitive semiconductor dies and the larger system.
High-precision metallized ceramic substrate enabling reliable component integration and thermal management.
We offer a range of ceramic bases to match your specific thermal, electrical, and cost requirements. Options include various grades of Alumina Ceramic Substrate (Al2O3) (94% to 99.6% purity), high thermal conductivity Aluminum Nitride (AlN, 170-230 W/m·K), and premium-performance Beryllium Oxide (BeO). We also develop custom formulations for specialized needs.
Our core expertise lies in Mo/Mn and Tungsten (W) paste metallization, fired to create a strong, hermetic bond with the ceramic. This provides excellent brazing compatibility, high adhesion strength, and a superior surface for subsequent plating or component attachment. Key characteristics include high dielectric strength, matched Coefficient of Thermal Expansion (CTE) to semiconductors, and outstanding flexural strength.
Unlike simple circuit boards, our metallized substrates are integral to module performance. The ceramic provides electrical isolation and structural support, while the patterned metal layer facilitates electrical interconnection and acts as a primary heat conduction path. This is especially critical for insulation elements in high-voltage applications and thermal management in thermoelectric cooling assemblies.
The substrate of choice for IGBT modules, SiC/GaN power devices, and EV traction inverters. Provides critical insulation and heat spreading for high-current applications.
Enables low-loss performance in microwave components, power amplifiers, and filters for 5G infrastructure, radar, and satellite systems, where signal integrity is paramount.
Used in high-power LED packaging, laser diode mounts, and sensor packaging, where stable thermal performance ensures consistent output and longevity.
Provides hermetic sealing and unmatched reliability for critical avionics, radar systems, and microelectronics in extreme environments.
Found in motor drives, solar inverters, and industrial controls, offering durability and performance in harsh operational conditions.
Puwei Ceramic operates under an ISO 9001:2015 certified quality management system. All materials and processes comply with RoHS and REACH directives. We maintain full material traceability and employ industry-standard testing protocols (adhesion pull tests, thermal cycling, electrical breakdown) to ensure every substrate, including Bare Ceramic Plates destined for assembly, meets the highest standards of performance and reliability.
We are a solutions partner, not just a supplier. Our comprehensive customization capabilities include:
Our production is a vertically controlled sequence: from stringent QC of incoming ceramic powder, through precision sintering and shaping, to the critical metallization steps where Mo/Mn or W paste is screen-printed and fired in controlled atmosphere furnaces. Each batch undergoes 100% inspection for dimensional accuracy, adhesion strength, and electrical properties. This rigorous process ensures we deliver a consistently reliable foundation for your most critical electronic assemblies.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate
