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Aluminum Nitride Ceramic DBC Substrate

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AlN Coated Copper DBC Substrate for High-Performance Thermoelectric Modules

Product Overview

Puwei's AlN Coated Copper Direct Bonded Copper (DBC) Substrate is a premium engineered solution designed to revolutionize thermal management in advanced thermoelectric modules. By integrating high-purity Aluminum Nitride (AlN) ceramic with robust copper layers, this substrate delivers unparalleled heat dissipation and electrical isolation, making it a critical component for demanding applications in Power Devices, Microelectronics Packaging, and high-efficiency Thermoelectric Semiconductor Module Plates. It is the ideal foundation for applications leveraging the Peltier effect for precise cooling or power generation.

Core Benefits & Value Proposition

Why Choose Our AlN DBC Substrate?

  • Maximized Module Efficiency: Exceptional thermal conductivity (170-200 W/m·K) ensures rapid heat transfer, significantly improving the Coefficient of Performance (COP) of your thermoelectric systems.
  • Unmatched Reliability: Superior peel strength (≥5.0 N/mm) and a wide operational temperature range (-50°C to +350°C) guarantee long-term durability under thermal cycling and mechanical stress.
  • Design Freedom for Innovation: Supports custom sizes, complex circuit patterning, and large-format dimensions, enabling next-generation designs in Hybrid Micro Circuits and RF Circuits.
  • Risk Mitigation & Quality Assurance: Manufactured under ISO 9001 standards with full RoHS/REACH compliance, ensuring global acceptance and consistent performance for critical Integrated Circuits and Sensor Packaging.

Product Visual Documentation

Technical Specifications

Material Composition

  • Ceramic Core: High-Purity AlN (Aluminum Nitride)
  • Conductor: Oxygen-Free High Conductivity Copper
  • Bonding Technology: Direct Bonded Copper (DBC)

Key Performance Metrics

  • Thermal Conductivity: 170 - 200 W/(m·K)
  • Dielectric Strength: > 2.5 kV
  • Peel Strength: ≥ 5.0 N/mm
  • CTE: 4.5 - 5.5 ppm/K
  • Operating Temperature: -50°C to +350°C

Product Features & Working Principle

This substrate functions as the backbone of a thermoelectric module. When current flows through the semiconductor elements (utilizing the Peltier effect), heat is pumped from one side to the other. Our substrate's copper layers efficiently distribute current and transfer heat, while the AlN ceramic provides essential electrical isolation and minimal thermal resistance, maximizing energy conversion efficiency. This principle is crucial for Thermoelectric Modules for Electric Power Generation and precision cooling systems.

Distinguishing Advantages

  • Superior Thermal vs. Alumina: AlN offers 5-7x higher thermal conductivity than standard Al2O3, drastically reducing hot spots.
  • Robust Interface: The DBC process creates a metallurgical bond, preventing delamination in high-vibration environments like automotive electronics.
  • High-Frequency Suitability: Excellent dielectric properties make it suitable for High-Frequency Modules and Microwave Applications.
  • Chemical Inertness: Resists oxidation and corrosion, ensuring stability in harsh environments for Optoelectronics Applications.

Integration Guide: Key Steps

  1. Design & Layout: Finalize substrate dimensions and copper pattern to match your thermoelectric element array and heat sink.
  2. Surface Preparation: Clean copper pads with IPA to ensure optimal solderability for component attachment.
  3. Element Attachment: Precisely place P/N thermoelectric pellets onto pads using solder paste or epoxy.
  4. Interconnection: Form electrical series connections between elements via wire bonding or soldering.
  5. Thermal Interface: Apply TIM and attach heat sinks to both sides to complete the thermal path.
  6. Validation: Test for thermal delta, electrical resistance, and insulation integrity before system integration.

Primary Application Scenarios

Precision Temperature Control

Medical diagnostic equipment, laboratory instruments, and CCD cooling where stability is critical for Sensor Packaging.

Energy Harvesting & Power Gen

Converting waste heat from automotive exhaust or industrial processes into usable electricity.

Advanced Electronics Thermal Management

Thermal stabilization for high-power laser diodes, RF amplifiers (Microwave Components), and High-Power Microelectronic Components.

Automotive & Aerospace

Battery thermal management in EVs, seat climate control, and avionics cooling requiring extreme reliability.

Our Commitment to Quality

Every Puwei AlN DBC Substrate is produced under a stringent quality management system (ISO 9001) and complies with RoHS/REACH directives. Our vertical integration from material selection to precision machining ensures traceability and consistency, providing you with a reliable Bare Ceramic Plate ready for high-yield assembly.

Customization & OEM/ODM Services

We specialize in tailoring solutions to your exact needs. Our capabilities include:

  • Custom Dimensions & Layouts: From miniature to large formats (up to 240mm x 280mm).
  • Flexible Metallization: Custom copper patterning, various surface finishes (Ni, Au, Ag).
  • Material Expertise: AlN for peak performance or Al2O3 for cost-optimized designs.
  • Full Technical Support: Collaboration from design phase to volume production for your Thick Film Hybrid Microcircuits or Thermoelectric Cooling Assemblies.
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Address: Xian, China


Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics, AlN Ceramics Disc, DPC Substrate , DBC Ceramic Substrate

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