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Puwei Ceramic's Silicon Nitride Ceramic AMB Copper-clad Substrate represents the pinnacle of advanced ceramic substrate technology for demanding power electronics applications. Utilizing Active Metal Brazing (AMB) technology, we bond high-conductivity copper to premium silicon nitride (Si3N4) ceramic, delivering exceptional performance in high-power, high-reliability applications.
As the ideal foundation for next-generation silicon carbide (SiC) power modules, our Si3N4 Ceramic AMB Substrate offers superior thermal management and mechanical robustness. While we offer comprehensive solutions including Alumina Ceramic Substrates and Aluminum Nitride Substrates, silicon nitride excels in fracture toughness and thermal shock resistance for the most demanding Electronic Packaging applications.
AMB Silicon Nitride Ceramic Substrate for advanced SiC power applications
Precision copper patterning on high-strength silicon nitride ceramic
Technical performance comparison showing silicon nitride advantages
Outperforms Alumina Ceramic Substrates and Aluminum Nitride Ceramics in applications with rapid temperature cycling. Silicon nitride's unique microstructure prevents crack propagation, making it ideal for harsh thermal environments in Power Devices and automotive applications.
With thermal expansion coefficient of 3.2 ppm/°C closely matching SiC semiconductors (3.7 ppm/°C), our substrates minimize thermal stress at interfaces. This compatibility extends product lifetime and enhances reliability in high-power Integrated Circuits and Microelectronics Packaging.
Flexural strength exceeding 800 MPa provides 3-5x greater mechanical robustness compared to alumina substrates. This superior strength withstands mechanical stress, vibration, and thermal cycling in demanding applications such as electric vehicle power trains and industrial motor drives.
Active Metal Brazing creates chemical bonds rather than mechanical ones, resulting in superior thermal cycling performance and long-term reliability. This advanced bonding technology outperforms traditional DBC Ceramic Substrate methods for Metallized Ceramics applications.
The Active Metal Brazing process utilizes reactive braze alloys containing active elements to create strong chemical bonds between silicon nitride ceramic and copper layers. This advanced manufacturing technology ensures superior thermal cycling performance, mechanical reliability, and long-term stability compared to conventional bonding methods, making it ideal for demanding High-Power Microelectronic Components.
Assess if silicon nitride is needed versus alternatives based on thermal, mechanical, and reliability requirements for your specific Electronic Packaging application.
Utilize material property data for performance modeling and thermal management optimization in your power electronics design.
Provide circuit layout and specifications, leveraging our expertise in Metallized Ceramics for optimal performance.
Test samples for validation under actual operating conditions to verify performance and reliability.
Adapt assembly processes for silicon nitride characteristics, ensuring proper thermal management and mechanical integrity.
Perform comprehensive testing and qualification to meet industry standards and application requirements.
Scale to mass production with our rigorous quality assurance systems and manufacturing expertise.
Inverters, DC-DC converters, and onboard chargers requiring robust thermal management and mechanical reliability under vibration and thermal cycling conditions. Ideal for next-generation Power Devices in automotive applications.
Solar and wind power converters demanding long-term reliability and excellent thermal shock resistance in outdoor environments with wide temperature variations.
High-power drives for manufacturing equipment requiring exceptional mechanical strength and thermal cycling performance in harsh industrial environments.
Power systems for trains and infrastructure where reliability under vibration, mechanical stress, and temperature extremes is paramount for safety and performance.
Critical power electronics systems requiring the highest levels of reliability, mechanical robustness, and performance under extreme conditions for mission-critical operations.
Selection of high-purity silicon nitride powder with verified thermal and mechanical properties for consistent performance.
Precise shaping of ceramic green bodies using advanced forming techniques to achieve required dimensions and density.
High-temperature sintering under controlled atmosphere to develop the optimal microstructure for strength and thermal properties.
Grinding and polishing to achieve exact thickness, flatness, and surface quality specifications.
Meticulous cleaning and surface activation to ensure perfect bonding interface for AMB process.
High-temperature vacuum brazing with active metal alloys to create strong metallurgical bonds between ceramic and copper.
Photolithography and etching for precise copper circuit patterns with fine feature resolution.
Application of protective and solderable finishes to ensure reliable assembly and long-term performance.
100% inspection and performance testing to verify thermal, electrical, and mechanical properties.
Careful packaging to prevent damage during shipping and ensure product integrity upon arrival.
Puwei Ceramic maintains the highest quality standards through comprehensive international certifications ensuring reliable, professional-grade components for global markets:
We offer comprehensive customization services to meet your specific technical requirements and application challenges in advanced Microelectronics Packaging and power electronics.
Our expertise in Metallized Ceramics enables us to provide innovative solutions that perfectly match your technical requirements and cost targets for advanced Electronic Packaging applications. We specialize in creating optimized silicon nitride substrates for the most demanding environments where thermal management, mechanical reliability, and long-term performance are critical.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate
