Large-sized Silicon Nitride AMB Substrate

Large-sized Silicon Nitride AMB Substrate

7 month ago

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Shaanxi Puwei Electronic Technology Co., Ltd

 11 month year

Product details

Silicon Nitride Ceramic AMB Copper-clad Substrate

Product Overview

Puwei Ceramic's Silicon Nitride Ceramic AMB Copper-clad Substrate represents the pinnacle of ceramic substrate technology for demanding power electronics applications. Engineered specifically for high power density, exceptional reliability, and extended service life requirements, this substrate utilizes advanced Active Metal Brazing (AMB) technology to bond copper layers to high-performance silicon nitride (Si3N4) ceramic.

As an ideal solution for next-generation silicon carbide (SiC) power modules, our Si3N4 AMB substrates offer superior thermal and mechanical properties compared to traditional materials. While we also produce Aluminum Nitride Substrates and Alumina Ceramic Substrates, silicon nitride stands out for applications requiring the ultimate in fracture toughness and thermal shock resistance.

Product Images

High-performance AMB Silicon Nitride Ceramic Substrate for power modules

AMB Silicon Nitride Ceramic Substrate - Optimized for SiC power applications

Detailed view of Silicon Nitride AMB substrate copper patterning

Precision copper patterning on silicon nitride ceramic base

Technical properties and specifications of Si3N4 AMB substrates

Technical performance comparison showcasing silicon nitride advantages

Technical Specifications

Our Silicon Nitride AMB substrates are engineered to meet the most demanding requirements in power electronics packaging.

Material Properties

Base Material: High-purity Silicon Nitride (Si3N4) Ceramic
Cladding Material: Oxygen-free high conductivity copper
Thermal Conductivity: 80-90 W/m·K (superior mechanical properties compensate for slightly lower than AlN)
Flexural Strength: >800 MPa (exceptional fracture toughness)
Thermal Expansion Coefficient: 3.2 ppm/°C (closely matched to SiC chips: 3.7 ppm/°C)
Dielectric Strength: >15 kV/mm
Peel Strength: >80 N/cm (excellent bond reliability)

Standard Dimensions & Tolerances

Ceramic Thickness: 0.25mm to 1.0mm (standard), custom 0.2mm-2.0mm available
Copper Thickness: 0.1mm to 0.8mm (thicker than typical DBC processes)
Standard Size Tolerance: ±0.1mm to ±0.5mm depending on dimensions
Surface Flatness: <10μm/cm

Product Features & Advantages

Silicon Nitride AMB substrates offer unique advantages that make them the preferred choice for the most demanding power electronics applications.

Key Technical Advantages

Exceptional Thermal Shock Resistance: Silicon nitride's unique microstructure provides unparalleled resistance to thermal cycling, far exceeding the performance of Alumina Ceramic Substrates and even Aluminum Nitride Ceramics in fracture toughness.
Optimal CTE Matching with SiC: The thermal expansion coefficient (3.2 ppm/°C) closely matches that of silicon carbide chips (3.7 ppm/°C), minimizing thermal stress and enhancing reliability in SiC power modules.
Superior Mechanical Strength: With flexural strength exceeding 800 MPa, Si3N4 substrates can withstand significant mechanical stress and vibration, making them ideal for automotive and industrial applications.
High Reliability Bonding: The AMB process creates a metallurgical bond that withstands extreme temperature cycling and offers higher peel strength than alternative bonding methods used in DBC Ceramic Substrate manufacturing.
Thick Copper Capability: AMB technology supports thicker copper layers (up to 0.8mm) compared to other processes, enabling higher current carrying capacity.

How AMB Technology Enhances Silicon Nitride Performance

The Active Metal Brazing process involves using reactive braze alloys containing elements like titanium that actively react with the ceramic surface, creating a strong chemical bond rather than just a mechanical one. This results in superior thermal cycling performance and long-term reliability.

How to Implement Si3N4 AMB Substrates in Your Design

Follow these steps for successful integration of our silicon nitride substrates into your power modules.

Application Analysis: Determine if your application requires the exceptional mechanical strength and thermal cycling performance of silicon nitride versus other options like DPC Ceramic Substrate or standard DBC.
Thermal and Mechanical Simulation: Utilize material property data to simulate thermal performance and mechanical stress under operating conditions.
Substrate Design: Provide your circuit layout, copper thickness requirements, and any special features needed for your application.
Prototype Fabrication: We manufacture prototype samples for your validation testing, including power cycling and thermal shock tests.
Assembly Process Development: Optimize your die-attach and interconnection processes for the specific characteristics of silicon nitride.
Quality Validation: Perform comprehensive testing including thermal cycling, power cycling, and mechanical stress tests.
Volume Production Ramp-up: Scale to production volumes with our quality assurance systems ensuring consistency.

Application Scenarios

Silicon Nitride AMB substrates excel in applications where reliability under extreme conditions is paramount.

Primary Applications

Electric Vehicle Power Trains: Main inverters, DC-DC converters, and onboard chargers where vibration and thermal cycling demands exceed the capabilities of other substrate materials.
Renewable Energy Systems: Solar inverters and wind power converters requiring long-term reliability in outdoor environments with wide temperature fluctuations.
Industrial Motor Drives: High-power motor drives for manufacturing equipment where mechanical vibration and thermal cycling could compromise less robust substrates.
Rail Transportation: Power conversion systems for trains and rail infrastructure requiring certification for safety-critical applications.
Aerospace and Defense: Power electronics for avionics and military systems where failure is not an option.

The exceptional fracture toughness of silicon nitride makes it particularly suitable for applications where mechanical shock or vibration could cause catastrophic failure in more brittle ceramic materials.

Benefits for Customers

Choosing Puwei's Silicon Nitride AMB substrates delivers significant value throughout your product lifecycle.

Enhanced Product Reliability: Dramatically reduce field failures with substrates proven to withstand the most demanding thermal and mechanical stress conditions.
Longer Product Lifetime: Extend the operational life of your power modules, particularly important for applications with high replacement costs or safety implications.
Reduced System Size and Weight: The high mechanical strength of Si3N4 allows for thinner substrates and more compact module designs compared to Alumina Ceramic Robotic Arm applications where strength is critical.
Lower Total Cost of Ownership: While initial costs may be higher, the extended lifetime and reduced failure rates typically result in significant savings over the product lifecycle.
Competitive Advantage: Differentiate your products with technology that enables higher performance and reliability than competitors using conventional substrates.

Certifications and Compliance

Puwei Ceramic maintains rigorous quality standards and holds relevant certifications for our manufacturing processes and products.

ISO 9001:2015 Quality Management System certified manufacturing facilities
IATF 16949:2016 compliance for automotive applications
Ceramic Heat Sink Surface Copyright Certificate protecting our innovative designs
Copyright Certificate for Ceramic Material Production System
UL 94 V-0 flammability rating for safety-critical applications
RoHS and REACH compliance for international markets

Our commitment to quality ensures that every substrate meets the highest standards for performance and reliability.

Customization Options (OEM & ODM Services)

We understand that standard solutions rarely meet the unique requirements of advanced power electronics. Puwei Ceramic offers comprehensive customization services.

Customization Capabilities

Size and Geometry: We specialize in large-format substrates up to 240mm × 280mm and can produce virtually any shape based on your specifications.
Thickness Variations: Ceramic thickness from 0.2mm to 2.00mm, with copper thickness optimized for your current requirements.
Complex Circuit Patterns: Sophisticated copper patterning with fine features to meet your electrical design needs.
Special Surface Finishes: Various metallization options including Ni/Au, Ni/Pd, Ag, and Sn plating for optimal solderability and wire bonding.
Application-Specific Optimization: Tailored material formulations and processing parameters for your specific operating environment.

Our expertise in Metallized Ceramics enables us to provide solutions that perfectly match your technical requirements and cost targets.

Production Process

Our manufacturing process combines advanced technology with rigorous quality control to ensure consistent performance.

Raw Material Preparation: High-purity silicon nitride powder with precisely controlled additives for optimal sintering.
Forming Process: Tape casting or dry pressing to create green sheets with uniform density and thickness.
Sintering: Pressureless sintering at high temperatures to achieve full density and the desired microstructure.
Precision Machining: Grinding and polishing to achieve exact dimensions and surface finish requirements.
Surface Preparation: Cleaning and surface activation to ensure optimal bonding in the AMB process.
Active Metal Brazing: High-temperature brazing in controlled atmosphere to create the copper-ceramic bond.
Pattern Definition: Photolithography and etching to create the precise circuit pattern.
Surface Finishing: Application of protective and bondable surface coatings.
Quality Assurance: 100% visual inspection and statistical sampling for performance testing.
Packaging: Secure packaging in anti-static materials with proper cushioning to prevent damage during transit.

Ready to enhance your power electronics with the reliability of silicon nitride technology?

Contact Puwei Ceramic today to discuss your specific requirements, request samples, or get a detailed quotation for your project.

We offer a complete range of advanced ceramic solutions including Alumina Ceramic Substrates, Aluminum Nitride Ceramics, and specialized Metalization Ceramics to meet your exact needs.