16Pin Three‑Shot Mold Type‑C Receptacle

16Pin Three‑Shot Mold Type‑C Receptacle

2 month ago

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HuiZhou Antenk Electronics Co., LTD

 5 year year

Product details

Product Description:

Huizhou Antenk Electronics Co., Ltd. produces ATK‑B0398‑BTCF‑16‑021 series 16Pin three‑shot mold board‑mount Type‑C female receptacles to deliver reliable high‑current charging and USB2.0 data transmission for compact SMT PCB layouts, following dedicated PCB footprint drawing and unified dimensional tolerances to guarantee stable pick‑and‑place and reflow soldering assembly. This USB‑C receptacle adopts LCP plus 30 percent glass fiber UL94V‑0 as flame‑retardant insulator, high‑conductivity copper terminals with nickel underlayer and 1u inch gold plating on contact zone, SUS201 nickel‑plated outer shell and SUS301 inner clip sheet, electrically rated for 5A rated current and maximum 20V working voltage, 40mΩ maximum initial contact resistance and minimum 100MΩ insulation resistance, passing 100V AC dielectric withstand test, supporting 10000 mating cycles, and enduring peak 260 degree Celsius SMT reflow temperature without plastic blistering or warping, operating stably within minus 30 degrees Celsius to plus 85 degrees Celsius and complying with RoHS environmental standards, supplied with tape and reel packaging for automatic mass production. This durable Type‑C socket is widely deployed in liquid crystal display modules, digital cameras, communication hardware, industrial control panels, portable storage devices, digital household appliances, electronic toys, computer peripherals, automotive electronic assemblies and precision measuring instruments requiring compact USB‑C interface connection. Operators should follow official PCB layout drawings for SMT soldering, avoid excessive plug‑pull force to prevent shell deformation and terminal damage, and store finished connectors in dry sealed packages to prevent plating corrosion. Unlike competitors outsourcing mold and stamping processes Antenk owns full independent production workflows covering self‑developed precision plastic and metal mold manufacturing, high‑conductivity copper terminal stamping, high‑temperature LCP injection molding, precise gold and nickel electroplating plus comprehensive reliability lab testing including salt spray and solderability inspection, holding ISO9001 ISO14001 IATF16949 and UL E472792 certifications compliant with REACH rules. We own more than two hundred fifty plastic connector molds and one hundred eighty metal terminal molds, deliver custom solutions, provide round‑the‑clock professional engineering technical support, and over seventy percent of our Type‑C connector products are exported globally supported by ANTENK brand and consistent stable mass‑production quality.

1. LCP GF UL94V 0 Type C Insulator provides excellent high temperature resistance and flame retardant performance for SMT USB‑C reflow soldering applications.

2. High Conductivity Copper Terminal ensures stable 5A current transmission and reliable signal contact under long‑term plug and pull operations.

3. SUS201 Nickel Plated Shell offers robust mechanical protection and anti‑corrosion property for daily repeated mating of the Type‑C receptacle.

Detailed Specifications:

1. Electrical Parameters

1.1 Rated Current: 5A

1.2 Working Voltage: 5V, Max 20V

1.3 Maximum Initial Contact Resistance: 40mΩ

1.4 Minimum Insulation Resistance: 100MΩ

1.5 Dielectric Withstanding Voltage: 100V AC R.M.S.

2. Material & Surface Finishing

2.1 Insulator Core: LCP +30% G.F, UL94V‑0 flame retardant grade

2.2 Terminal: High‑conductivity copper; nickel base minimum 50U", contact area gold plating 1u", soldering area gold flash

2.3 Outer Shell: SUS201, thickness 0.30mm, nickel plating minimum 50U"

2.4 Inner Clip Sheet: SUS301

3. Mechanical Performance

3.1 Insertion Force: 5‑20N; 5‑20N after durability test

3.2 Extraction Force: 8‑20N; 6‑20N after durability test

3.3 Durability Mating Cycles: 10000 cycles

3.4 SMT Reflow Resistance: Peak temperature 260℃±5℃, no blistering, melting or excessive warpage

3.5 Solder Requirement: Solder coverage over 95%

3.6 Minimum Salt Spray Test: 24 hours

4. Dimensional Standards (Unit: mm)

4.1 Unspecified dimensional tolerance: ±0.05mm

4.2 Special recommended dedicated PCB layout for SMT mounting

5. Environmental Performance

5.1 Operating Temperature Range: ‑30℃ ~ +85℃

6. Compliance Standard

6.1 Compliant with RoHS environmental requirements

7. Packaging Mode

7.1 Tape and reel packaging for automated SMT production

8. Application Scenarios

8.1 Liquid crystal display modules, digital cameras

8.2 Communication hardware, industrial control panels

8.3 Portable storage devices, digital household appliances

8.4 Electronic toys, computer peripherals

8.5 Automotive electronic assemblies, precision measuring instruments

9. Operation & Storage Precautions

9.1 Complete SMT reflow soldering strictly follow official recommended PCB layout drawings

9.2 Avoid excessive plug‑pull force to prevent shell deformation and terminal damage

9.3 Ensure sufficient soldering coverage to meet 95 percent solder area requirement

9.4 Store finished connectors in dry sealed packages to avoid plating layer corrosion

FAQ

Q: How many packaging do you have?

A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.

Q: Can you do our own packaging?

A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.

Q: How many different types of products your company manufactures?

A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.

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HuiZhou Antenk Electronics Co., LTD

 Audited supplier

5 year

Address: Shenzhen, China

Main Product: Connectors , Wire harness, Board to board connector , Wire to board connector , Battery holders , Industrial connector

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