Huizhou Antenk Electronics Co Ltd manufactures reverse type Micro USB five pin AB receptacle with ejector structure and four shell dip legs to realize stable power supply and data transmission between peripheral cables and printed circuit boards. This female USB socket adopts UL94 V zero grade glass filled high temperature thermoplastic housing, zero point two zero millimeter thick copper alloy contacts and mixed copper alloy SUS shell, multiple gold plating grades and insulator material options are supported, full dimension parameters are displayed on engineering drawing for PCB layout reference, it supports maximum one amp rated current, one hundred volt AC dielectric withstanding voltage for one minute, contact resistance below fifty milliohm and insulation resistance above one thousand megaohm and runs within minus thirty degree Celsius to eighty degree Celsius. Users complete dip soldering onto circuit board following official PCB drawing and mate with matched Micro USB plug to achieve reliable signal and power connection for target electronic hardware. Operators must follow drawing dimensional tolerances for footprint design avoid excessive mating force to prevent copper alloy contact deformation and store products inside dry environment to protect plating layers against corrosion. Unlike competitors purchasing outsourced components Antenk completes full in house workflow covering plastic molding terminal stamping assembly and comprehensive laboratory performance testing. Our factory holds ISO9001 ISO14001 IATF16949 and UL certifications and more than seventy percent finished goods export globally. This receptacle fits portable consumer electronics IoT devices and handheld measurement equipment. Please send your insulator option plating selection packing preference and project specifications for free sample evaluation and complete technical document support.
High Temperature USB Jack uses UL94 V zero glass filled thermoplastic housing to maintain stable mechanical performance under elevated operating temperature environments.
Four Shell DIP Socket is designed with four shell dip pins for firm through hole soldering and enhanced locking strength on printed circuit boards.
Ejector Type USB Connector incorporates built in ejector structure to deliver smooth plugging and unplugging experience during repeated mating cycles.
2.Detailed Specifications of MUFM21 Reverse Type Micro USB 5P AB Receptacle
1. Mechanical Specifications
1.1 Product type: Reverse type Micro USB 5 pin AB receptacle, ejector structure with four shell DIP pins
1.2 Measurement unit: millimeter
1.3 Key dimension: Overall dimension 8.35 by 4.45 millimeter. Refer to engineering drawing for outline sizes pin dimensions and dedicated PCB layout dimensions. Apply drawing standard dimensional tolerances for unspecified dimensions during printed circuit board design.
1.4 Assembly method: Complete through hole DIP soldering onto printed circuit board, mate with compatible Micro USB plug to finish power and data interconnection.
1.5 Ordering feature: Multiple housing material options various gold plating grades and diverse packing styles are available for selection.
1.6 CTA: Contact our engineering team to obtain complete dimension drawings and ordering specifications for your hardware design validation.
2. Material Construction
2.1 Housing: Glass filled high temperature thermoplastic UL94 V zero rating
2.2 Contact: 0.20 millimeter thickness copper alloy
2.3 Shell: Composite of copper alloy and SUS stainless steel
3. Electrical & Environmental Performance Parameters
3.1 Current rating: Maximum 1A
3.2 Dielectric withstanding voltage: 100V AC for one minute
3.3 Contact resistance: Maximum 50 milliohm
3.4 Insulation resistance: Minimum 1000 Megaohm
3.5 Total mating force: Maximum 3.57 kilogram force
3.6 Total unmating force: Minimum 1.0 kilogram force, minimum 0.81‑2.05 kilogram force after 10000 insertion and extraction cycles
3.7 Operating temperature range: Minus 30 degree Celsius to 80 degree Celsius
3.8 Compliance: Meets RoHS environmental requirements
4. Usage Method
4.1 Assembly mode: Follow official PCB layout drawing to finish DIP through hole soldering on printed circuit board, connect with matched Micro USB plug for stable power and data signal transmission.
4.2 Operation tip: Adopt PCB layout dimensions provided on engineering drawing for circuit board layout development.
5. Application Scenarios
5.1 Power and data interface for portable consumer electronic devices
5.2 Signal connection for IoT smart hardware
5.3 Charging port for handheld measuring instruments
5.4 Internal connectivity for small size digital electronic assemblies
6. Operation & Storage Precautions
6.1 Strictly follow drawing dimensional tolerances for PCB footprint design
6.2 Avoid excessive mating or unmating force to prevent permanent deformation of copper alloy contacts and shell structure
6.3 Prevent scratches dirt and mechanical impact on housing and metal components before assembly
6.4 Keep products stored in dry environment to avoid oxidation of plating surfaces
6.5 Confirm housing material contact plating grade and packing style before placing purchase order
6.6 CTA: Submit your hardware requirement material and plating options and project information, we provide free sample evaluation and professional technical consultation services.
3.FAQ
Q: How many packaging do you have?
A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.
Q: Can you do our own packaging?
A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.
Q: How many different types of products your company manufactures?
A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.
4.Product Drawing：
