Product
Product
Supplier
Search
Get Quote
730 people are quoting
Puwei's specialized Aluminum Nitride Ceramic Substrates provide the ideal foundation for advanced thick film circuits, combining exceptional thermal management with superior electrical performance. Engineered specifically for demanding electronic packaging and microelectronics packaging applications, these substrates deliver reliable performance in high-power and high-frequency environments.
With thermal conductivity of 170-230 W/(m·K), our AlN substrates efficiently dissipate heat from high-power microelectronic components, preventing overheating and ensuring reliable operation in demanding power devices applications.
Excellent dielectric strength and volume resistivity exceeding 10¹⁴ Ω·cm provide reliable electrical isolation, making these substrates ideal for high-frequency modules and RF circuits in microwave applications.
Resistant to acids, alkalis, and corrosive environments, ensuring long-term durability and performance consistency in harsh industrial conditions.
Smooth, flat surfaces provide ideal platforms for thick film printing and sintering, ensuring uniform circuit layers and reliable performance in thick film hybrid microcircuits.
Complete control from raw material R&D to finished ceramic products, ensuring consistent quality and performance across all production batches.
High-purity aluminum nitride powder processing and formulation to achieve optimal thermal and electrical properties for specific application requirements.
State-of-the-art forming and sintering processes to create substrates with precise dimensions and superior material properties.
Comprehensive testing and inspection at every production stage to ensure dimensional accuracy, thermal performance, and electrical properties.
Choose appropriate substrate thickness and surface finish based on your thick film circuit requirements and thermal management needs for microelectronics applications.
Ensure clean, contamination-free substrate surfaces before thick film printing to achieve optimal adhesion and circuit performance.
Apply thick film pastes using standard printing techniques, taking advantage of the substrate's optimized surface properties for uniform deposition.
Follow recommended sintering profiles to achieve proper adhesion and electrical properties while maintaining substrate integrity.
Integrate completed thick film circuits into final assemblies, leveraging the substrate's thermal management capabilities for optimal performance.
Ideal for power converters, motor drives, and industrial control systems where efficient heat dissipation from power devices is critical for reliability and performance in demanding industrial environments.
Essential for RF power amplifiers, base station components, and microwave components requiring stable dielectric properties and minimal signal loss in high-frequency applications.
Perfect for sensor packaging applications where thermal stability and electrical insulation are crucial for accurate sensing and long-term reliability in harsh operating conditions.
Superior platform for thick film hybrid microcircuits and integrated circuit packaging, providing the thermal management and electrical performance needed for advanced electronic systems.
Puwei Ceramic maintains the highest quality standards with comprehensive certification and quality management systems ensuring consistent product quality and performance.
If you are interested in the product, contact 2bvideo.com for more information for more information
The information of 2bvideo.com limited shown above is provided by the user or collected on the network. Video 2B does not guarantee the authenticity,accuracy and legitimacy of 2bvideo.com limited information. Video 2B does not involve legal relationships and disputes between users arising from transactions other than secured transactions on this website. Disputes shall be settled by you through negotiation. If you are the person in charge or relevant employee of this enterprise, if you find that the enterprise information is incorrect or want to manage thiscompany, please contact us jacklee1558@gmail.com, after you claim the enterprise, you can obtain management permission, publish supplyand demand information, bring consulting orders, and remove page advertisements.
Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate
