Product
Product
Supplier
Search
Get Quote
730 people are quoting
Puwei Ceramic delivers industry-leading alumina ceramic substrates engineered for superior performance in demanding electronic packaging applications. Our proprietary manufacturing technology enables production of exceptionally large substrates (up to 240×280×1mm) with minimal warpage under 0.25%, addressing critical challenges in microelectronics packaging and circuit integration.
These advanced electronic ceramic products provide exceptional dimensional stability, excellent electrical insulation, and superior thermal management properties. Ideal for high-frequency modules and power devices, our substrates ensure reliable performance in precision electronic assemblies, serving as fundamental building blocks for integrated circuits and thick film hybrid microcircuits.
Material Composition: 96% Alumina Ceramic (Al₂O₃). Available Sizes: Standard and custom dimensions up to 240×280mm. Thickness Range: 0.2mm to 2.00mm. Maximum Warpage: <0.25% (significantly lower than industry standard). Surface Finish: Precision polished for optimal flatness. Dimensional Tolerance: ±0.1mm to ±0.5mm. Volume Resistivity: >10¹⁴ Ω·cm. Dielectric Strength: >10 kV/mm. Thermal Conductivity: 20-25 W/m·K. Coefficient of Thermal Expansion: 7.2-8.4 × 10⁻⁶/°C. These parameters make our substrates ideal for microwave applications and RF circuits requiring consistent electrical properties.
Precision manufacturing of large-format ceramic components for advanced electronics.
Our proprietary flat firing technique reduces camber to less than 0.25%, significantly below the 0.39% industry standard. This exceptional flatness ensures perfect alignment in integrated circuit assemblies and prevents stress in mounted components, crucial for high-power microelectronic components.
Unique iron removal process reduces iron content inclusions by over 95%, eliminating red spots that compromise appearance and electrical properties. This ensures superior volume resistivity and dielectric strength for microwave applications and sensor packaging.
We specialize in extra-large substrates (up to 240×280×1mm) that are difficult to source elsewhere, making us the preferred supplier for applications requiring substantial circuit real estate in thick film hybrid microcircuits and optoelectronics applications.
Whether mold-stamped or laser-processed, our substrates maintain tight dimensional tolerances critical for automated assembly processes, reducing integration issues and improving manufacturing yield for hybrid micro circuits.
High volume resistivity (>10¹⁴ Ω·cm) and exceptional dielectric strength (>10 kV/mm) make our substrates ideal for RF circuits and high-voltage applications where insulation integrity is paramount, serving as reliable insulation elements.
Our large-format, low-warpage substrates excel in power modules, IGBTs, and automotive power systems where flatness ensures proper thermal management and reliability for high-power microelectronic components and IGBT ceramic substrates.
Exceptional dimensional stability makes our substrates perfect for high-density LED arrays and display backplanes where precise component placement is critical in optoelectronics applications and LED ceramic substrates.
Low dielectric loss and consistent electrical properties across large areas make our substrates valuable for microwave components requiring stable performance at high frequencies, ideal for microwave and RF ceramic substrates.
Thermal stability and flatness ensure reliable performance in demanding test environments where temperature cycling can cause conventional substrates to fail, supporting Bare Ceramic Plates for test assemblies.
For X-ray detectors, ultrasound systems, and other medical imaging applications, our substrates provide the reliability and precision required in medical electronics, serving as excellent insulation elements and ceramic components.
Our manufacturing facilities and processes are certified to international quality standards (Certificate: GXLH41023Q10642R0S). We maintain rigorous quality control throughout production to ensure consistent performance and reliability for all ceramic components.
Our alumina ceramic substrates comply with relevant industry standards for electronic ceramics and are suitable for automotive, medical, and industrial applications requiring certified components, including power semiconductor ceramic substrates and automotive electronic ceramic substrates.
We offer comprehensive OEM & ODM services to meet specific customer requirements. Our technical team can produce ceramic substrates with thicknesses from 0.2mm to 2.00mm, with custom dimensions and geometries available for applications ranging from laser ceramic heat sinks to high thermal conductivity ceramic substrates.
Our expertise extends to specialized requirements including custom metallization patterns, vias, and cavities. We provide metallized ceramics with various metal coatings (Cu, Al, Au, Ag) optimized for specific application needs in sensor packaging and other specialized fields, including AlN ceramic circuit boards upon request.
Our manufacturing incorporates advanced techniques developed specifically for large-format, low-warpage substrates:
Each production batch undergoes multiple quality checkpoints to ensure dimensional accuracy, surface quality, and electrical performance for all ceramic components and substrates, meeting the demanding requirements of integrated circuit manufacturing and power device assembly.
If you are interested in the product, contact 2bvideo.com for more information for more information
The information of 2bvideo.com limited shown above is provided by the user or collected on the network. Video 2B does not guarantee the authenticity,accuracy and legitimacy of 2bvideo.com limited information. Video 2B does not involve legal relationships and disputes between users arising from transactions other than secured transactions on this website. Disputes shall be settled by you through negotiation. If you are the person in charge or relevant employee of this enterprise, if you find that the enterprise information is incorrect or want to manage thiscompany, please contact us jacklee1558@gmail.com, after you claim the enterprise, you can obtain management permission, publish supplyand demand information, bring consulting orders, and remove page advertisements.
Main Product:
Alumina Ceramic Substrates ,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
