Product
Product
Supplier
Search
Get Quote
730 people are quoting
Puwei Ceramic specializes in manufacturing large-format, low-warpage alumina ceramic substrates that set industry standards for flatness and reliability. Our proprietary manufacturing techniques enable us to produce exceptionally large substrates (up to 240×280×1mm and 95×400×1mm) with minimal camber, addressing a critical challenge in electronic packaging and circuit integration.
These advanced electronic ceramic products are engineered for applications requiring precise dimensional stability, excellent electrical insulation, and superior thermal management properties. With warpage levels reduced to less than 0.25% - significantly below industry standards - our substrates ensure optimal performance in high-precision electronic assemblies.
96% Alumina Ceramic Substrate - Large Format Design
Superior Flatness Achieved Through Special Manufacturing Process
Performance Parameters of 96% Alumina Ceramic Substrate
Dimensional Tolerances for Mold Stamped Substrates
Dimensional Tolerances for Laser-Processed Substrates
Our proprietary flat firing technique reduces camber to less than 0.25%, significantly below the industry standard of 0.39% for conventional tape-cast ceramic substrates. This exceptional flatness ensures perfect alignment in multilayer assemblies and prevents stress in mounted components.
Our unique iron removal process reduces iron content inclusions by more than 95%, eliminating red spots that can compromise both appearance and electrical properties. This results in superior volume resistivity and dielectric strength compared to standard alumina substrates.
We specialize in producing extra-large substrates (up to 240×280×1mm) that are difficult to source elsewhere. Our expertise in handling large formats makes us the preferred supplier for applications requiring substantial circuit real estate.
Whether mold-stamped or laser-processed, our substrates maintain tight dimensional tolerances critical for automated assembly processes. This precision reduces integration issues and improves manufacturing yield for our clients.
High volume resistivity (>10¹⁴ Ω·cm) and exceptional dielectric strength (>10 kV/mm) make our substrates ideal for high-voltage and high-frequency applications where insulation integrity is paramount.
Our large-format, low-warpage substrates are ideal for DBC ceramic substrate applications in power modules, IGBTs, and automotive power systems where flatness ensures proper thermal management and reliability.
The exceptional dimensional stability of our substrates makes them perfect for high-density LED arrays and display backplanes where precise component placement is critical.
Low dielectric loss and consistent electrical properties across large areas make our substrates valuable for RF applications requiring stable performance at high frequencies.
The thermal stability and flatness of our substrates ensure reliable performance in demanding test environments where temperature cycling can cause conventional substrates to fail.
For X-ray detectors, ultrasound systems, and other medical imaging applications, our substrates provide the reliability and precision required in medical electronics.
Our manufacturing facilities and processes are certified to international quality standards (Certificate: GXLH41023Q10642R0S). We maintain rigorous quality control protocols throughout production to ensure consistent performance and reliability.
Our alumina ceramic substrates comply with relevant industry standards for electronic ceramics and are suitable for use in automotive, medical, and industrial applications requiring certified components.
We offer comprehensive OEM & ODM services to meet specific customer requirements. Our technical team can produce ceramic substrates with thicknesses ranging from 0.2mm to 2.00mm, with custom dimensions and geometries available according to customer specifications.
Our expertise in large-format substrates extends to specialized requirements such as custom metallization patterns, vias, and cavities. We can also provide metallized ceramics with various metal coatings (Cu, Al, Au, Ag) optimized for your specific application needs.
Whether you require standard 96% alumina or specialized aluminum nitride ceramics for enhanced thermal performance, our engineering team can develop solutions that meet your exact technical requirements.
Our manufacturing process incorporates advanced techniques specifically developed for large-format, low-warpage substrates:
Each production batch undergoes multiple quality checkpoints to ensure dimensional accuracy, surface quality, and electrical performance.
We package our ceramic substrates in specially designed cartons with protective plastic liners to prevent scratches and moisture damage. Sturdy cartons are stacked on pallets and secured with straps or shrink wrap for optimal protection during transit.
We support multiple transportation methods including ocean, air, and express shipping, with flexible Incoterm options (FOB, CIF, EXW) available. Our major shipping ports include Shanghai, Beijing, and Xi'an.
Our proprietary flat firing technique specifically addresses the warpage issue common in tape-cast ceramics. By carefully controlling temperature gradients and using specialized setters during firing, we achieve camber levels below 0.25%, significantly better than the industry standard of 0.39%.
While 240×280mm represents our standard large format, we have experience producing even larger substrates for special applications. Please consult with our engineering team to discuss your specific size requirements.
Iron impurities can create localized conduction paths and reduce dielectric strength. Our process reduces iron content by over 95%, eliminating red spots and ensuring consistent electrical properties across the entire substrate surface.
Our substrates offer significantly better flatness, larger available sizes, more consistent electrical properties, and specialized expertise in handling challenging formats. These advantages translate to higher manufacturing yields and more reliable end products for our customers.
Yes, we offer comprehensive metalization ceramics services including direct bond copper (DBC), direct plated copper (DPC), and active metal brazing (AMB) for applications requiring circuit patterns or thermal management solutions.
If you are interested in the product, contact 2bvideo.com for more information for more information
The information of 2bvideo.com limited shown above is provided by the user or collected on the network. Video 2B does not guarantee the authenticity,accuracy and legitimacy of 2bvideo.com limited information. Video 2B does not involve legal relationships and disputes between users arising from transactions other than secured transactions on this website. Disputes shall be settled by you through negotiation. If you are the person in charge or relevant employee of this enterprise, if you find that the enterprise information is incorrect or want to manage thiscompany, please contact us jacklee1558@gmail.com, after you claim the enterprise, you can obtain management permission, publish supplyand demand information, bring consulting orders, and remove page advertisements.
Main Product:
Alumina Ceramic Substrates ,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
