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Puwei Ceramic delivers industry-leading alumina ceramic substrates engineered for superior performance in demanding electronic packaging applications. Our proprietary manufacturing technology enables production of exceptionally large substrates (up to 240×280×1mm) with minimal warpage under 0.25%, addressing critical challenges in microelectronics packaging and circuit integration.
These advanced electronic ceramic products provide exceptional dimensional stability, excellent electrical insulation, and superior thermal management properties. Ideal for high-frequency modules and power devices, our substrates ensure reliable performance in precision electronic assemblies.
96% Alumina Ceramic Substrate - Large Format Design
Superior Flatness Achieved Through Special Manufacturing Process
Performance Parameters of 96% Alumina Ceramic Substrate
Dimensional Tolerances for Mold Stamped Substrates
Dimensional Tolerances for Laser-Processed Substrates
Our proprietary flat firing technique reduces camber to less than 0.25%, significantly below the 0.39% industry standard. This exceptional flatness ensures perfect alignment in integrated circuit assemblies and prevents stress in mounted components.
Unique iron removal process reduces iron content inclusions by over 95%, eliminating red spots that compromise appearance and electrical properties. This ensures superior volume resistivity and dielectric strength for microwave applications.
We specialize in extra-large substrates (up to 240×280×1mm) that are difficult to source elsewhere, making us the preferred supplier for applications requiring substantial circuit real estate in thick film hybrid microcircuits.
Whether mold-stamped or laser-processed, our substrates maintain tight dimensional tolerances critical for automated assembly processes, reducing integration issues and improving manufacturing yield.
High volume resistivity (>10¹⁴ Ω·cm) and exceptional dielectric strength (>10 kV/mm) make our substrates ideal for RF circuits and high-voltage applications where insulation integrity is paramount.
Our large-format, low-warpage substrates excel in power modules, IGBTs, and automotive power systems where flatness ensures proper thermal management and reliability for high-power microelectronic components.
Exceptional dimensional stability makes our substrates perfect for high-density LED arrays and display backplanes where precise component placement is critical in optoelectronics applications.
Low dielectric loss and consistent electrical properties across large areas make our substrates valuable for microwave components requiring stable performance at high frequencies.
Thermal stability and flatness ensure reliable performance in demanding test environments where temperature cycling can cause conventional substrates to fail.
For X-ray detectors, ultrasound systems, and other medical imaging applications, our substrates provide the reliability and precision required in medical electronics, serving as excellent insulation elements.
Our manufacturing facilities and processes are certified to international quality standards (Certificate: GXLH41023Q10642R0S). We maintain rigorous quality control throughout production to ensure consistent performance and reliability for all ceramic components.
Our alumina ceramic substrates comply with relevant industry standards for electronic ceramics and are suitable for automotive, medical, and industrial applications requiring certified components.
We offer comprehensive OEM & ODM services to meet specific customer requirements. Our technical team can produce ceramic substrates with thicknesses from 0.2mm to 2.00mm, with custom dimensions and geometries available.
Our expertise extends to specialized requirements including custom metallization patterns, vias, and cavities. We provide metallized ceramics with various metal coatings (Cu, Al, Au, Ag) optimized for specific application needs in sensor packaging and other specialized fields.
Our manufacturing incorporates advanced techniques developed specifically for large-format, low-warpage substrates:
Each production batch undergoes multiple quality checkpoints to ensure dimensional accuracy, surface quality, and electrical performance for all ceramic chips and substrates.
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Main Product:
Alumina Ceramic Substrates ,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate,
DBC Ceramic Substrate
