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Puwei's 99.6% Alumina Ceramic Substrate is engineered specifically to meet the extreme thermal, mechanical, and electrical demands of high-power optoelectronic and microelectronics packaging. Manufactured from ultra-high purity (>99.6%) Aluminum Oxide (Al₂O₃), this substrate delivers exceptional heat dissipation, outstanding electrical insulation, and robust mechanical stability. It serves as a critical, high-performance foundation for mounting high-power microelectronic components such as laser diodes, ensuring reliable operation, extended lifespan, and maximum efficiency in demanding systems like high-frequency modules and power devices.
Our 99.6% Alumina substrates are characterized by precise, consistent properties crucial for reliable system design in optoelectronics applications and integrated circuit manufacturing.
Material Composition: > 99.6% Aluminum Oxide (Al₂O₃). Density: 3.90 - 3.98 g/cm³. Color: White / Ivory. Water Absorption: 0% (Fully Dense). Flexural Strength: 350 - 450 MPa. Compressive Strength: > 2500 MPa. Hardness (Vickers): > 1500 HV.
Thermal Conductivity: 25 - 30 W/(m·K) @ 25°C. Coefficient of Thermal Expansion (CTE): 7.0 - 7.5 x 10⁻⁶/°C. Max Continuous Use Temperature: 1600°C. Thermal Shock Resistance: Excellent.
Volume Resistivity: > 10¹⁴ Ω·cm @ 25°C. Dielectric Constant (εr): 9.5 - 9.8 @ 1 MHz. Dielectric Loss Tangent (tan δ): < 0.0002 @ 1 MHz. Dielectric Strength: > 15 kV/mm.
This substrate is a versatile solution for demanding microelectronics and thermal management challenges.
The core application for mounting laser diode bars and stacks in industrial cutting, medical aesthetics, and LiDAR systems. Critical for thermal management to maintain beam quality.
Used as an insulating substrate for microwave components like RF power transistors and amplifiers in telecommunications and radar systems.
Acts as a robust baseplate for thick film hybrid microcircuits, providing electrical isolation and a stable platform for screen-printed components in aerospace and industrial controls.
Serves as a high-thermal-conductivity submount for high-power LED chips in automotive headlights and projectors.
Provides a stable, insulating platform for sensor packaging, particularly for high-temperature pressure and gas sensors.
Proper integration is key to unlocking full performance. Follow these general steps for reliable assembly of your high-power microelectronic components.
99.6% purity represents a significant performance jump over standard 96% alumina, offering distinct benefits for critical electronic packaging:
Puwei specializes in tailoring 99.6% alumina substrates to your exact requirements for insulation elements and advanced circuits.
Puwei is committed to delivering products that meet the highest standards for global markets.
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Main Product:
Alumina Ceramic Substrates,
Aluminum Nitride Substrates,
Metallized Ceramics,
AlN Ceramics Disc,
DPC Substrate ,
DBC Ceramic Substrate
