Silicon Nitride Double-Sided AMB Copper-Clad Substrate

Silicon Nitride Double-Sided AMB Copper-Clad Substrate

11 month ago

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Shaanxi Puwei Electronic Technology Co., Ltd

 2 year year

Product details

Puwei AMB Ceramic Copper-Clad Substrates: The Foundation for Next-Generation Power Electronics

As a leader in advanced electronic packaging solutions, Puwei delivers high-reliability Active Metal Brazing (AMB) Ceramic Copper-Clad Substrates. Engineered specifically for the extreme demands of new energy applications, our substrates form an unbreakable metallurgical bond between copper and ceramic. This technology is the cornerstone for building compact, efficient, and ultra-reliable power devices and high-power microelectronic components in Electric Vehicles (EVs), Renewable Energy systems, and Industrial Drives.

Core Advantages of Puwei AMB Technology

Exceptional Bond Strength (>80 MPa): The chemical-metallurgical bond eliminates copper delamination under extreme thermal cycling, offering superior reliability over traditional methods for automotive and industrial microelectronics packaging.
Optimized Thermal Management: Silicon Nitride (Si3N4) AMB provides high thermal conductivity (>90 W/mK) and CTE matching for SiC semiconductors, drastically reducing thermomechanical stress.
High Power Density Design: Supports thick copper layers (up to 0.8mm standard, 2.00mm custom) for extreme current capacity (>500A), enabling more compact inverter designs.
Proven Long-Term Reliability: Withstands >5,000 thermal cycles (-55°C to +150°C), extending product lifespan and reducing field failures in critical integrated circuit-based systems.
Material Flexibility: Choose from AlN-AMB for max heat flux, Si3N4-AMB for strength/CTE match, or Al2O3-AMB for cost-effective solutions—all within the robust AMB architecture.

AMB Ceramic Substrate integrated into a high-power EV traction inverter power module

Close-up microscopic view of the uniform copper layer on AMB ceramic substrate

Technical Specifications & Material Options

Our AMB substrates are precision-engineered for consistent performance in your power module design.

Available Material Systems

Ceramic Core:
- Aluminum Nitride (AlN): Ultra-high thermal conductivity (180-200 W/mK).
- Silicon Nitride (Si3N4): Superior mechanical strength and fracture toughness, with excellent thermal conductivity (>90 W/mK).
- Alumina (Al2O3): A reliable and cost-effective insulation element with good electrical properties.
Copper Layer: Oxygen-Free High Conductivity (OFHC) Copper. Standard thickness 0.3mm to 0.8mm, customizable up to 2.00mm.
Key Performance Parameters:
- Peel Strength: > 80 MPa (Typical 100-150 MPa)
- Thermal Conductivity: AlN: 180-200 W/mK | Si3N4: >90 W/mK | Al2O3 (99%): 24-28 W/mK
- Dielectric Strength: > 20 kV/mm
- Operating Temperature: -55°C to +400°C (continuous)

Why AMB is the Superior Bonding Solution

Active Metal Brazing (AMB) is a vacuum process using a solder paste with active elements (Ti/Zr) that react with the ceramic, creating a strong, void-free chemical bond with the copper foil.

AMB vs. Alternative Technologies

vs. Direct Bonded Copper (DBC): AMB offers significantly higher peel strength and better resistance to thermal fatigue, especially with Si3N4 ceramics.
vs. Direct Plated Copper (DPC): AMB supports thicker copper for higher current and offers superior thermal performance, making it ideal for high-power modules rather than high-frequency modules requiring ultra-fine features.
vs. Thick Film Metallization: AMB provides a fully dense, solderable copper surface ideal for high-power die attach, unlike printed conductors used in some hybrid micro circuits.

Primary Application Scenarios

Electric & Hybrid Vehicle Powertrains

Ideal for traction inverters, onboard chargers, and DC-DC converters. Si3N4-AMB is critical for 800V+ architectures using SiC devices, serving as the core insulation element and heat spreader.

Renewable Energy Power Conversion

Central to solar inverters, wind turbine converters, and ESS inverters, improving efficiency and lifetime of power conversion systems.

Industrial Motor Drives & UPS

Used in high-power AC drives and UPS where reliability under continuous operation is paramount.

Rail, Marine & Aerospace

Meets stringent requirements for traction converters and power distribution systems where vibration resistance and reliability are critical.

Design & Integration Guidance

Material Selection: Consult Puwei to choose the optimal ceramic (Si3N4 for SiC reliability, AlN for max heat flux, Al2O3 for cost-efficiency).
Design & Layout: Share your circuit layout. We advise on manufacturable trace widths and copper balancing to prevent warpage.
Substrate Preparation: Clean with IPA or plasma clean for high-reliability assemblies to ensure perfect surface wettability.
Component Assembly: Use solder or silver sintering for die attach. Thick Al/Cu wires can be bonded directly to the copper traces.
Thermal Interface & Housing: Attach to heatsink using thermal interface materials and integrate into your module housing.

Customization & OEM/ODM Services

Puwei provides full co-engineering support to tailor AMB substrates to your exact needs.

Custom Sizes & Shapes: Non-standard dimensions, cut-outs, and contours.
Complex Circuit Patterns: Intricate designs with fine features and multi-step copper thickness.
Specialized Surface Finishes: ImSn, ImAg, Ni/Au, or ENEPIG for specific bonding needs.
Hybrid Constructions: Integration with other Puwei products like Alumina Ceramic Substrate (Al2O3) or CERAMIC COMPONENTS.
From Prototype to Volume: Rapid prototyping supported by high-volume manufacturing capability.

Advanced Manufacturing & Quality Assurance

Our state-of-the-art process ensures the highest quality standards for every substrate.

Ceramic blank preparation from high-purity powder.
Surface activation and precise braze paste printing.
Copper foil lamination and vacuum brazing at ~800°C to form the permanent bond.
Precision etching to define customer circuit patterns.
Final machining, plating (if specified), and 100% inspection (AOI, HiPot testing).

Certifications & Compliance

Our commitment to quality aligns with global industry standards.

Quality Management: ISO 9001:2015 Certified.
Environmental Compliance: RoHS and REACH compliant. Halogen-free options available.
Automotive Alignment: Processes developed in line with IATF 16949 principles.
Full Traceability: Complete material and process traceability for every batch.

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Shaanxi Puwei Electronic Technology Co., Ltd

 Audited supplier

2 year

Address: Xian, China

Main Product: Alumina Ceramic Substrates, Aluminum Nitride Substrates, Metallized Ceramics , AlN Ceramics Disc, DPC Substrate, DBC Ceramic Substrate

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