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1.27mm Pin Header Straight Type Single Row

2 month ago
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Product details
Huizhou Antenk Electronics Co., Ltd. (IATF16949, ISO9001, ISO14001 certified) presents the 1.27mm Pin Header Straight Type Single Row. This ultra fine pitch male header is specifically engineered for space constrained, high density board to board or wire to board interconnections. The 1.27mm (0.05 inch) pitch offers 50 percent space savings compared to traditional 2.54mm headers, enabling miniaturization of portable electronics. The insulator is molded from high temperature UL94 V-0 LCP or PBT, capable of withstanding 260°C reflow soldering with excellent dimensional stability. Contacts are stamped from phosphor bronze with selective gold plating on the mating area and pure tin on the solder tails, ensuring low contact resistance and reliable solderability. Key specifications include current rating 1A per contact, contact resistance below 25 milliohms, insulation resistance above 1000 megohms, dielectric strength 500V AC, and operating temperature from -40 to +105 degrees Celsius. The straight vertical orientation allows direct PCB mounting and mating with 1.27mm female headers or IDC sockets. RoHS and REACH compliant, UL recognized under E472792.
 
Applications include compact medical devices (glucose meters, patient monitors), portable consumer electronics (smart watches, earbuds), telecommunications modules, industrial sensors, and automotive infotainment systems. Usage method: solder the through hole tails to the PCB using wave or hand soldering. For high volume production, the header can also be supplied in tape and reel for automated insertion. Mate with a corresponding 1.27mm single row female header. Precautions: do not exceed 1A per contact, ensure precise PCB hole alignment (recommended hole diameter 0.8mm), avoid excessive mating force as fine pitch contacts are more delicate. Advantages over competitors: Antenk maintains pin coplanarity within 0.05mm and pin tip alignment within ±0.03mm, ensuring seamless mating without stubbing. The high temperature LCP housing prevents solder wicking and maintains straightness after reflow. Low MOQs of 1000 units with no tooling fees for standard pin counts and plating options.
 
Production process: in house mold design, precision injection molding on 10 Japanese and Taiwanese machines, high speed stamping of pins on 9 presses, selective gold and tin plating, automated pin insertion, 100 percent coplanarity, alignment and pin height inspection, contact resistance and insulation tests, 48 hour salt spray test, and final QC with lot traceability. Free samples, 2D and 3D CAD drawings, and 24 hour technical support available. Contact Antenk for custom pin lengths, plating thickness, and packaging.
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Audited supplier
5 year
Address: Shenzhen, China


Main Product: Connectors , Wire harness, Board to board connector , Wire to board connector , Battery holders , Industrial connector

Disclaimer:
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