1.Product Description：
Huizhou Antenk Electronics Co Ltd manufactures dual row surface mount female header with one point two seven millimeter pitch featuring different post structure and half bump design to deliver stable board to board signal and low power interconnection for compact printed circuit board assemblies. This SMT female header adopts UL94 V zero grade PA6T black insulator and brass contact terminals, it supports two to one hundred contact positions, multiple selective gold plating and tin plating grades as well as variable post dimension plastic height and various packing selections, full dimension parameters can be checked on engineering drawing for PCB footprint reference, it provides one amp rated current, five hundred volt AC dielectric withstanding voltage, insulation resistance no less than one thousand megaohm and contact resistance below twenty milliohm and runs reliably from minus sixty five degree Celsius to plus one hundred twenty five degree Celsius. Users perform surface mount reflow soldering following official PCB drawing and mate with matching male header to achieve steady circuit interconnection for miniaturized electronic hardware. Operators must follow drawing dimensional tolerances for PCB layout avoid excessive mating force to prevent brass terminal deformation and store goods in dry environment to protect plated surfaces from oxidation. Unlike competitors buying outsourced components Antenk carries out complete in house workflow covering plastic molding terminal stamping assembly and comprehensive laboratory performance verification. Our factory holds ISO9001 ISO14001 IATF16949 and UL certifications and over seventy percent finished goods export globally. This female header fits precision instruments portable gadgets and compact industrial control modules. Please provide your contact count post specification plating option and project requirements for free sample evaluation and complete technical document support.
Half Bump Female Header incorporates special half bump structural design to improve alignment performance during connector mating for compact PCB applications.
Low Profile SMT Socket occupies limited board height and supports surface mount reflow soldering for space constrained miniature electronic assemblies.
Custom Post Female Socket accepts varied post dimension modifications to satisfy unique mechanical and connection requirements of customer hardware projects.
2.Detailed Specifications of FHCM10‑XXDXXXXX 1.27 mm Dual Row SMT Female Header with Different Post and Half Bump
1. Mechanical Specifications
1.1 Product type: Dual row surface mount SMT female header with different post and half bump structure
1.2 Measurement unit: millimeter
1.3 Key dimension: Pitch is 1.27 millimeter, contact quantity ranges from 2 positions to 100 positions. Refer to engineering drawing for outline dimension and dedicated PCB layout dimensions. Follow drawing standard dimensional tolerances for unspecified dimensions during printed circuit board design. Multiple post dimension and plastic height options are available.
1.4 Assembly method: Perform surface mount reflow soldering onto printed circuit board, mate with matching male header to realize board to board signal and low power interconnection.
1.5 Ordering feature: Multiple insulator material options, various selective gold plating and tin plating grades, diverse post dimension plastic height and packing styles for custom project demands.
1.6 CTA: Contact our engineering team to obtain complete dimension drawings and ordering specifications for your hardware design validation.
2. Material Construction
2.1 Contact Material: Brass
2.2 Insulator Material: PA6T UL94 V zero black, alternative insulator materials are selectable
3. Electrical & Environmental Performance Parameters
3.1 Current rating: 1 Amp
3.2 Dielectric withstanding voltage: AC 500V
3.3 Insulation resistance: Minimum 1000 Megaohm
3.4 Contact resistance: Maximum 20 milliohm
3.5 Operating temperature range: Minus 65 degree Celsius to plus 125 degree Celsius
3.6 Compliance: Meets RoHS and HSF environmental requirements
4. Usage Method
4.1 Assembly mode: Complete surface mount reflow soldering according to official PCB layout drawing, connect with matched male header to achieve stable signal and low power transmission.
4.2 Operation tip: Adopt PCB layout dimension data provided on engineering drawing for circuit board layout development.
5. Application Scenarios
5.1 High precision board to board signal connection for precision measuring instruments
5.2 Internal circuit interconnection for portable electronic gadgets
5.3 Compact signal interface for mini industrial control modules
5.4 Low power interconnection for space limited miniature electronic hardware
6. Operation & Storage Precautions
6.1 Strictly follow drawing dimensional tolerances for PCB footprint design
6.2 Avoid excessive mating force to prevent permanent deformation of brass contact terminals
6.3 Prevent scratches dirt and mechanical impact on insulator and brass terminals before assembly
6.4 Store products in dry environment to avoid oxidation of plated surfaces
6.5 Confirm contact count insulator material plating grade post dimension plastic height and packing type before placing purchase order
6.6 CTA: Submit your hardware requirement material plating options and project information, we provide free sample evaluation and professional technical consultation services.
3.FAQ
Q: How many packaging do you have?
A: We have five packages including PE bag, hand bag, zip lock bag, colorful box and white box currently.
Q: Can you do our own packaging?
A: Yes, you just provide the package design and we will produce what you want. We also have the professional designer can help you do the packaging design.
Q: How many different types of products your company manufactures?
A: Now we have more than 1,000 products. We have a strong advantage of OEM, just give us the actual products or your idea that you want, we will manufacture for you.
4.Product Drawing：
