electronic packages

3 year ago

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Shaanxi Xinlong Metal Electro-mechanical Co., Ltd.

 3 year year

Product details

High-Speed Optoelectronic Packaging: Metal-Wall Housings for Communication Devices

Product Overview

Our metal-wall, ceramic-insulator housings are the gold standard for high-performance Optoelectronic Packaging. This construction methodology provides the ultimate combination of rugged mechanical protection and high-fidelity electrical performance. The metal body acts as a durable, hermetic shield and an excellent heat sink, while the integrated alumina ceramic feedthroughs provide superior electrical isolation for high-speed signal and DC bias pins. Engineered to solve the complex interconnection challenges between the semiconductor chip and external circuitry, these packages support data rates from 2.5Gbps up to 400Gbps, making them the ideal choice for the entire spectrum of optical communication applications.

Technical Specifications

Parameter	Specification
Supported Data Rates	2.5Gbps, 10Gbps, 25Gbps, 40Gbps, 100Gbps, and 400Gbps
Impedance Control	Designed for 50Ω characteristic impedance
Package Types Available	14-Pin Butterfly, TOSA/ROSA Box Packages, Mini-DIL, Custom Designs
Wall/Lid Material	Kovar (Fe-Ni-Co Alloy)
Insulator Material	High-Purity Alumina ($Al_2O_3$)
Hermeticity	Compliant with GR-468 and MIL-STD-883 standards
Optical Interface	Sapphire window or fiber optic tube

Product Images

A metal-wall housing with ceramic feedthroughs for optical communication

Features & Advantages

Unmatched Signal Integrity: Precision-engineered feedthroughs maintain a 50Ω impedance match, minimizing signal reflections and ensuring clean data transmission at very high frequencies.
Robust Hermetic Protection: The brazed metal-ceramic construction provides a permanent, gas-tight seal, safeguarding sensitive components from environmental degradation.
Effective Thermal Dissipation: The metal package body provides an efficient pathway for heat to be conducted away from the laser chip to an external heat sink.
Mechanical Stability: Offers rigid and stable support for optical components and fiber pigtails, critical for maintaining optical alignment over the product's lifetime.
Broad Portfolio: Our extensive range of standard ceramic packages, from compact TOSA housings to high-pin-count butterfly packages, covers nearly every application.

Application Scenarios

These housings are the building blocks for the internet's infrastructure and other advanced optical systems:

TOSA/ROSA Modules: For transceivers used in data centers and telecommunication networks (e.g., QSFP28, CFP2).
Pump Laser Modules: For Erbium-Doped Fiber Amplifiers (EDFAs) in long-haul optical networks.
Optical Switches: For reconfigurable optical add-drop multiplexers (ROADMs).
High-Power Lasers: For industrial and medical applications requiring reliable fiber-coupled lasers.

Customer Benefits

Guaranteed Performance: Build your modules with confidence using packages that are pre-validated for high-speed performance and reliability.
Reduced Development Risk: Leverage our deep expertise in RF simulation and structural design to get your product to market faster.
Scalable Manufacturing: Our vertically integrated manufacturing process ensures consistent quality from prototype to high-volume production.
One-Stop Solution: We provide not only the housing but also matching lids and can support custom substrate design, offering a complete packaging solution.

FAQ (Frequently Asked Questions)

Q1: What is the difference between a TOSA and a ROSA package?

A1: TOSA (Transmitter Optical Sub-Assembly) packages are designed to house laser diodes and modulators, which transmit optical signals. ROSA (Receiver Optical Sub-Assembly) packages house photodetectors, which receive optical signals. While structurally similar, their internal layouts and electrical feedthroughs are optimized for their specific functions.

Q2: What does "hermeticity compliant with MIL-STD-883" mean for my product?

A2: It means the package has passed rigorous leak tests defined by a US military standard for microelectronics. This guarantees an extremely low leak rate, ensuring that the internal atmosphere of the package remains free of moisture and contaminants for many years, which is the single most important factor for the long-term reliability of an optical semiconductor device.

Q3: Do you offer simulation services to help optimize a package for my chip?

A3: Yes. We have advanced capabilities in RF, thermal, and structural stress simulation. We can work with you as a design partner to optimize a standard package or create a fully custom solution that maximizes the performance of your specific chip.