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We specialize in providing fully customized Tungsten-Copper (WCu) components tailored to your exact specifications. As a leading-edge Heat Sink Material, our WCu offers an unparalleled combination of thermal conductivity and mechanical stability. Whether you need a specific thermal expansion coefficient or a complex machined part, our engineering team can deliver a solution that optimizes your Electronics Packaging design.
While we offer standard grades, our primary strength is customization. The following properties can be precisely tuned:
We can precisely adjust the W/Cu ratio to match the CTE of various semiconductor materials (e.g., GaAs, SiC, AlN, Al₂O₃), minimizing thermal stress and dramatically improving device reliability.
Leveraging our advanced CNC machining capabilities, we can produce highly complex shapes with tight tolerances (e.g., planarity to 0.005mm), perfect for intricate Optoelectronic Packaging assemblies.
Our in-house plating facility provides reliable and consistent surface finishes, including Nickel (Ni), Nickel-Gold (Ni/Au), and selective plating, ensuring excellent solderability for mounting components onto Ceramic Packages.
All custom products are manufactured under our rigorous ISO 9001:2015 certified quality management system, ensuring full traceability and adherence to your specifications.
Our customization capabilities are extensive:
Our process begins with a detailed consultation to understand your needs. We then utilize our advanced powder metallurgy and infiltration techniques to create the base material, followed by precision machining and plating. Each custom part undergoes 100% dimensional and visual inspection.
"Their ability to deliver a WCu heat sink with a custom CTE and complex geometry was a critical success factor for our project. The quality and precision were outstanding." - R&D Manager, Defense Contractor
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Main Product:
Tungsten Heavy Alloys,
Heat Sink,
Electronic Packaging,
Rhenium Alloys,
Tantalum Alloys,
Nickel Based Braze Alloy
