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The CSOP-48 is a high-pin-count, 48-lead Ceramic Small Outline Package designed for complex integrated circuits that require both a compact surface-mount footprint and high reliability. This package provides a hermetically sealed environment, superior thermal performance, and robust mechanical construction, making it an ideal choice for advanced ICs in demanding sectors such as telecommunications, industrial automation, and aerospace. It is a significant reliability upgrade over comparable plastic packages like SSOP or TSSOP.
| Parameter | Specification (Model: CSOP48E) |
|---|---|
| Lead Count | 48 |
| Lead Pitch | 0.5 mm |
| Body Material | Multilayer Alumina (Al₂O₃) Ceramic |
| Lead Material / Finish | Kovar / Gold (Au) over Nickel (Ni) |
| Die Cavity Dimensions (A x B) | 5.50 mm x 5.20 mm |
| Overall Dimensions (C x D) | 12.56 mm x 7.82 mm |
| Sealing Method | Au-Sn Solder Seal (Hermetic) |
| Compliance | Designed to meet MIL-STD-883 reliability standards |
The CSOP-48 is ideal for a wide range of complex ICs:
Q1: What is the benefit of a CSOP-48 over a CQFP-48 (Ceramic Quad Flat Pack)?
A1: The main difference is the lead configuration. A CSOP has leads on two sides, while a CQFP has leads on all four sides. For a 48-pin device, a CQFP will have a more square, compact body, while a CSOP will be longer and narrower. The choice often depends on the specific PCB layout and routing requirements.
Q2: What is Au-Sn solder sealing?
A2: Au-Sn (Gold-Tin) solder sealing is a high-reliability hermetic sealing process. A lid with a pre-applied Au-Sn solder preform is placed on the package's seal ring and heated in a controlled atmosphere furnace. The solder melts and creates a strong, reliable, hermetic seal.
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