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This standard-sized Molybdenum-Copper (MoCu) plate offers a versatile and high-performance solution for thermal management. As a premium Heat Sink Material, it provides an excellent balance of thermal conductivity and a low, controllable coefficient of thermal expansion (CTE). This plate is ideal for prototyping, small production runs, or as a base material for machining custom components for advanced Electronics Packaging.
| Property | Value |
|---|---|
| Dimensions | 1.0mm (T) x 100mm (W) x 100mm (L) |
| Available Grades | Mo50Cu50 to Mo90Cu10 |
| Thermal Conductivity | 150 - 270 W/m·K (Grade Dependent) |
| CTE | 5.6 - 11.5 x 10⁻⁶/K (Grade Dependent) |
| Dimensional Tolerance | Standard industry tolerances |
Manufactured using our advanced powder metallurgy process, this plate features a homogeneous, low-porosity microstructure, ensuring consistent and reliable thermal performance across its entire surface.
Available in various grades, allowing you to select a plate with a CTE that closely matches your semiconductor or ceramic substrate, minimizing thermal stress and enhancing the reliability of your assembly.
MoCu is readily machinable, allowing this plate to be easily cut, drilled, or milled to create custom heat sinks, carriers, or other components for Ceramic Packages.
All our materials are produced in our ISO 9001:2015 certified facility, ensuring full quality control and material traceability.
While this is a standard size, we can supply MoCu plates in any custom dimensions you require. We also offer in-house machining and plating services to deliver a fully finished component.
Our MoCu plates are produced through a process of powder blending, pressing, sintering, and infiltration. The resulting blocks are then precisely cut and ground to the final plate dimensions. Each plate is inspected for dimensional accuracy and surface quality.
"Having these 100x100mm MoCu plates in stock is incredibly useful for our R&D team. The material quality is always top-notch, and it allows us to machine and test new designs very quickly." - Lab Manager, Semiconductor Company
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