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This thin Molybdenum-Copper (MoCu) alloy sheet is made possible by the excellent rollability of our MoCu composite material. At just 0.25mm thick, it is an ideal Heat Sink Material for applications requiring a lightweight, low-profile thermal spreader. It combines good planar thermal conductivity with a low CTE, making it a superior alternative to copper foils in applications where thermal stress is a concern in Electronics Packaging.
| Property | Value |
|---|---|
| Dimensions | 0.25mm (T) x 200mm (W) x 300mm (L) |
| Available Grades | Mo50Cu50 to Mo70Cu30 (Optimized for rollability) |
| Thermal Conductivity | 180 - 270 W/m·K (Grade Dependent) |
| CTE | 8.1 - 11.5 x 10⁻⁶/K (Grade Dependent) |
| Thickness Tolerance | Precision tolerances available |
The 0.25mm thickness allows for heat spreading in extremely space-constrained environments, such as portable electronics and compact power modules.
While copper foil has high conductivity, its high CTE can cause stress and warping when bonded to low-expansion materials like silicon or ceramics. This MoCu sheet provides a low-CTE alternative, ensuring mechanical stability.
Due to its good ductility, this thin sheet can be stamped or formed into shims, lids, or other custom shapes, offering great design flexibility for Optoelectronic Packaging.
All our materials are produced in our ISO 9001:2015 certified facility, ensuring the highest standards of quality and consistency.
We can provide thin MoCu sheets in custom widths, lengths, and thicknesses. We also offer stamping and plating services to deliver a finished part to your specifications.
Our process involves synthesizing the MoCu material, followed by a specialized multi-stage rolling and annealing process to achieve the final thin gauge while maintaining material integrity. Every coil or sheet is inspected for thickness uniformity and surface quality.
"This thin MoCu sheet was the perfect solution for our compact power module. It spreads the heat effectively without adding bulk, and its low CTE prevented the substrate from warping. A fantastic product." - Senior Engineer, Power Electronics Firm
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Main Product:
Tungsten Heavy Alloys ,
Heat Sink,
Electronic Packaging,
Rhenium Alloys,
Tantalum Alloys,
Nickel Based Braze Alloy
