 
        
         
                            Our Surface Mount Device (SMD) power packages are compact, high-performance solutions designed for modern Wireless RF Packaging. These packages provide excellent thermal dissipation and electrical performance for power transistors in a leadless, surface-mountable form factor. By eliminating traditional leads and utilizing a multi-layer ceramic construction with an integrated metal heat sink, these ceramic packages offer a low-profile design with very low parasitic inductance, making them ideal for high-frequency applications. They are engineered for automated pick-and-place assembly, enabling high-volume, cost-effective manufacturing of RF power amplifiers.
| Parameter | Specification | 
|---|---|
| Package Series | SMD-0.5, SMD-1.0, and custom sizes | 
| Heat Sink Material | Tungsten Copper (WCu), Molybdenum Copper (MoCu), CMC, CPC | 
| Ceramic Material | High-purity Alumina ($Al_2O_3$) | 
| Electrode Material | Oxygen-Free Copper (TU1) | 
| Plating | Nickel (Ni) and Gold (Au) for solderability and wire bonding | 
| Assembly Method | Surface Mount Technology (SMT) | 
| Compliance Standard | GJB923A-2004 (General specification for packages of semiconductor discrete devices) | 

These SMD packages are the preferred choice for a wide range of modern wireless applications:
Q1: What is the main advantage of an SMD package over a traditional flanged package?
A1: The main advantages are size and high-frequency performance. SMD packages are significantly smaller and lighter, and the absence of long leads results in much lower inductance, which is critical for achieving good performance at higher RF frequencies. They are also better suited for high-volume automated assembly.
Q2: How is heat transferred from the SMD package to the system?
A2: The metal heat sink on the bottom of the SMD package is soldered directly to a thermal pad on the printed circuit board (PCB). The PCB then spreads the heat and often transfers it to a larger system-level heat sink or chassis.
Q3: Are these packages available on tape and reel for automated assembly?
A3: Yes, we can provide our SMD electronic packages in tape and reel format to meet the requirements of your high-speed pick-and-place assembly lines. Please specify this requirement when ordering.
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