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The CLCC-20 is a 20-terminal Ceramic Leadless Chip Carrier, a high-performance surface-mount package engineered for maximum density and excellent high-frequency performance. By eliminating leads and using metallized terminals on the package body, the CLCC offers the shortest possible signal path from the IC to the PCB, minimizing parasitic inductance. Its monolithic ceramic construction provides superior thermal dissipation and the capability for a true hermetic seal, making it an outstanding choice for demanding applications in aerospace, defense, and telecommunications where performance and reliability are paramount.
| Parameter | Specification (Model: LCC20) |
|---|---|
| Terminal Count | 20 |
| Terminal Pitch | 1.27 mm |
| Body Material | Multilayer Alumina (Al₂O₃) Ceramic |
| Terminal Plating | Nickel (Ni) / Gold (Au) for excellent solderability and wire bonding |
| Body Dimensions | SQ 9.0 mm |
| Die Cavity Dimensions | SQ 4.6 mm |
| Sealing Method | Seam Weld (Hermetic) |
| Compliance | Designed to meet MIL-STD-883 reliability standards |
The CLCC-20 is a versatile solution for a range of high-performance electronics:
Q1: What is the main challenge when soldering CLCC packages?
A1: The primary challenge is managing the thermo-mechanical stress caused by the mismatch in the Coefficient of Thermal Expansion (CTE) between the ceramic package and the PCB. For reliable, long-term solder joints, it is crucial to use a PCB material with a compatible CTE or employ other stress-mitigation techniques in your assembly.
Q2: Can CLCCs have a thermal pad on the bottom?
A2: Yes. Many CLCC designs can incorporate a large, metallized ground/thermal pad on the bottom of the package. This pad can be soldered directly to the PCB to create an excellent, low-resistance thermal path for high-power devices.
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