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Our flanged power packages are industry-standard solutions for housing high-power RF transistors used in demanding applications like wireless base stations and radar systems. This style of Wireless RF Packaging features a robust metal flange for secure mounting to a heat sink, a high-conductivity base for thermal management, and isolated leads passing through a ceramic frame. This construction provides excellent heat dissipation, mechanical stability, and reliable electrical connections for high-power LDMOS and GaN transistors. It is a proven, cost-effective, and high-performance solution for RF power amplifier designers.
| Parameter | Specification (Example: QF193 / 780-2 Style) |
|---|---|
| Outer Dimensions | 20.57 x 9.78 x 1.67 mm |
| Cavity Dimensions | 16.51 x 6.10 x 0.50 mm |
| Lead Count | 2 (plus source flange) |
| Base Material | Options include Copper (TU1), WCu, MoCu |
| Ceramic Frame | High-purity Alumina ($Al_2O_3$) |
| Leads | Kovar (4J34) |
| Power Handling | Up to 500W (pulsed) depending on design and semiconductor |
| Frequency Range | Suitable for applications up to S-Band (~3 GHz) |
These flanged packages are ubiquitous in the RF power industry and are used in:
Q1: What is the purpose of the ceramic frame in the package?
A1: The ceramic frame (typically Alumina) is an excellent electrical insulator. It allows the metal leads (Gate and Drain) to pass into the package and connect to the transistor die while remaining electrically isolated from the metal flange, which is typically connected to the Source of the transistor and ground.
Q2: Are these packages hermetically sealed?
A2: These types of RF power packages are typically non-hermetic. They are sealed with an epoxy or ceramic lid that provides mechanical and environmental protection but is not airtight. This is a standard and highly reliable approach for most wireless infrastructure applications.
Q3: Can you produce a custom footprint or lead configuration?
A3: Yes. While we offer a vast portfolio of standard packages, we have full custom design and manufacturing capabilities. We can work with you to develop a unique package tailored to your specific needs.
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