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The Ceramic Small Outline Package (CSOP) combines the space-saving benefits of surface-mount technology with the unparalleled reliability of a hermetic ceramic enclosure. Our CSOP-28 is a 28-lead package designed for high-performance analog, mixed-signal, and digital ICs that require robust environmental protection and excellent thermal stability. Featuring compliant gull-wing leads for durable solder joints and a multi-layer alumina body, this package is the premier choice for demanding applications in the automotive, industrial, and telecommunications sectors. It provides a significant upgrade in reliability and performance over standard plastic SOIC packages.
Our CSOP-28 packages are engineered for precision and reliability.
| Parameter | Specification (Model: CSOP28C) |
|---|---|
| Lead Count | 28 |
| Lead Pitch | 0.635 mm |
| Body Material | Multilayer Alumina (Al₂O₃) Ceramic |
| Lead Material / Finish | Kovar / Gold (Au) over Nickel (Ni) |
| Die Cavity Dimensions (A x B) | 10.39 mm x 6.39 mm |
| Overall Dimensions (C x D) | 12.56 mm x 8.68 mm |
| Package Thickness | 1.4 mm |
| Sealing Method | Au-Sn Solder Seal |
| Hermeticity | Meets MIL-STD-883 requirements |
The small outline and fine pitch allow for high-density PCB layouts, enabling more functionality in a smaller product footprint compared to through-hole packages like DIPs.
The ability to achieve a true hermetic seal makes the CSOP ideal for applications operating in harsh environments with temperature extremes, humidity, or exposure to chemicals, a key requirement in Automotive Electronics Packaging.
The compliant "gull-wing" leads are designed to absorb thermo-mechanical stress between the ceramic package and the PCB, preventing solder joint fatigue and ensuring long-term reliability through thousands of temperature cycles.
The alumina ceramic body efficiently conducts heat away from the integrated circuit to the PCB, ensuring stable performance for thermally sensitive components like precision amplifiers and voltage references.
The CSOP is a versatile package for a wide range of high-performance ICs:
Our CSOPs are manufactured using a mature multi-layer ceramic process (HTCC). Each lot undergoes rigorous quality control, including dimensional verification, plating thickness measurement, and hermeticity testing, to ensure every package meets our exacting standards.
Q1: What is the main advantage of a CSOP over a standard plastic SOIC package?
A1: The primary advantage is reliability. A CSOP can be hermetically sealed, making it impervious to moisture, which is a major failure mechanism for plastic packages. Additionally, the ceramic body offers superior thermal performance. This makes CSOP the choice for any application where long-term reliability is critical.
Q2: What are the best practices for soldering CSOP packages?
A2: CSOPs should be assembled using standard SMT reflow soldering processes. It is important to use a controlled reflow profile as recommended by the solder paste manufacturer to ensure high-quality solder joints without subjecting the package to excessive thermal stress. Visual or automated optical inspection (AOI) should be used to verify solder joint quality post-reflow.
Q3: Are other pin counts and body sizes available?
A3: Yes. We offer a wide family of ceramic packages in the SOP style, with pin counts ranging from 4 to 56 and various body widths and lead pitches. We can also develop custom footprints to meet your specific requirements.
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