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Our Copper-Molybdenum-Copper (CMC) composites are engineered multi-layer materials designed to provide an optimal balance of thermal conductivity and controlled thermal expansion. Consisting of a molybdenum core clad with oxygen-free copper, CMC is an ideal Heat Sink Material for robust Electronics Packaging. Uniquely, our CMC material possesses superior formability, allowing it to be stamped into complex shapes—a capability not found in competing products.
| Grade (Cu:Mo:Cu Thickness Ratio) | Density (g/cm³) | CTE (10⁻⁶/K) | Thermal Conductivity X-Y (W/m·K) | Thermal Conductivity Z (W/m·K) |
|---|---|---|---|---|
| 13:74:13 | 9.88 | 5.6 | 200 | 170 |
| 1:4:1 | 9.75 | 6.0 | 220 | 180 |
| 1:3:1 | 9.66 | 6.8 | 244 | 190 |
| 1:2:1 | 9.54 | 7.8 | 260 | 210 |
| 1:1:1 | 9.30 | 8.8 | 305 | 250 |
| S-CMC (5:1:5:1:5) | 9.20 | 6.1 (20-800°C) | 350 | 295 |
Unlike standard CMC materials, our product can be stamped to create complex 3D features like bosses and cavities. This revolutionary feature enables integrated, single-piece designs, reducing assembly complexity and cost for advanced Optoelectronic Packaging.
Our proprietary rolling and bonding process creates an exceptionally strong interface that can withstand repeated thermal shocks up to 1000°C without delamination, ensuring maximum reliability in harsh operating environments.
The oxygen-free copper surface provides a naturally hermetic seal and is ideal for standard plating processes (e.g., Ni/Au), ensuring reliable soldering and wire bonding.
All our products are manufactured under a strict quality management system certified to ISO 9001:2015, guaranteeing quality, consistency, and traceability.
We offer extensive customization to meet your exact requirements:
Our production process involves multi-layer roll bonding under immense pressure and controlled temperatures to ensure a perfect metallurgical bond. Every batch undergoes rigorous quality checks, including thermal shock testing and metallographic analysis, to verify interfacial integrity and material properties.
"The stampable CMC from this company revolutionized our package design. We were able to replace a multi-part machined assembly with a single, cost-effective stamped component without sacrificing thermal performance. A true game-changer." - Senior Packaging Engineer, RF Communications Company
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Main Product:
Tungsten Heavy Alloys,
Heat Sink,
Electronic Packaging,
Rhenium Alloys,
Tantalum Alloys,
Nickel Based Braze Alloy
