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The 40-Pin Ceramic Dual In-Line Package (CDIP) is the flagship through-hole solution for housing complex, large-scale integrated circuits (VLSI) such as early microprocessors, complex peripherals, and large memory arrays. Its robust, multi-layer ceramic construction and hermetic sealing capability provide the highest level of protection and thermal stability. The CDIP-40 is the definitive choice for industrial, military, and aerospace systems that require extreme reliability and potential for field serviceability. It remains a critical component for both new designs in harsh environments and for long-term support of legacy systems.
| Parameter | Specification (Model: DIP40A) |
|---|---|
| Lead Count | 40 |
| Lead Pitch | 2.54 mm |
| Row Spacing | 15.24 mm (0.600 inch "Wide" format) |
| Body Material | Multilayer Alumina (Al₂O₃) Ceramic |
| Lead Frame Material | Kovar (Fe-Ni-Co Alloy) |
| Die Cavity Dimensions | Approx. 18.0 mm x 13.0 mm (customizable) |
| Sealing Method | Au-Sn Solder Seal (Hermetic) |
| Compliance | Designed to meet MIL-STD-883 reliability standards |
The CDIP-40 is essential for a range of high-value integrated circuits:
Q1: Can this package be supplied with a window for UV EPROMs?
A1: Yes, the CDIP-40 is famously available with a quartz window integrated into the lid. This allows the die of a UV-erasable EPROM to be exposed to ultraviolet light for reprogramming. Please specify this requirement when ordering.
Q2: What is the purpose of the notch on one end of the package?
A2: The notch is a standard feature on DIP packages that serves as the primary indicator for Pin 1. Pin 1 is located to the left of the notch when viewing the package from the top. This ensures the IC is correctly oriented during insertion into a socket or PCB.
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